(kicad_pcb (version 4) (host pcbnew "(2015-08-18 BZR 6102)-product")
  (general
    (links 1221)
    (no_connects 0)
    (area 57.669958 17.0375 275.101601 176.1916)
    (thickness 1.6002)
    (drawings 177)
    (tracks 4428)
    (zones 0)
    (modules 432)
    (nets 379)
  )
  (page A4)
  (title_block
    (date "19 may 2014")
  )
  (layers
    (0 C1F signal)
    (1 C2 signal)
    (2 C3 signal)
    (31 C4B signal)
    (32 B.Adhes user)
    (33 F.Adhes user)
    (34 B.Paste user)
    (35 F.Paste user)
    (36 B.SilkS user)
    (37 F.SilkS user)
    (38 B.Mask user)
    (39 F.Mask user)
    (41 Cmts.User user)
    (44 Edge.Cuts user)
  )
  (setup
    (last_trace_width 0.2794)
    (user_trace_width 0.1524)
    (user_trace_width 0.2032)
    (user_trace_width 0.254)
    (user_trace_width 0.3048)
    (user_trace_width 0.4064)
    (user_trace_width 0.4572)
    (user_trace_width 0.508)
    (user_trace_width 1.016)
    (user_trace_width 1.27)
    (trace_clearance 0.1524)
    (zone_clearance 0.254)
    (zone_45_only no)
    (trace_min 0.1524)
    (segment_width 0.2032)
    (edge_width 0.381)
    (via_size 0.6858)
    (via_drill 0.3302)
    (via_min_size 0.6858)
    (via_min_drill 0.3302)
    (user_via 0.7874 0.4064)
    (user_via 0.9398 0.508)
    (user_via 1.0668 0.635)
    (uvia_size 0.508)
    (uvia_drill 0.127)
    (uvias_allowed no)
    (uvia_min_size 0.254)
    (uvia_min_drill 0.127)
    (pcb_text_width 0.1905)
    (pcb_text_size 0.762 1.016)
    (mod_edge_width 0.2032)
    (mod_text_size 1.524 1.524)
    (mod_text_width 0.3048)
    (pad_size 0.8 0.24)
    (pad_drill 0)
    (pad_to_mask_clearance 0.0762)
    (pad_to_paste_clearance_ratio -0.12)
    (aux_axis_origin 0 0)
    (visible_elements FFFFFFBF)
    (pcbplotparams
      (layerselection 0x010e8_80000007)
      (usegerberextensions true)
      (excludeedgelayer true)
      (linewidth 0.150000)
      (plotframeref false)
      (viasonmask false)
      (mode 1)
      (useauxorigin false)
      (hpglpennumber 1)
      (hpglpenspeed 20)
      (hpglpendiameter 15)
      (hpglpenoverlay 0)
      (psnegative false)
      (psa4output false)
      (plotreference false)
      (plotvalue false)
      (plotinvisibletext false)
      (padsonsilk false)
      (subtractmaskfromsilk false)
      (outputformat 1)
      (mirror false)
      (drillshape 0)
      (scaleselection 1)
      (outputdirectory gerbers))
  )
  (net 0 "")
  (net 1 !MIX_BYPASS)
  (net 2 !RX_AMP_PWR)
  (net 3 !TX_AMP_PWR)
  (net 4 !VAA_ENABLE)
  (net 5 +1.8V)
  (net 6 /baseband/CLK0)
  (net 7 /baseband/CLK1)
  (net 8 /baseband/CLK2)
  (net 9 /baseband/CLK3)
  (net 10 /baseband/CLK5)
  (net 11 /baseband/COM)
  (net 12 /baseband/CPOUT+)
  (net 13 /baseband/CPOUT-)
  (net 14 /baseband/IA+)
  (net 15 /baseband/IA-)
  (net 16 /baseband/ID+)
  (net 17 /baseband/ID-)
  (net 18 /baseband/INTR)
  (net 19 /baseband/OEB)
  (net 20 /baseband/QA+)
  (net 21 /baseband/QA-)
  (net 22 /baseband/QD+)
  (net 23 /baseband/QD-)
  (net 24 /baseband/REFN)
  (net 25 /baseband/REFP)
  (net 26 /baseband/RXBBI+)
  (net 27 /baseband/RXBBI-)
  (net 28 /baseband/RXBBQ+)
  (net 29 /baseband/RXBBQ-)
  (net 30 /baseband/TXBBI+)
  (net 31 /baseband/TXBBI-)
  (net 32 /baseband/TXBBQ+)
  (net 33 /baseband/TXBBQ-)
  (net 34 /baseband/XA)
  (net 35 /baseband/XB)
  (net 36 /baseband/XCVR_CLKOUT)
  (net 37 /baseband/XTAL2)
  (net 38 /frontend/!ANT_BIAS)
  (net 39 /frontend/REF_IN)
  (net 40 /frontend/RX_AMP_OUT)
  (net 41 /frontend/TX_AMP_IN)
  (net 42 /frontend/TX_AMP_OUT)
  (net 43 /mcu/usb/power/ADC0_0)
  (net 44 /mcu/usb/power/ADC0_2)
  (net 45 /mcu/usb/power/ADC0_5)
  (net 46 /mcu/usb/power/ADC0_6)
  (net 47 /mcu/usb/power/B1AUX13)
  (net 48 /mcu/usb/power/B1AUX14)
  (net 49 /mcu/usb/power/B2AUX1)
  (net 50 /mcu/usb/power/B2AUX10)
  (net 51 /mcu/usb/power/B2AUX11)
  (net 52 /mcu/usb/power/B2AUX12)
  (net 53 /mcu/usb/power/B2AUX13)
  (net 54 /mcu/usb/power/B2AUX14)
  (net 55 /mcu/usb/power/B2AUX15)
  (net 56 /mcu/usb/power/B2AUX16)
  (net 57 /mcu/usb/power/B2AUX2)
  (net 58 /mcu/usb/power/B2AUX3)
  (net 59 /mcu/usb/power/B2AUX4)
  (net 60 /mcu/usb/power/B2AUX5)
  (net 61 /mcu/usb/power/B2AUX6)
  (net 62 /mcu/usb/power/B2AUX7)
  (net 63 /mcu/usb/power/B2AUX8)
  (net 64 /mcu/usb/power/B2AUX9)
  (net 65 /mcu/usb/power/BANK2F3M1)
  (net 66 /mcu/usb/power/BANK2F3M10)
  (net 67 /mcu/usb/power/BANK2F3M11)
  (net 68 /mcu/usb/power/BANK2F3M12)
  (net 69 /mcu/usb/power/BANK2F3M14)
  (net 70 /mcu/usb/power/BANK2F3M15)
  (net 71 /mcu/usb/power/BANK2F3M16)
  (net 72 /mcu/usb/power/BANK2F3M2)
  (net 73 /mcu/usb/power/BANK2F3M3)
  (net 74 /mcu/usb/power/BANK2F3M4)
  (net 75 /mcu/usb/power/BANK2F3M5)
  (net 76 /mcu/usb/power/BANK2F3M6)
  (net 77 /mcu/usb/power/BANK2F3M7)
  (net 78 /mcu/usb/power/BANK2F3M8)
  (net 79 /mcu/usb/power/BANK2F3M9)
  (net 80 /mcu/usb/power/CPLD_TCK)
  (net 81 /mcu/usb/power/CPLD_TDI)
  (net 82 /mcu/usb/power/CPLD_TDO)
  (net 83 /mcu/usb/power/CPLD_TMS)
  (net 84 /mcu/usb/power/DBGEN)
  (net 85 /mcu/usb/power/DM)
  (net 86 /mcu/usb/power/DP)
  (net 87 /mcu/usb/power/EN1V8)
  (net 88 /mcu/usb/power/GCK0)
  (net 89 /mcu/usb/power/GPIO3_10)
  (net 90 /mcu/usb/power/GPIO3_11)
  (net 91 /mcu/usb/power/GPIO3_12)
  (net 92 /mcu/usb/power/GPIO3_13)
  (net 93 /mcu/usb/power/GPIO3_14)
  (net 94 /mcu/usb/power/GPIO3_15)
  (net 95 /mcu/usb/power/GPIO3_8)
  (net 96 /mcu/usb/power/GPIO3_9)
  (net 97 /mcu/usb/power/GP_CLKIN)
  (net 98 /mcu/usb/power/I2C1_SCL)
  (net 99 /mcu/usb/power/I2C1_SDA)
  (net 100 /mcu/usb/power/I2S0_RX_MCLK)
  (net 101 /mcu/usb/power/I2S0_RX_SCK)
  (net 102 /mcu/usb/power/I2S0_RX_SDA)
  (net 103 /mcu/usb/power/I2S0_RX_WS)
  (net 104 /mcu/usb/power/I2S0_TX_MCLK)
  (net 105 /mcu/usb/power/I2S0_TX_SCK)
  (net 106 /mcu/usb/power/ISP)
  (net 107 /mcu/usb/power/LED1)
  (net 108 /mcu/usb/power/LED2)
  (net 109 /mcu/usb/power/LED3)
  (net 110 /mcu/usb/power/P1_1)
  (net 111 /mcu/usb/power/P1_2)
  (net 112 /mcu/usb/power/P2_13)
  (net 113 /mcu/usb/power/P2_8)
  (net 114 /mcu/usb/power/P2_9)
  (net 115 /mcu/usb/power/REG_OUT1)
  (net 116 /mcu/usb/power/REG_OUT2)
  (net 117 /mcu/usb/power/RESET)
  (net 118 /mcu/usb/power/RREF)
  (net 119 /mcu/usb/power/RTCX1)
  (net 120 /mcu/usb/power/RTCX2)
  (net 121 /mcu/usb/power/RTC_ALARM)
  (net 122 /mcu/usb/power/SD_CD)
  (net 123 /mcu/usb/power/SD_CLK)
  (net 124 /mcu/usb/power/SD_CMD)
  (net 125 /mcu/usb/power/SD_DAT0)
  (net 126 /mcu/usb/power/SD_DAT1)
  (net 127 /mcu/usb/power/SD_DAT2)
  (net 128 /mcu/usb/power/SD_DAT3)
  (net 129 /mcu/usb/power/SD_POW)
  (net 130 /mcu/usb/power/SD_VOLT0)
  (net 131 /mcu/usb/power/SGPIO0)
  (net 132 /mcu/usb/power/SGPIO1)
  (net 133 /mcu/usb/power/SGPIO10)
  (net 134 /mcu/usb/power/SGPIO11)
  (net 135 /mcu/usb/power/SGPIO12)
  (net 136 /mcu/usb/power/SGPIO13)
  (net 137 /mcu/usb/power/SGPIO14)
  (net 138 /mcu/usb/power/SGPIO15)
  (net 139 /mcu/usb/power/SGPIO2)
  (net 140 /mcu/usb/power/SGPIO3)
  (net 141 /mcu/usb/power/SGPIO4)
  (net 142 /mcu/usb/power/SGPIO5)
  (net 143 /mcu/usb/power/SGPIO6)
  (net 144 /mcu/usb/power/SGPIO7)
  (net 145 /mcu/usb/power/SGPIO9)
  (net 146 /mcu/usb/power/SPIFI_CS)
  (net 147 /mcu/usb/power/SPIFI_MISO)
  (net 148 /mcu/usb/power/SPIFI_MOSI)
  (net 149 /mcu/usb/power/SPIFI_SCK)
  (net 150 /mcu/usb/power/SPIFI_SIO2)
  (net 151 /mcu/usb/power/SPIFI_SIO3)
  (net 152 /mcu/usb/power/TCK)
  (net 153 /mcu/usb/power/TDI)
  (net 154 /mcu/usb/power/TDO)
  (net 155 /mcu/usb/power/TMS)
  (net 156 /mcu/usb/power/U0_RXD)
  (net 157 /mcu/usb/power/U0_TXD)
  (net 158 /mcu/usb/power/USB_SHIELD)
  (net 159 /mcu/usb/power/VBAT)
  (net 160 /mcu/usb/power/VBUS)
  (net 161 /mcu/usb/power/VBUSCTRL)
  (net 162 /mcu/usb/power/VIN)
  (net 163 /mcu/usb/power/VREGMODE)
  (net 164 /mcu/usb/power/WAKEUP)
  (net 165 /mcu/usb/power/XTAL1)
  (net 166 /mcu/usb/power/XTAL2)
  (net 167 AMP_BYPASS)
  (net 168 CLK6)
  (net 169 CLKIN)
  (net 170 CLKOUT)
  (net 171 CS_AD)
  (net 172 CS_XCVR)
  (net 173 DA0)
  (net 174 DA1)
  (net 175 DA2)
  (net 176 DA3)
  (net 177 DA4)
  (net 178 DA5)
  (net 179 DA6)
  (net 180 DA7)
  (net 181 DD0)
  (net 182 DD1)
  (net 183 DD2)
  (net 184 DD3)
  (net 185 DD4)
  (net 186 DD5)
  (net 187 DD6)
  (net 188 DD7)
  (net 189 DD8)
  (net 190 DD9)
  (net 191 GCK1)
  (net 192 GCK2)
  (net 193 GND)
  (net 194 HP)
  (net 195 LP)
  (net 196 MCU_CLK)
  (net 197 MIXER_ENX)
  (net 198 MIXER_RESETX)
  (net 199 MIXER_SCLK)
  (net 200 MIXER_SDATA)
  (net 201 MIX_BYPASS)
  (net 202 MIX_CLK)
  (net 203 RSSI)
  (net 204 RX)
  (net 205 RXENABLE)
  (net 206 RX_AMP)
  (net 207 RX_IF)
  (net 208 RX_MIX_BP)
  (net 209 SCL)
  (net 210 SDA)
  (net 211 SGPIO_CLK)
  (net 212 SSP1_MISO)
  (net 213 SSP1_MOSI)
  (net 214 SSP1_SCK)
  (net 215 TX)
  (net 216 TXENABLE)
  (net 217 TX_AMP)
  (net 218 TX_IF)
  (net 219 TX_MIX_BP)
  (net 220 VAA)
  (net 221 VCC)
  (net 222 XCVR_EN)
  (net 223 "Net-(C8-Pad2)")
  (net 224 "Net-(C9-Pad2)")
  (net 225 "Net-(C9-Pad1)")
  (net 226 "Net-(C12-Pad1)")
  (net 227 "Net-(C13-Pad1)")
  (net 228 "Net-(C14-Pad2)")
  (net 229 "Net-(C14-Pad1)")
  (net 230 "Net-(C15-Pad2)")
  (net 231 "Net-(C17-Pad2)")
  (net 232 "Net-(C17-Pad1)")
  (net 233 "Net-(C18-Pad2)")
  (net 234 "Net-(C18-Pad1)")
  (net 235 "Net-(C20-Pad2)")
  (net 236 "Net-(C20-Pad1)")
  (net 237 "Net-(C21-Pad2)")
  (net 238 "Net-(C21-Pad1)")
  (net 239 "Net-(C23-Pad2)")
  (net 240 "Net-(C23-Pad1)")
  (net 241 "Net-(C25-Pad1)")
  (net 242 "Net-(C26-Pad2)")
  (net 243 "Net-(C26-Pad1)")
  (net 244 "Net-(C27-Pad2)")
  (net 245 "Net-(C27-Pad1)")
  (net 246 "Net-(C28-Pad2)")
  (net 247 "Net-(C28-Pad1)")
  (net 248 "Net-(C31-Pad2)")
  (net 249 "Net-(C31-Pad1)")
  (net 250 "Net-(C32-Pad2)")
  (net 251 "Net-(C32-Pad1)")
  (net 252 "Net-(C43-Pad2)")
  (net 253 "Net-(C43-Pad1)")
  (net 254 "Net-(C44-Pad2)")
  (net 255 "Net-(C44-Pad1)")
  (net 256 "Net-(C46-Pad2)")
  (net 257 "Net-(C46-Pad1)")
  (net 258 "Net-(C48-Pad1)")
  (net 259 "Net-(C49-Pad2)")
  (net 260 "Net-(C50-Pad1)")
  (net 261 "Net-(C51-Pad2)")
  (net 262 "Net-(C51-Pad1)")
  (net 263 "Net-(C163-Pad2)")
  (net 264 "Net-(C58-Pad2)")
  (net 265 "Net-(C58-Pad1)")
  (net 266 "Net-(C59-Pad2)")
  (net 267 "Net-(C61-Pad2)")
  (net 268 "Net-(C61-Pad1)")
  (net 269 "Net-(C62-Pad2)")
  (net 270 "Net-(C64-Pad2)")
  (net 271 "Net-(C64-Pad1)")
  (net 272 "Net-(C99-Pad2)")
  (net 273 "Net-(C99-Pad1)")
  (net 274 "Net-(C102-Pad2)")
  (net 275 "Net-(C102-Pad1)")
  (net 276 "Net-(C104-Pad2)")
  (net 277 "Net-(C104-Pad1)")
  (net 278 "Net-(C105-Pad1)")
  (net 279 "Net-(C106-Pad1)")
  (net 280 "Net-(C111-Pad2)")
  (net 281 "Net-(C111-Pad1)")
  (net 282 "Net-(C114-Pad2)")
  (net 283 "Net-(C114-Pad1)")
  (net 284 "Net-(C125-Pad2)")
  (net 285 "Net-(C160-Pad1)")
  (net 286 "Net-(D2-Pad2)")
  (net 287 "Net-(D4-Pad2)")
  (net 288 "Net-(D5-Pad2)")
  (net 289 "Net-(D6-Pad2)")
  (net 290 "Net-(D7-Pad2)")
  (net 291 "Net-(D8-Pad2)")
  (net 292 "Net-(FB1-Pad1)")
  (net 293 "Net-(FB2-Pad1)")
  (net 294 "Net-(FB3-Pad1)")
  (net 295 "Net-(J1-Pad4)")
  (net 296 "Net-(J1-Pad3)")
  (net 297 "Net-(J1-Pad2)")
  (net 298 "Net-(L1-Pad2)")
  (net 299 "Net-(L1-Pad1)")
  (net 300 "Net-(L2-Pad1)")
  (net 301 "Net-(L3-Pad1)")
  (net 302 "Net-(L10-Pad1)")
  (net 303 "Net-(L11-Pad2)")
  (net 304 "Net-(L13-Pad1)")
  (net 305 "Net-(P6-Pad1)")
  (net 306 "Net-(P7-Pad1)")
  (net 307 "Net-(P17-Pad1)")
  (net 308 "Net-(P19-Pad1)")
  (net 309 "Net-(P24-Pad1)")
  (net 310 "Net-(P25-Pad3)")
  (net 311 "Net-(P26-Pad7)")
  (net 312 "Net-(R4-Pad2)")
  (net 313 "Net-(R30-Pad2)")
  (net 314 "Net-(R19-Pad2)")
  (net 315 "Net-(R51-Pad1)")
  (net 316 "Net-(R52-Pad2)")
  (net 317 "Net-(R55-Pad2)")
  (net 318 "Net-(R62-Pad1)")
  (net 319 "Net-(U4-Pad1)")
  (net 320 "Net-(U4-Pad2)")
  (net 321 "Net-(U4-Pad3)")
  (net 322 "Net-(U4-Pad11)")
  (net 323 "Net-(U4-Pad13)")
  (net 324 "Net-(U4-Pad14)")
  (net 325 "Net-(U4-Pad17)")
  (net 326 "Net-(U4-Pad18)")
  (net 327 "Net-(U4-Pad20)")
  (net 328 "Net-(U4-Pad21)")
  (net 329 "Net-(U9-Pad2)")
  (net 330 "Net-(U12-Pad2)")
  (net 331 "Net-(U14-Pad2)")
  (net 332 "Net-(U15-Pad4)")
  (net 333 "Net-(U15-Pad6)")
  (net 334 "Net-(U17-Pad3)")
  (net 335 "Net-(U17-Pad6)")
  (net 336 "Net-(U17-Pad8)")
  (net 337 "Net-(U17-Pad9)")
  (net 338 "Net-(U17-Pad12)")
  (net 339 "Net-(U17-Pad14)")
  (net 340 "Net-(U17-Pad18)")
  (net 341 "Net-(U17-Pad33)")
  (net 342 "Net-(U17-Pad34)")
  (net 343 "Net-(U17-Pad40)")
  (net 344 "Net-(U18-Pad38)")
  (net 345 "Net-(U23-Pad89)")
  (net 346 "Net-(U23-Pad90)")
  (net 347 "Net-(U23-Pad136)")
  (net 348 "Net-(U23-Pad138)")
  (net 349 "Net-(U23-Pad139)")
  (net 350 "Net-(U24-Pad14)")
  (net 351 "Net-(U24-Pad15)")
  (net 352 "Net-(U24-Pad16)")
  (net 353 "Net-(U24-Pad20)")
  (net 354 "Net-(U24-Pad25)")
  (net 355 "Net-(U24-Pad44)")
  (net 356 "Net-(U24-Pad46)")
  (net 357 "Net-(U24-Pad49)")
  (net 358 "Net-(U24-Pad50)")
  (net 359 "Net-(U24-Pad52)")
  (net 360 "Net-(U24-Pad53)")
  (net 361 "Net-(U24-Pad54)")
  (net 362 "Net-(U24-Pad58)")
  (net 363 "Net-(U24-Pad59)")
  (net 364 "Net-(U24-Pad60)")
  (net 365 "Net-(U24-Pad63)")
  (net 366 "Net-(U24-Pad65)")
  (net 367 "Net-(U24-Pad66)")
  (net 368 "Net-(U24-Pad68)")
  (net 369 "Net-(U24-Pad73)")
  (net 370 "Net-(U24-Pad75)")
  (net 371 "Net-(U24-Pad80)")
  (net 372 "Net-(U24-Pad82)")
  (net 373 "Net-(U24-Pad85)")
  (net 374 "Net-(U24-Pad86)")
  (net 375 "Net-(U24-Pad87)")
  (net 376 "Net-(U24-Pad93)")
  (net 377 "Net-(U24-Pad95)")
  (net 378 "Net-(U24-Pad96)")
  (net_class Default "This is the default net class."
    (clearance 0.1524)
    (trace_width 0.2794)
    (via_dia 0.6858)
    (via_drill 0.3302)
    (uvia_dia 0.508)
    (uvia_drill 0.127)
    (add_net !MIX_BYPASS)
    (add_net !RX_AMP_PWR)
    (add_net !TX_AMP_PWR)
    (add_net !VAA_ENABLE)
    (add_net +1.8V)
    (add_net /baseband/CLK0)
    (add_net /baseband/CLK1)
    (add_net /baseband/CLK2)
    (add_net /baseband/CLK3)
    (add_net /baseband/CLK5)
    (add_net /baseband/COM)
    (add_net /baseband/CPOUT+)
    (add_net /baseband/CPOUT-)
    (add_net /baseband/IA+)
    (add_net /baseband/IA-)
    (add_net /baseband/ID+)
    (add_net /baseband/ID-)
    (add_net /baseband/INTR)
    (add_net /baseband/OEB)
    (add_net /baseband/QA+)
    (add_net /baseband/QA-)
    (add_net /baseband/QD+)
    (add_net /baseband/QD-)
    (add_net /baseband/REFN)
    (add_net /baseband/REFP)
    (add_net /baseband/RXBBI+)
    (add_net /baseband/RXBBI-)
    (add_net /baseband/RXBBQ+)
    (add_net /baseband/RXBBQ-)
    (add_net /baseband/TXBBI+)
    (add_net /baseband/TXBBI-)
    (add_net /baseband/TXBBQ+)
    (add_net /baseband/TXBBQ-)
    (add_net /baseband/XA)
    (add_net /baseband/XB)
    (add_net /baseband/XCVR_CLKOUT)
    (add_net /baseband/XTAL2)
    (add_net /frontend/!ANT_BIAS)
    (add_net /frontend/REF_IN)
    (add_net /frontend/RX_AMP_OUT)
    (add_net /frontend/TX_AMP_IN)
    (add_net /frontend/TX_AMP_OUT)
    (add_net /mcu/usb/power/ADC0_0)
    (add_net /mcu/usb/power/ADC0_2)
    (add_net /mcu/usb/power/ADC0_5)
    (add_net /mcu/usb/power/ADC0_6)
    (add_net /mcu/usb/power/B1AUX13)
    (add_net /mcu/usb/power/B1AUX14)
    (add_net /mcu/usb/power/B2AUX1)
    (add_net /mcu/usb/power/B2AUX10)
    (add_net /mcu/usb/power/B2AUX11)
    (add_net /mcu/usb/power/B2AUX12)
    (add_net /mcu/usb/power/B2AUX13)
    (add_net /mcu/usb/power/B2AUX14)
    (add_net /mcu/usb/power/B2AUX15)
    (add_net /mcu/usb/power/B2AUX16)
    (add_net /mcu/usb/power/B2AUX2)
    (add_net /mcu/usb/power/B2AUX3)
    (add_net /mcu/usb/power/B2AUX4)
    (add_net /mcu/usb/power/B2AUX5)
    (add_net /mcu/usb/power/B2AUX6)
    (add_net /mcu/usb/power/B2AUX7)
    (add_net /mcu/usb/power/B2AUX8)
    (add_net /mcu/usb/power/B2AUX9)
    (add_net /mcu/usb/power/BANK2F3M1)
    (add_net /mcu/usb/power/BANK2F3M10)
    (add_net /mcu/usb/power/BANK2F3M11)
    (add_net /mcu/usb/power/BANK2F3M12)
    (add_net /mcu/usb/power/BANK2F3M14)
    (add_net /mcu/usb/power/BANK2F3M15)
    (add_net /mcu/usb/power/BANK2F3M16)
    (add_net /mcu/usb/power/BANK2F3M2)
    (add_net /mcu/usb/power/BANK2F3M3)
    (add_net /mcu/usb/power/BANK2F3M4)
    (add_net /mcu/usb/power/BANK2F3M5)
    (add_net /mcu/usb/power/BANK2F3M6)
    (add_net /mcu/usb/power/BANK2F3M7)
    (add_net /mcu/usb/power/BANK2F3M8)
    (add_net /mcu/usb/power/BANK2F3M9)
    (add_net /mcu/usb/power/CPLD_TCK)
    (add_net /mcu/usb/power/CPLD_TDI)
    (add_net /mcu/usb/power/CPLD_TDO)
    (add_net /mcu/usb/power/CPLD_TMS)
    (add_net /mcu/usb/power/DBGEN)
    (add_net /mcu/usb/power/DM)
    (add_net /mcu/usb/power/DP)
    (add_net /mcu/usb/power/EN1V8)
    (add_net /mcu/usb/power/GCK0)
    (add_net /mcu/usb/power/GPIO3_10)
    (add_net /mcu/usb/power/GPIO3_11)
    (add_net /mcu/usb/power/GPIO3_12)
    (add_net /mcu/usb/power/GPIO3_13)
    (add_net /mcu/usb/power/GPIO3_14)
    (add_net /mcu/usb/power/GPIO3_15)
    (add_net /mcu/usb/power/GPIO3_8)
    (add_net /mcu/usb/power/GPIO3_9)
    (add_net /mcu/usb/power/GP_CLKIN)
    (add_net /mcu/usb/power/I2C1_SCL)
    (add_net /mcu/usb/power/I2C1_SDA)
    (add_net /mcu/usb/power/I2S0_RX_MCLK)
    (add_net /mcu/usb/power/I2S0_RX_SCK)
    (add_net /mcu/usb/power/I2S0_RX_SDA)
    (add_net /mcu/usb/power/I2S0_RX_WS)
    (add_net /mcu/usb/power/I2S0_TX_MCLK)
    (add_net /mcu/usb/power/I2S0_TX_SCK)
    (add_net /mcu/usb/power/ISP)
    (add_net /mcu/usb/power/LED1)
    (add_net /mcu/usb/power/LED2)
    (add_net /mcu/usb/power/LED3)
    (add_net /mcu/usb/power/P1_1)
    (add_net /mcu/usb/power/P1_2)
    (add_net /mcu/usb/power/P2_13)
    (add_net /mcu/usb/power/P2_8)
    (add_net /mcu/usb/power/P2_9)
    (add_net /mcu/usb/power/REG_OUT1)
    (add_net /mcu/usb/power/REG_OUT2)
    (add_net /mcu/usb/power/RESET)
    (add_net /mcu/usb/power/RREF)
    (add_net /mcu/usb/power/RTCX1)
    (add_net /mcu/usb/power/RTCX2)
    (add_net /mcu/usb/power/RTC_ALARM)
    (add_net /mcu/usb/power/SD_CD)
    (add_net /mcu/usb/power/SD_CLK)
    (add_net /mcu/usb/power/SD_CMD)
    (add_net /mcu/usb/power/SD_DAT0)
    (add_net /mcu/usb/power/SD_DAT1)
    (add_net /mcu/usb/power/SD_DAT2)
    (add_net /mcu/usb/power/SD_DAT3)
    (add_net /mcu/usb/power/SD_POW)
    (add_net /mcu/usb/power/SD_VOLT0)
    (add_net /mcu/usb/power/SGPIO0)
    (add_net /mcu/usb/power/SGPIO1)
    (add_net /mcu/usb/power/SGPIO10)
    (add_net /mcu/usb/power/SGPIO11)
    (add_net /mcu/usb/power/SGPIO12)
    (add_net /mcu/usb/power/SGPIO13)
    (add_net /mcu/usb/power/SGPIO14)
    (add_net /mcu/usb/power/SGPIO15)
    (add_net /mcu/usb/power/SGPIO2)
    (add_net /mcu/usb/power/SGPIO3)
    (add_net /mcu/usb/power/SGPIO4)
    (add_net /mcu/usb/power/SGPIO5)
    (add_net /mcu/usb/power/SGPIO6)
    (add_net /mcu/usb/power/SGPIO7)
    (add_net /mcu/usb/power/SGPIO9)
    (add_net /mcu/usb/power/SPIFI_CS)
    (add_net /mcu/usb/power/SPIFI_MISO)
    (add_net /mcu/usb/power/SPIFI_MOSI)
    (add_net /mcu/usb/power/SPIFI_SCK)
    (add_net /mcu/usb/power/SPIFI_SIO2)
    (add_net /mcu/usb/power/SPIFI_SIO3)
    (add_net /mcu/usb/power/TCK)
    (add_net /mcu/usb/power/TDI)
    (add_net /mcu/usb/power/TDO)
    (add_net /mcu/usb/power/TMS)
    (add_net /mcu/usb/power/U0_RXD)
    (add_net /mcu/usb/power/U0_TXD)
    (add_net /mcu/usb/power/USB_SHIELD)
    (add_net /mcu/usb/power/VBAT)
    (add_net /mcu/usb/power/VBUS)
    (add_net /mcu/usb/power/VBUSCTRL)
    (add_net /mcu/usb/power/VIN)
    (add_net /mcu/usb/power/VREGMODE)
    (add_net /mcu/usb/power/WAKEUP)
    (add_net /mcu/usb/power/XTAL1)
    (add_net /mcu/usb/power/XTAL2)
    (add_net AMP_BYPASS)
    (add_net CLK6)
    (add_net CLKIN)
    (add_net CLKOUT)
    (add_net CS_AD)
    (add_net CS_XCVR)
    (add_net DA0)
    (add_net DA1)
    (add_net DA2)
    (add_net DA3)
    (add_net DA4)
    (add_net DA5)
    (add_net DA6)
    (add_net DA7)
    (add_net DD0)
    (add_net DD1)
    (add_net DD2)
    (add_net DD3)
    (add_net DD4)
    (add_net DD5)
    (add_net DD6)
    (add_net DD7)
    (add_net DD8)
    (add_net DD9)
    (add_net GCK1)
    (add_net GCK2)
    (add_net GND)
    (add_net HP)
    (add_net LP)
    (add_net MCU_CLK)
    (add_net MIXER_ENX)
    (add_net MIXER_RESETX)
    (add_net MIXER_SCLK)
    (add_net MIXER_SDATA)
    (add_net MIX_BYPASS)
    (add_net MIX_CLK)
    (add_net "Net-(C102-Pad1)")
    (add_net "Net-(C102-Pad2)")
    (add_net "Net-(C104-Pad1)")
    (add_net "Net-(C104-Pad2)")
    (add_net "Net-(C105-Pad1)")
    (add_net "Net-(C106-Pad1)")
    (add_net "Net-(C111-Pad1)")
    (add_net "Net-(C111-Pad2)")
    (add_net "Net-(C114-Pad1)")
    (add_net "Net-(C114-Pad2)")
    (add_net "Net-(C12-Pad1)")
    (add_net "Net-(C125-Pad2)")
    (add_net "Net-(C13-Pad1)")
    (add_net "Net-(C14-Pad1)")
    (add_net "Net-(C14-Pad2)")
    (add_net "Net-(C15-Pad2)")
    (add_net "Net-(C160-Pad1)")
    (add_net "Net-(C163-Pad2)")
    (add_net "Net-(C17-Pad1)")
    (add_net "Net-(C17-Pad2)")
    (add_net "Net-(C18-Pad1)")
    (add_net "Net-(C18-Pad2)")
    (add_net "Net-(C20-Pad1)")
    (add_net "Net-(C20-Pad2)")
    (add_net "Net-(C21-Pad1)")
    (add_net "Net-(C21-Pad2)")
    (add_net "Net-(C23-Pad1)")
    (add_net "Net-(C23-Pad2)")
    (add_net "Net-(C25-Pad1)")
    (add_net "Net-(C26-Pad1)")
    (add_net "Net-(C26-Pad2)")
    (add_net "Net-(C27-Pad1)")
    (add_net "Net-(C27-Pad2)")
    (add_net "Net-(C28-Pad1)")
    (add_net "Net-(C28-Pad2)")
    (add_net "Net-(C31-Pad1)")
    (add_net "Net-(C31-Pad2)")
    (add_net "Net-(C32-Pad1)")
    (add_net "Net-(C32-Pad2)")
    (add_net "Net-(C43-Pad1)")
    (add_net "Net-(C43-Pad2)")
    (add_net "Net-(C44-Pad1)")
    (add_net "Net-(C44-Pad2)")
    (add_net "Net-(C46-Pad1)")
    (add_net "Net-(C46-Pad2)")
    (add_net "Net-(C48-Pad1)")
    (add_net "Net-(C49-Pad2)")
    (add_net "Net-(C50-Pad1)")
    (add_net "Net-(C51-Pad1)")
    (add_net "Net-(C51-Pad2)")
    (add_net "Net-(C58-Pad1)")
    (add_net "Net-(C58-Pad2)")
    (add_net "Net-(C59-Pad2)")
    (add_net "Net-(C61-Pad1)")
    (add_net "Net-(C61-Pad2)")
    (add_net "Net-(C62-Pad2)")
    (add_net "Net-(C64-Pad1)")
    (add_net "Net-(C64-Pad2)")
    (add_net "Net-(C8-Pad2)")
    (add_net "Net-(C9-Pad1)")
    (add_net "Net-(C9-Pad2)")
    (add_net "Net-(C99-Pad1)")
    (add_net "Net-(C99-Pad2)")
    (add_net "Net-(D2-Pad2)")
    (add_net "Net-(D4-Pad2)")
    (add_net "Net-(D5-Pad2)")
    (add_net "Net-(D6-Pad2)")
    (add_net "Net-(D7-Pad2)")
    (add_net "Net-(D8-Pad2)")
    (add_net "Net-(FB1-Pad1)")
    (add_net "Net-(FB2-Pad1)")
    (add_net "Net-(FB3-Pad1)")
    (add_net "Net-(J1-Pad2)")
    (add_net "Net-(J1-Pad3)")
    (add_net "Net-(J1-Pad4)")
    (add_net "Net-(L1-Pad1)")
    (add_net "Net-(L1-Pad2)")
    (add_net "Net-(L10-Pad1)")
    (add_net "Net-(L11-Pad2)")
    (add_net "Net-(L13-Pad1)")
    (add_net "Net-(L2-Pad1)")
    (add_net "Net-(L3-Pad1)")
    (add_net "Net-(P17-Pad1)")
    (add_net "Net-(P19-Pad1)")
    (add_net "Net-(P24-Pad1)")
    (add_net "Net-(P25-Pad3)")
    (add_net "Net-(P26-Pad7)")
    (add_net "Net-(P6-Pad1)")
    (add_net "Net-(P7-Pad1)")
    (add_net "Net-(R19-Pad2)")
    (add_net "Net-(R30-Pad2)")
    (add_net "Net-(R4-Pad2)")
    (add_net "Net-(R51-Pad1)")
    (add_net "Net-(R52-Pad2)")
    (add_net "Net-(R55-Pad2)")
    (add_net "Net-(R62-Pad1)")
    (add_net "Net-(U12-Pad2)")
    (add_net "Net-(U14-Pad2)")
    (add_net "Net-(U15-Pad4)")
    (add_net "Net-(U15-Pad6)")
    (add_net "Net-(U17-Pad12)")
    (add_net "Net-(U17-Pad14)")
    (add_net "Net-(U17-Pad18)")
    (add_net "Net-(U17-Pad3)")
    (add_net "Net-(U17-Pad33)")
    (add_net "Net-(U17-Pad34)")
    (add_net "Net-(U17-Pad40)")
    (add_net "Net-(U17-Pad6)")
    (add_net "Net-(U17-Pad8)")
    (add_net "Net-(U17-Pad9)")
    (add_net "Net-(U18-Pad38)")
    (add_net "Net-(U23-Pad136)")
    (add_net "Net-(U23-Pad138)")
    (add_net "Net-(U23-Pad139)")
    (add_net "Net-(U23-Pad89)")
    (add_net "Net-(U23-Pad90)")
    (add_net "Net-(U24-Pad14)")
    (add_net "Net-(U24-Pad15)")
    (add_net "Net-(U24-Pad16)")
    (add_net "Net-(U24-Pad20)")
    (add_net "Net-(U24-Pad25)")
    (add_net "Net-(U24-Pad44)")
    (add_net "Net-(U24-Pad46)")
    (add_net "Net-(U24-Pad49)")
    (add_net "Net-(U24-Pad50)")
    (add_net "Net-(U24-Pad52)")
    (add_net "Net-(U24-Pad53)")
    (add_net "Net-(U24-Pad54)")
    (add_net "Net-(U24-Pad58)")
    (add_net "Net-(U24-Pad59)")
    (add_net "Net-(U24-Pad60)")
    (add_net "Net-(U24-Pad63)")
    (add_net "Net-(U24-Pad65)")
    (add_net "Net-(U24-Pad66)")
    (add_net "Net-(U24-Pad68)")
    (add_net "Net-(U24-Pad73)")
    (add_net "Net-(U24-Pad75)")
    (add_net "Net-(U24-Pad80)")
    (add_net "Net-(U24-Pad82)")
    (add_net "Net-(U24-Pad85)")
    (add_net "Net-(U24-Pad86)")
    (add_net "Net-(U24-Pad87)")
    (add_net "Net-(U24-Pad93)")
    (add_net "Net-(U24-Pad95)")
    (add_net "Net-(U24-Pad96)")
    (add_net "Net-(U4-Pad1)")
    (add_net "Net-(U4-Pad11)")
    (add_net "Net-(U4-Pad13)")
    (add_net "Net-(U4-Pad14)")
    (add_net "Net-(U4-Pad17)")
    (add_net "Net-(U4-Pad18)")
    (add_net "Net-(U4-Pad2)")
    (add_net "Net-(U4-Pad20)")
    (add_net "Net-(U4-Pad21)")
    (add_net "Net-(U4-Pad3)")
    (add_net "Net-(U9-Pad2)")
    (add_net RSSI)
    (add_net RX)
    (add_net RXENABLE)
    (add_net RX_AMP)
    (add_net RX_IF)
    (add_net RX_MIX_BP)
    (add_net SCL)
    (add_net SDA)
    (add_net SGPIO_CLK)
    (add_net SSP1_MISO)
    (add_net SSP1_MOSI)
    (add_net SSP1_SCK)
    (add_net TX)
    (add_net TXENABLE)
    (add_net TX_AMP)
    (add_net TX_IF)
    (add_net TX_MIX_BP)
    (add_net VAA)
    (add_net VCC)
    (add_net XCVR_EN)
  )
  (module hackrf:GSG-QFN20-4 (layer C1F) (tedit 527E5841)
    (at 127.4692 162.926 90)
    (solder_mask_margin 0.07112)
    (clearance 0.1524)
    (fp_text reference U19 (at 0 0 90) (layer F.SilkS))
    (fp_text value SI5351C (at 0 0 90) (layer F.SilkS) hide)
    (pad 1 smd oval (at -2.2 -1 90) (size 1.2 0.32) (layers C1F F.Paste F.Mask)
      (net 34 /baseband/XA) (die_length 0.08382))
    (pad 2 smd oval (at -2.2 -0.5 90) (size 1.2 0.32) (layers C1F F.Paste F.Mask)
      (net 35 /baseband/XB) (die_length 0.08128))
    (pad 3 smd oval (at -2.2 0 90) (size 1.2 0.32) (layers C1F F.Paste F.Mask)
      (net 18 /baseband/INTR) (die_length 0.08382))
    (pad 4 smd oval (at -2.2 0.5 90) (size 1.2 0.32) (layers C1F F.Paste F.Mask)
      (net 209 SCL) (die_length -0.00254))
    (pad 5 smd oval (at -2.2 1 90) (size 1.2 0.32) (layers C1F F.Paste F.Mask)
      (net 210 SDA) (die_length 0.08382))
    (pad 6 smd oval (at -1 2.2 180) (size 1.2 0.32) (layers C1F F.Paste F.Mask)
      (net 169 CLKIN) (die_length 0.08382))
    (pad 7 smd oval (at -0.5 2.2 180) (size 1.2 0.32) (layers C1F F.Paste F.Mask)
      (net 19 /baseband/OEB) (die_length 0.2032))
    (pad 8 smd oval (at 0 2.2 180) (size 1.2 0.32) (layers C1F F.Paste F.Mask)
      (net 9 /baseband/CLK3) (die_length 0.04572))
    (pad 9 smd oval (at 0.5 2.2 180) (size 1.2 0.32) (layers C1F F.Paste F.Mask)
      (net 8 /baseband/CLK2) (die_length 0.18288))
    (pad 10 smd oval (at 1 2.2 180) (size 1.2 0.32) (layers C1F F.Paste F.Mask)
      (net 221 VCC) (die_length 0.12192))
    (pad 11 smd oval (at 2.2 1 90) (size 1.2 0.32) (layers C1F F.Paste F.Mask)
      (net 221 VCC) (die_length 0.18288))
    (pad 12 smd oval (at 2.2 0.5 90) (size 1.2 0.32) (layers C1F F.Paste F.Mask)
      (net 7 /baseband/CLK1) (die_length 0.12192))
    (pad 13 smd oval (at 2.2 0 90) (size 1.2 0.32) (layers C1F F.Paste F.Mask)
      (net 6 /baseband/CLK0) (die_length -2147.483648))
    (pad 14 smd oval (at 2.2 -0.5 90) (size 1.2 0.32) (layers C1F F.Paste F.Mask)
      (net 221 VCC) (die_length -2147.483648))
    (pad 15 smd oval (at 2.2 -1 90) (size 1.2 0.32) (layers C1F F.Paste F.Mask)
      (net 196 MCU_CLK) (die_length -2147.483648))
    (pad 16 smd oval (at 1 -2.2 180) (size 1.2 0.32) (layers C1F F.Paste F.Mask)
      (net 168 CLK6) (die_length -2147.483648))
    (pad 17 smd oval (at 0.5 -2.2 180) (size 1.2 0.32) (layers C1F F.Paste F.Mask)
      (net 10 /baseband/CLK5) (die_length 0.254))
    (pad 18 smd oval (at 0 -2.2 180) (size 1.2 0.32) (layers C1F F.Paste F.Mask)
      (net 221 VCC) (die_length 0.10668))
    (pad 19 smd oval (at -0.5 -2.2 180) (size 1.2 0.32) (layers C1F F.Paste F.Mask)
      (net 202 MIX_CLK) (die_length 0.09144))
    (pad 20 smd oval (at -1 -2.2 180) (size 1.2 0.32) (layers C1F F.Paste F.Mask)
      (net 221 VCC) (die_length -2147.483648))
    (pad 0 smd rect (at 0 0 90) (size 2.65 2.65) (layers C1F F.Mask)
      (net 193 GND) (solder_mask_margin -0.09906))
    (pad 0 thru_hole circle (at 0 0 90) (size 0.6 0.6) (drill 0.35) (layers *.Cu B.Mask)
      (net 193 GND))
    (pad 0 thru_hole circle (at -0.66 -0.66 90) (size 0.6 0.6) (drill 0.35) (layers *.Cu B.Mask)
      (net 193 GND))
    (pad 0 thru_hole circle (at 0.66 -0.66 90) (size 0.6 0.6) (drill 0.35) (layers *.Cu B.Mask)
      (net 193 GND))
    (pad 0 thru_hole circle (at 0.66 0.66 90) (size 0.6 0.6) (drill 0.35) (layers *.Cu B.Mask)
      (net 193 GND))
    (pad 0 thru_hole circle (at -0.66 0.66 90) (size 0.6 0.6) (drill 0.35) (layers *.Cu B.Mask)
      (net 193 GND))
    (pad 0 smd rect (at -0.66 -0.66 90) (size 1.32 1.32) (layers C1F F.Paste)
      (net 193 GND))
    (pad 0 smd rect (at 0.66 -0.66 90) (size 1.32 1.32) (layers C1F F.Paste)
      (net 193 GND))
    (pad 0 smd rect (at -0.66 0.66 90) (size 1.32 1.32) (layers C1F F.Paste)
      (net 193 GND))
    (pad 0 smd rect (at 0.66 0.66 90) (size 1.32 1.32) (layers C1F F.Paste)
      (net 193 GND))
  )
  (module GSG-TESTPOINT-30MIL-MASKONLY (layer C1F) (tedit 52807D39)
    (at 89.31402 142.49908)
    (fp_text reference TESTPOINT-30MIL-MASKONLY (at 0 0) (layer F.SilkS) hide)
    (fp_text value VAL** (at 0 0) (layer F.SilkS) hide)
    (pad "" smd circle (at 0 0) (size 0.762 0.762) (layers F.Mask)
      (die_length 0.1651))
  )
  (module GSG-TESTPOINT-30MIL-MASKONLY (layer C1F) (tedit 52807D39)
    (at 84.1046 151.6574)
    (fp_text reference TESTPOINT-30MIL-MASKONLY (at 0 0) (layer F.SilkS) hide)
    (fp_text value VAL** (at 0 0) (layer F.SilkS) hide)
    (pad "" smd circle (at 0 0) (size 0.762 0.762) (layers F.Mask)
      (die_length 0.1651))
  )
  (module GSG-TESTPOINT-30MIL-MASKONLY (layer C1F) (tedit 52807D39)
    (at 75.57516 144.21358)
    (fp_text reference TESTPOINT-30MIL-MASKONLY (at 0 0) (layer F.SilkS) hide)
    (fp_text value VAL** (at 0 0) (layer F.SilkS) hide)
    (pad "" smd circle (at 0 0) (size 0.762 0.762) (layers F.Mask)
      (die_length 0.1651))
  )
  (module GSG-TESTPOINT-30MIL-MASKONLY (layer C1F) (tedit 52807D39)
    (at 74.0537 146.1516)
    (fp_text reference TESTPOINT-30MIL-MASKONLY (at 0 0) (layer F.SilkS) hide)
    (fp_text value VAL** (at 0 0) (layer F.SilkS) hide)
    (pad "" smd circle (at 0 0) (size 0.762 0.762) (layers F.Mask)
      (die_length 0.1651))
  )
  (module GSG-TESTPOINT-30MIL-MASKONLY (layer C1F) (tedit 52807D39)
    (at 93.782 138.932)
    (fp_text reference TESTPOINT-30MIL-MASKONLY (at 0 0) (layer F.SilkS) hide)
    (fp_text value VAL** (at 0 0) (layer F.SilkS) hide)
    (pad "" smd circle (at 0 0) (size 0.762 0.762) (layers F.Mask)
      (die_length 0.1651))
  )
  (module GSG-TESTPOINT-30MIL-MASKONLY (layer C1F) (tedit 52807D39)
    (at 85.4 161.3602)
    (fp_text reference TESTPOINT-30MIL-MASKONLY (at 0 0) (layer F.SilkS) hide)
    (fp_text value VAL** (at 0 0) (layer F.SilkS) hide)
    (pad "" smd circle (at 0 0) (size 0.762 0.762) (layers F.Mask)
      (die_length 0.1651))
  )
  (module GSG-TESTPOINT-30MIL-MASKONLY (layer C1F) (tedit 52807D39)
    (at 75.33894 157.8483)
    (fp_text reference TESTPOINT-30MIL-MASKONLY (at 0 0) (layer F.SilkS) hide)
    (fp_text value VAL** (at 0 0) (layer F.SilkS) hide)
    (pad "" smd circle (at 0 0) (size 0.762 0.762) (layers F.Mask)
      (die_length 0.1651))
  )
  (module GSG-TESTPOINT-30MIL-MASKONLY (layer C1F) (tedit 52807D39)
    (at 79.0321 151.36114)
    (fp_text reference TESTPOINT-30MIL-MASKONLY (at 0 0) (layer F.SilkS) hide)
    (fp_text value VAL** (at 0 0) (layer F.SilkS) hide)
    (pad "" smd circle (at 0 0) (size 0.762 0.762) (layers F.Mask)
      (die_length 0.1651))
  )
  (module GSG-TESTPOINT-30MIL-MASKONLY (layer C1F) (tedit 52807D39)
    (at 113.919 161.74974)
    (fp_text reference TESTPOINT-30MIL-MASKONLY (at 0 0) (layer F.SilkS) hide)
    (fp_text value VAL** (at 0 0) (layer F.SilkS) hide)
    (pad "" smd circle (at 0 0) (size 0.762 0.762) (layers F.Mask)
      (die_length 0.1651))
  )
  (module GSG-TESTPOINT-30MIL-MASKONLY (layer C1F) (tedit 52807D39)
    (at 104.11206 168.79824)
    (fp_text reference TESTPOINT-30MIL-MASKONLY (at 0 0) (layer F.SilkS) hide)
    (fp_text value VAL** (at 0 0) (layer F.SilkS) hide)
    (pad "" smd circle (at 0 0) (size 0.762 0.762) (layers F.Mask)
      (die_length 0.1651))
  )
  (module GSG-TESTPOINT-30MIL-MASKONLY (layer C1F) (tedit 52807D39)
    (at 104.25176 165.37432)
    (fp_text reference TESTPOINT-30MIL-MASKONLY (at 0 0) (layer F.SilkS) hide)
    (fp_text value VAL** (at 0 0) (layer F.SilkS) hide)
    (pad "" smd circle (at 0 0) (size 0.762 0.762) (layers F.Mask)
      (die_length 0.1651))
  )
  (module GSG-TESTPOINT-30MIL-MASKONLY (layer C1F) (tedit 52807D39)
    (at 101.0158 166.26332)
    (fp_text reference TESTPOINT-30MIL-MASKONLY (at 0 0) (layer F.SilkS) hide)
    (fp_text value VAL** (at 0 0) (layer F.SilkS) hide)
    (pad "" smd circle (at 0 0) (size 0.762 0.762) (layers F.Mask)
      (die_length 0.1651))
  )
  (module GSG-TESTPOINT-30MIL-MASKONLY (layer C1F) (tedit 52807D39)
    (at 79.6671 147.71116)
    (fp_text reference TESTPOINT-30MIL-MASKONLY (at 0 0) (layer F.SilkS) hide)
    (fp_text value VAL** (at 0 0) (layer F.SilkS) hide)
    (pad "" smd circle (at 0 0) (size 0.762 0.762) (layers F.Mask)
      (die_length 0.1651))
  )
  (module GSG-TESTPOINT-30MIL-MASKONLY (layer C1F) (tedit 52807D39)
    (at 109.47654 159.42564)
    (fp_text reference TESTPOINT-30MIL-MASKONLY (at 0 0) (layer F.SilkS) hide)
    (fp_text value VAL** (at 0 0) (layer F.SilkS) hide)
    (pad "" smd circle (at 0 0) (size 0.762 0.762) (layers F.Mask)
      (die_length 0.1651))
  )
  (module GSG-TESTPOINT-30MIL-MASKONLY (layer C1F) (tedit 52807D39)
    (at 99.36226 147.6883)
    (fp_text reference TESTPOINT-30MIL-MASKONLY (at 0 0) (layer F.SilkS) hide)
    (fp_text value VAL** (at 0 0) (layer F.SilkS) hide)
    (pad "" smd circle (at 0 0) (size 0.762 0.762) (layers F.Mask)
      (die_length 0.1651))
  )
  (module GSG-TESTPOINT-30MIL-MASKONLY (layer C1F) (tedit 52807D39)
    (at 103.23068 154.2796)
    (fp_text reference TESTPOINT-30MIL-MASKONLY (at 0 0) (layer F.SilkS) hide)
    (fp_text value VAL** (at 0 0) (layer F.SilkS) hide)
    (pad "" smd circle (at 0 0) (size 0.762 0.762) (layers F.Mask)
      (die_length 0.1651))
  )
  (module GSG-TESTPOINT-30MIL-MASKONLY (layer C1F) (tedit 52807D39)
    (at 112.71504 153.71064)
    (fp_text reference TESTPOINT-30MIL-MASKONLY (at 0 0) (layer F.SilkS) hide)
    (fp_text value VAL** (at 0 0) (layer F.SilkS) hide)
    (pad "" smd circle (at 0 0) (size 0.762 0.762) (layers F.Mask)
      (die_length 0.1651))
  )
  (module GSG-MARK1MM (layer C1F) (tedit 52FD5A36)
    (at 171 102)
    (fp_text reference MARK1MM (at 0 0) (layer F.SilkS) hide)
    (fp_text value VAL** (at 0 0) (layer F.SilkS) hide)
    (pad "" smd circle (at 0 0) (size 1 1) (layers *.Cu *.Mask)
      (solder_mask_margin 0.5))
  )
  (module gsg-modules:LTST-S220 (layer C1F) (tedit 5787BCD0)
    (at 61 117.9 270)
    (solder_mask_margin 0.1016)
    (fp_text reference D7 (at 0 -1.5 270) (layer F.SilkS))
    (fp_text value VCCLED (at 0 0 270) (layer F.SilkS) hide)
    (pad 1 smd rect (at 1.25 0 270) (size 1.5 1) (layers C1F F.Paste F.Mask)
      (net 193 GND) (die_length 0.08128) (solder_mask_margin 0.1016) (clearance 0.1778))
    (pad 2 smd rect (at -1.25 0 270) (size 1.5 1) (layers C1F F.Paste F.Mask)
      (net 290 "Net-(D7-Pad2)") (die_length -2147.483648) (solder_mask_margin 0.1016) (clearance 0.1778))
  )
  (module gsg-modules:LTST-S220 (layer C1F) (tedit 5787BCD0)
    (at 61.27 130.55 270)
    (solder_mask_margin 0.1016)
    (fp_text reference D8 (at 0 -1.5 270) (layer F.SilkS))
    (fp_text value 1V8LED (at 0 0 270) (layer F.SilkS) hide)
    (pad 1 smd rect (at 1.25 0 270) (size 1.5 1) (layers C1F F.Paste F.Mask)
      (net 193 GND) (die_length 0.08128) (solder_mask_margin 0.1016) (clearance 0.1778))
    (pad 2 smd rect (at -1.25 0 270) (size 1.5 1) (layers C1F F.Paste F.Mask)
      (net 291 "Net-(D8-Pad2)") (die_length -2147.483648) (solder_mask_margin 0.1016) (clearance 0.1778))
  )
  (module gsg-modules:LTST-S220 (layer C1F) (tedit 5787BCD0)
    (at 61.27 135.122 270)
    (solder_mask_margin 0.1016)
    (fp_text reference D2 (at 0 -1.5 270) (layer F.SilkS))
    (fp_text value VAALED (at 0 0 270) (layer F.SilkS) hide)
    (pad 1 smd rect (at 1.25 0 270) (size 1.5 1) (layers C1F F.Paste F.Mask)
      (net 193 GND) (die_length 0.08128) (solder_mask_margin 0.1016) (clearance 0.1778))
    (pad 2 smd rect (at -1.25 0 270) (size 1.5 1) (layers C1F F.Paste F.Mask)
      (net 286 "Net-(D2-Pad2)") (die_length -2147.483648) (solder_mask_margin 0.1016) (clearance 0.1778))
  )
  (module gsg-modules:LTST-S220 (layer C1F) (tedit 5787BCD0)
    (at 61.27 139.694 270)
    (solder_mask_margin 0.1016)
    (fp_text reference D4 (at 0 -1.5 270) (layer F.SilkS))
    (fp_text value USBLED (at 0 0 270) (layer F.SilkS) hide)
    (pad 1 smd rect (at 1.25 0 270) (size 1.5 1) (layers C1F F.Paste F.Mask)
      (net 193 GND) (die_length 0.08128) (solder_mask_margin 0.1016) (clearance 0.1778))
    (pad 2 smd rect (at -1.25 0 270) (size 1.5 1) (layers C1F F.Paste F.Mask)
      (net 287 "Net-(D4-Pad2)") (die_length -2147.483648) (solder_mask_margin 0.1016) (clearance 0.1778))
  )
  (module gsg-modules:LTST-S220 (layer C1F) (tedit 5787BCD0)
    (at 61.27 144.266 270)
    (solder_mask_margin 0.1016)
    (fp_text reference D5 (at 0 -1.5 270) (layer F.SilkS))
    (fp_text value RXLED (at 0 0 270) (layer F.SilkS) hide)
    (pad 1 smd rect (at 1.25 0 270) (size 1.5 1) (layers C1F F.Paste F.Mask)
      (net 193 GND) (die_length 0.08128) (solder_mask_margin 0.1016) (clearance 0.1778))
    (pad 2 smd rect (at -1.25 0 270) (size 1.5 1) (layers C1F F.Paste F.Mask)
      (net 288 "Net-(D5-Pad2)") (die_length -2147.483648) (solder_mask_margin 0.1016) (clearance 0.1778))
  )
  (module gsg-modules:LTST-S220 (layer C1F) (tedit 5787BCD0)
    (at 61.27 148.838 270)
    (solder_mask_margin 0.1016)
    (fp_text reference D6 (at 0 -1.5 270) (layer F.SilkS))
    (fp_text value TXLED (at 0 0 270) (layer F.SilkS) hide)
    (pad 1 smd rect (at 1.25 0 270) (size 1.5 1) (layers C1F F.Paste F.Mask)
      (net 193 GND) (die_length 0.08128) (solder_mask_margin 0.1016) (clearance 0.1778))
    (pad 2 smd rect (at -1.25 0 270) (size 1.5 1) (layers C1F F.Paste F.Mask)
      (net 289 "Net-(D6-Pad2)") (die_length -2147.483648) (solder_mask_margin 0.1016) (clearance 0.1778))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 91.0964 163.0468 270)
    (solder_mask_margin 0.1016)
    (fp_text reference C1 (at 0 0.0508 270) (layer F.SilkS))
    (fp_text value 33pF (at 0 0.0508 270) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 221 VCC) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 90.0804 163.0468 270)
    (solder_mask_margin 0.1016)
    (fp_text reference C2 (at 0 0.0508 270) (layer F.SilkS))
    (fp_text value 10nF (at 0 0.0508 270) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 221 VCC) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 93.1284 163.0468 270)
    (solder_mask_margin 0.1016)
    (fp_text reference C3 (at 0 0.0508 270) (layer F.SilkS))
    (fp_text value 33pF (at 0 0.0508 270) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 220 VAA) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 92.1124 163.0468 270)
    (solder_mask_margin 0.1016)
    (fp_text reference C4 (at 0 0.0508 270) (layer F.SilkS))
    (fp_text value 10nF (at 0 0.0508 270) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 220 VAA) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 92.341 152.328 90)
    (solder_mask_margin 0.1016)
    (fp_text reference C5 (at 0 0.0508 90) (layer F.SilkS))
    (fp_text value 33pF (at 0 0.0508 90) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 220 VAA) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 93.357 152.328 90)
    (solder_mask_margin 0.1016)
    (fp_text reference C6 (at 0 0.0508 90) (layer F.SilkS))
    (fp_text value 10nF (at 0 0.0508 90) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 220 VAA) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 107.084 168.5762 180)
    (solder_mask_margin 0.1016)
    (fp_text reference C7 (at 0 0.0508 180) (layer F.SilkS))
    (fp_text value 33pF (at 0 0.0508 180) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 201 MIX_BYPASS) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 113.919 155.448 270)
    (solder_mask_margin 0.1016)
    (fp_text reference C8 (at 0 0.0508 270) (layer F.SilkS))
    (fp_text value 22pF (at 0 0.0508 270) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 223 "Net-(C8-Pad2)") (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 218 TX_IF) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 85.4 149.1682 90)
    (solder_mask_margin 0.1016)
    (fp_text reference C9 (at 0 0.0508 90) (layer F.SilkS))
    (fp_text value 100nF (at 0 0.0508 90) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 224 "Net-(C9-Pad2)") (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 225 "Net-(C9-Pad1)") (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 87.9808 143.4816)
    (solder_mask_margin 0.1016)
    (fp_text reference C10 (at 0 0.0508) (layer F.SilkS))
    (fp_text value 33pF (at 0 0.0508) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 204 RX) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 84.7138 143.4622 90)
    (solder_mask_margin 0.1016)
    (fp_text reference C11 (at 0 0.0508 90) (layer F.SilkS))
    (fp_text value 33pF (at 0 0.0508 90) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 195 LP) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 87.7944 153.8266 270)
    (solder_mask_margin 0.1016)
    (fp_text reference C12 (at 0 0.0508 270) (layer F.SilkS))
    (fp_text value 330pF (at 0 0.0508 270) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 226 "Net-(C12-Pad1)") (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 88.5564 150.9056 180)
    (solder_mask_margin 0.1016)
    (fp_text reference C13 (at 0 0.0508 180) (layer F.SilkS))
    (fp_text value 330pF (at 0 0.0508 180) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 227 "Net-(C13-Pad1)") (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 90.3344 152.6836 90)
    (solder_mask_margin 0.1016)
    (fp_text reference C14 (at 0 0.0508 90) (layer F.SilkS))
    (fp_text value 8p2 (at 0 0.0508 90) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 228 "Net-(C14-Pad2)") (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 229 "Net-(C14-Pad1)") (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 90.8424 150.9056)
    (solder_mask_margin 0.1016)
    (fp_text reference C15 (at 0 0.0508) (layer F.SilkS))
    (fp_text value 180pF (at 0 0.0508) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 230 "Net-(C15-Pad2)") (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 229 "Net-(C14-Pad1)") (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 106.4998 164.1566 90)
    (solder_mask_margin 0.1016)
    (fp_text reference C16 (at 0 0.0508 90) (layer F.SilkS))
    (fp_text value 33pF (at 0 0.0508 90) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 1 !MIX_BYPASS) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 82.9358 141.9382)
    (solder_mask_margin 0.1016)
    (fp_text reference C17 (at 0 0.0508) (layer F.SilkS))
    (fp_text value 100nF (at 0 0.0508) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 231 "Net-(C17-Pad2)") (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 232 "Net-(C17-Pad1)") (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 78.8718 141.9382)
    (solder_mask_margin 0.1016)
    (fp_text reference C18 (at 0 0.0508) (layer F.SilkS))
    (fp_text value 100nF (at 0 0.0508) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 233 "Net-(C18-Pad2)") (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 234 "Net-(C18-Pad1)") (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 77.0938 143.3352 90)
    (solder_mask_margin 0.1016)
    (fp_text reference C19 (at 0 0.0508 90) (layer F.SilkS))
    (fp_text value 33pF (at 0 0.0508 90) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 195 LP) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 87.8078 141.5288)
    (solder_mask_margin 0.1016)
    (fp_text reference C20 (at 0 0.0508) (layer F.SilkS))
    (fp_text value 100nF (at 0 0.0508) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 235 "Net-(C20-Pad2)") (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 236 "Net-(C20-Pad1)") (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 102.4382 165.3794 180)
    (solder_mask_margin 0.1016)
    (fp_text reference C21 (at 0 0.0508 180) (layer F.SilkS))
    (fp_text value 22pF (at 0 0.0508 180) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 237 "Net-(C21-Pad2)") (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 238 "Net-(C21-Pad1)") (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 95.9732 166.2726)
    (solder_mask_margin 0.1016)
    (fp_text reference C22 (at 0 0.0508) (layer F.SilkS))
    (fp_text value 33pF (at 0 0.0508) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 204 RX) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 101.2698 151.1808 90)
    (solder_mask_margin 0.1016)
    (fp_text reference C23 (at 0 0.0508 90) (layer F.SilkS))
    (fp_text value 100nF (at 0 0.0508 90) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 239 "Net-(C23-Pad2)") (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 240 "Net-(C23-Pad1)") (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 92.6798 143.4816 270)
    (solder_mask_margin 0.1016)
    (fp_text reference C24 (at 0 0.0508 270) (layer F.SilkS))
    (fp_text value 33pF (at 0 0.0508 270) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 215 TX) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 97.1924 163.7326)
    (solder_mask_margin 0.1016)
    (fp_text reference C25 (at 0 0.0508) (layer F.SilkS))
    (fp_text value 100nF (at 0 0.0508) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 241 "Net-(C25-Pad1)") (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 78.8718 138.8902 180)
    (solder_mask_margin 0.1016)
    (fp_text reference C26 (at 0 0.0508 180) (layer F.SilkS))
    (fp_text value 47pF (at 0 0.0508 180) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 242 "Net-(C26-Pad2)") (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 243 "Net-(C26-Pad1)") (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 82.9358 138.8902)
    (solder_mask_margin 0.1016)
    (fp_text reference C27 (at 0 0.0508) (layer F.SilkS))
    (fp_text value 47pF (at 0 0.0508) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 244 "Net-(C27-Pad2)") (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 245 "Net-(C27-Pad1)") (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 97.1924 164.8756)
    (solder_mask_margin 0.1016)
    (fp_text reference C28 (at 0 0.0508) (layer F.SilkS))
    (fp_text value 100nF (at 0 0.0508) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 246 "Net-(C28-Pad2)") (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 247 "Net-(C28-Pad1)") (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 75.4174 138.7124 180)
    (solder_mask_margin 0.1016)
    (fp_text reference C29 (at 0 0.0508 180) (layer F.SilkS))
    (fp_text value 33pF (at 0 0.0508 180) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 194 HP) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 84.7138 137.4932 90)
    (solder_mask_margin 0.1016)
    (fp_text reference C30 (at 0 0.0508 90) (layer F.SilkS))
    (fp_text value 33pF (at 0 0.0508 90) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 194 HP) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 75.5952 142.4462 90)
    (solder_mask_margin 0.1016)
    (fp_text reference C31 (at 0 0.0508 90) (layer F.SilkS))
    (fp_text value 100nF (at 0 0.0508 90) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 248 "Net-(C31-Pad2)") (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 249 "Net-(C31-Pad1)") (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 102.4382 168.8084 180)
    (solder_mask_margin 0.1016)
    (fp_text reference C32 (at 0 0.0508 180) (layer F.SilkS))
    (fp_text value 22pF (at 0 0.0508 180) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 250 "Net-(C32-Pad2)") (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 251 "Net-(C32-Pad1)") (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 100.1134 164.139 90)
    (solder_mask_margin 0.1016)
    (fp_text reference C33 (at 0 0.0508 90) (layer F.SilkS))
    (fp_text value 33pF (at 0 0.0508 90) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 215 TX) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 98.31 151.9216 90)
    (solder_mask_margin 0.1016)
    (fp_text reference C34 (at 0 0.0508 90) (layer F.SilkS))
    (fp_text value 33pF (at 0 0.0508 90) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 198 MIXER_RESETX) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 97.167 151.1596 90)
    (solder_mask_margin 0.1016)
    (fp_text reference C35 (at 0 0.0508 90) (layer F.SilkS))
    (fp_text value 33pF (at 0 0.0508 90) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 197 MIXER_ENX) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 96.024 150.7786 90)
    (solder_mask_margin 0.1016)
    (fp_text reference C36 (at 0 0.0508 90) (layer F.SilkS))
    (fp_text value 33pF (at 0 0.0508 90) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 199 MIXER_SCLK) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 93.738 149.915 180)
    (solder_mask_margin 0.1016)
    (fp_text reference C37 (at 0 0.0508 180) (layer F.SilkS))
    (fp_text value 33pF (at 0 0.0508 180) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 200 MIXER_SDATA) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 72.4456 142.8272)
    (solder_mask_margin 0.1016)
    (fp_text reference C38 (at 0 0.0508) (layer F.SilkS))
    (fp_text value 33pF (at 0 0.0508) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 1 !MIX_BYPASS) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 81.3054 147.3454 90)
    (solder_mask_margin 0.1016)
    (fp_text reference C39 (at 0 0.0508 90) (layer F.SilkS))
    (fp_text value 33pF (at 0 0.0508 90) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 219 TX_MIX_BP) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 72.4456 144.0718)
    (solder_mask_margin 0.1016)
    (fp_text reference C40 (at 0 0.0508) (layer F.SilkS))
    (fp_text value 33pF (at 0 0.0508) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 208 RX_MIX_BP) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 99.326 161.8276)
    (solder_mask_margin 0.1016)
    (fp_text reference C41 (at 0 0.0508) (layer F.SilkS))
    (fp_text value 100pF (at 0 0.0508) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 220 VAA) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 98.056 154.7156 180)
    (solder_mask_margin 0.1016)
    (fp_text reference C42 (at 0 0.0508 180) (layer F.SilkS))
    (fp_text value 100pF (at 0 0.0508 180) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 220 VAA) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 72.009 145.415 180)
    (solder_mask_margin 0.1016)
    (fp_text reference C43 (at 0 0.0508 180) (layer F.SilkS))
    (fp_text value 22pF (at 0 0.0508 180) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 252 "Net-(C43-Pad2)") (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 253 "Net-(C43-Pad1)") (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 79.6798 149.4282 90)
    (solder_mask_margin 0.1016)
    (fp_text reference C44 (at 0 0.0508 90) (layer F.SilkS))
    (fp_text value 100nF (at 0 0.0508 90) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 254 "Net-(C44-Pad2)") (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 255 "Net-(C44-Pad1)") (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 102.5906 155.6512)
    (solder_mask_margin 0.1016)
    (fp_text reference C45 (at 0 0.0508) (layer F.SilkS))
    (fp_text value 33pF (at 0 0.0508) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 215 TX) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 103.0478 156.7942 180)
    (solder_mask_margin 0.1016)
    (fp_text reference C46 (at 0 0.0508 180) (layer F.SilkS))
    (fp_text value 100nF (at 0 0.0508 180) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 256 "Net-(C46-Pad2)") (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 257 "Net-(C46-Pad1)") (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 112.1664 156.5656 90)
    (solder_mask_margin 0.1016)
    (fp_text reference C47 (at 0 0.0508 90) (layer F.SilkS))
    (fp_text value 33pF (at 0 0.0508 90) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 1 !MIX_BYPASS) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 108.7374 154.0002 90)
    (solder_mask_margin 0.1016)
    (fp_text reference C48 (at 0 0.0508 90) (layer F.SilkS))
    (fp_text value 22pF (at 0 0.0508 90) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 207 RX_IF) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 258 "Net-(C48-Pad1)") (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 100.85 156.2396 270)
    (solder_mask_margin 0.1016)
    (fp_text reference C49 (at 0 0.0508 270) (layer F.SilkS))
    (fp_text value 100nF (at 0 0.0508 270) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 259 "Net-(C49-Pad2)") (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 75.678 152.92)
    (solder_mask_margin 0.1016)
    (fp_text reference C50 (at 0 0.0508) (layer F.SilkS))
    (fp_text value 100nF (at 0 0.0508) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 40 /frontend/RX_AMP_OUT) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 260 "Net-(C50-Pad1)") (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 106.7414 159.434 180)
    (solder_mask_margin 0.1016)
    (fp_text reference C51 (at 0 0.0508 180) (layer F.SilkS))
    (fp_text value 22pF (at 0 0.0508 180) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 261 "Net-(C51-Pad2)") (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 262 "Net-(C51-Pad1)") (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 70.598 152.92 180)
    (solder_mask_margin 0.1016)
    (fp_text reference C52 (at 0 0.0508 180) (layer F.SilkS))
    (fp_text value 100pF (at 0 0.0508 180) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 263 "Net-(C163-Pad2)") (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 70.9474 147.9998 180)
    (solder_mask_margin 0.1016)
    (fp_text reference C53 (at 0 0.0508 180) (layer F.SilkS))
    (fp_text value 1uF (at 0 0.0508 180) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 220 VAA) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 103.124 159.6644 180)
    (solder_mask_margin 0.1016)
    (fp_text reference C54 (at 0 0.0508 180) (layer F.SilkS))
    (fp_text value 33pF (at 0 0.0508 180) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 204 RX) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 80.377 153.428)
    (solder_mask_margin 0.1016)
    (fp_text reference C55 (at 0 0.0508) (layer F.SilkS))
    (fp_text value 33pF (at 0 0.0508) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 217 TX_AMP) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 107.3912 154.8638 90)
    (solder_mask_margin 0.1016)
    (fp_text reference C56 (at 0 0.0508 90) (layer F.SilkS))
    (fp_text value 33pF (at 0 0.0508 90) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 201 MIX_BYPASS) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 76.835 149.4282 90)
    (solder_mask_margin 0.1016)
    (fp_text reference C57 (at 0 0.0508 90) (layer F.SilkS))
    (fp_text value 33pF (at 0 0.0508 90) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 167 AMP_BYPASS) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 71.614 157.111 90)
    (solder_mask_margin 0.1016)
    (fp_text reference C58 (at 0 0.0508 90) (layer F.SilkS))
    (fp_text value 100nF (at 0 0.0508 90) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 264 "Net-(C58-Pad2)") (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 265 "Net-(C58-Pad1)") (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 79.742 155.714)
    (solder_mask_margin 0.1016)
    (fp_text reference C59 (at 0 0.0508) (layer F.SilkS))
    (fp_text value 100nF (at 0 0.0508) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 266 "Net-(C59-Pad2)") (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 41 /frontend/TX_AMP_IN) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 75.043 151.396)
    (solder_mask_margin 0.1016)
    (fp_text reference C60 (at 0 0.0508) (layer F.SilkS))
    (fp_text value 33pF (at 0 0.0508) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 206 RX_AMP) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 76.3638 156.3236 90)
    (solder_mask_margin 0.1016)
    (fp_text reference C61 (at 0 0.0508 90) (layer F.SilkS))
    (fp_text value 100nF (at 0 0.0508 90) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 267 "Net-(C61-Pad2)") (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 268 "Net-(C61-Pad1)") (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 75.551 160.032)
    (solder_mask_margin 0.1016)
    (fp_text reference C62 (at 0 0.0508) (layer F.SilkS))
    (fp_text value 100nF (at 0 0.0508) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 269 "Net-(C62-Pad2)") (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 42 /frontend/TX_AMP_OUT) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 73.0872 162.2418 270)
    (solder_mask_margin 0.1016)
    (fp_text reference C63 (at 0 0.0508 270) (layer F.SilkS))
    (fp_text value 33pF (at 0 0.0508 270) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 217 TX_AMP) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 71.1 161 180)
    (solder_mask_margin 0.1016)
    (fp_text reference C64 (at 0 0.0508 180) (layer F.SilkS))
    (fp_text value 100nF (at 0 0.0508 180) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 270 "Net-(C64-Pad2)") (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 271 "Net-(C64-Pad1)") (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 69.836 158)
    (solder_mask_margin 0.1016)
    (fp_text reference C65 (at 0 0.0508) (layer F.SilkS))
    (fp_text value 33pF (at 0 0.0508) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 167 AMP_BYPASS) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 69.836 155.841)
    (solder_mask_margin 0.1016)
    (fp_text reference C66 (at 0 0.0508) (layer F.SilkS))
    (fp_text value 33pF (at 0 0.0508) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 206 RX_AMP) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 121.0802 164.2964 270)
    (solder_mask_margin 0.1016)
    (fp_text reference C67 (at 0 0.0508 270) (layer F.SilkS))
    (fp_text value 33pF (at 0 0.0508 270) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 39 /frontend/REF_IN) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 202 MIX_CLK) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 127.4624 155.7214 90)
    (solder_mask_margin 0.1016)
    (fp_text reference C68 (at 0 0.0508 90) (layer F.SilkS))
    (fp_text value 100pF (at 0 0.0508 90) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 191 GCK1) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 129.088 154.2736)
    (solder_mask_margin 0.1016)
    (fp_text reference C69 (at 0 0.0508) (layer F.SilkS))
    (fp_text value 100pF (at 0 0.0508) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 192 GCK2) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 121.0802 166.3284 270)
    (solder_mask_margin 0.1016)
    (fp_text reference C70 (at 0 0.0508 270) (layer F.SilkS))
    (fp_text value 100pF (at 0 0.0508 270) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 39 /frontend/REF_IN) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 100.4824 118.5578 270)
    (solder_mask_margin 0.1016)
    (fp_text reference C71 (at 0 0.0508 270) (layer F.SilkS))
    (fp_text value 100nF (at 0 0.0508 270) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 220 VAA) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 99.4664 118.5578 270)
    (solder_mask_margin 0.1016)
    (fp_text reference C72 (at 0 0.0508 270) (layer F.SilkS))
    (fp_text value 2.2uF (at 0 0.0508 270) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 220 VAA) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 103.4034 118.5578 270)
    (solder_mask_margin 0.1016)
    (fp_text reference C73 (at 0 0.0508 270) (layer F.SilkS))
    (fp_text value 100nF (at 0 0.0508 270) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 220 VAA) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 102.3874 118.5578 270)
    (solder_mask_margin 0.1016)
    (fp_text reference C74 (at 0 0.0508 270) (layer F.SilkS))
    (fp_text value 2.2uF (at 0 0.0508 270) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 220 VAA) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 105.4354 118.5578 270)
    (solder_mask_margin 0.1016)
    (fp_text reference C75 (at 0 0.0508 270) (layer F.SilkS))
    (fp_text value 100nF (at 0 0.0508 270) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 220 VAA) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 106.4514 118.5578 270)
    (solder_mask_margin 0.1016)
    (fp_text reference C76 (at 0 0.0508 270) (layer F.SilkS))
    (fp_text value 2.2uF (at 0 0.0508 270) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 220 VAA) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 101.6254 106.3658 90)
    (solder_mask_margin 0.1016)
    (fp_text reference C77 (at 0 0.0508 90) (layer F.SilkS))
    (fp_text value 100nF (at 0 0.0508 90) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 220 VAA) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 100.6094 106.3658 90)
    (solder_mask_margin 0.1016)
    (fp_text reference C78 (at 0 0.0508 90) (layer F.SilkS))
    (fp_text value 2.2uF (at 0 0.0508 90) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 220 VAA) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 96.7359 110.4933 180)
    (solder_mask_margin 0.1016)
    (fp_text reference C79 (at 0 0.0508 180) (layer F.SilkS))
    (fp_text value 100nF (at 0 0.0508 180) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 220 VAA) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 97.2439 108.8423 90)
    (solder_mask_margin 0.1016)
    (fp_text reference C80 (at 0 0.0508 90) (layer F.SilkS))
    (fp_text value 2.2uF (at 0 0.0508 90) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 220 VAA) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 96.1009 113.1603 180)
    (solder_mask_margin 0.1016)
    (fp_text reference C81 (at 0 0.0508 180) (layer F.SilkS))
    (fp_text value 100nF (at 0 0.0508 180) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 220 VAA) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 96.1009 112.1443 180)
    (solder_mask_margin 0.1016)
    (fp_text reference C82 (at 0 0.0508 180) (layer F.SilkS))
    (fp_text value 2.2uF (at 0 0.0508 180) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 220 VAA) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 96.3549 115.3193 180)
    (solder_mask_margin 0.1016)
    (fp_text reference C83 (at 0 0.0508 180) (layer F.SilkS))
    (fp_text value 100nF (at 0 0.0508 180) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 220 VAA) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 105.9815 147.4851 270)
    (solder_mask_margin 0.1016)
    (fp_text reference C84 (at 0 0.0508 270) (layer F.SilkS))
    (fp_text value 22pF (at 0 0.0508 270) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 220 VAA) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 109.0295 147.4851 270)
    (solder_mask_margin 0.1016)
    (fp_text reference C85 (at 0 0.0508 270) (layer F.SilkS))
    (fp_text value 22pF (at 0 0.0508 270) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 220 VAA) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 113.7285 145.1991 270)
    (solder_mask_margin 0.1016)
    (fp_text reference C86 (at 0 0.0508 270) (layer F.SilkS))
    (fp_text value 22pF (at 0 0.0508 270) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 220 VAA) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 114.2365 141.8971)
    (solder_mask_margin 0.1016)
    (fp_text reference C87 (at 0 0.0508) (layer F.SilkS))
    (fp_text value 10nF (at 0 0.0508) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 220 VAA) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 114.9985 140.8811)
    (solder_mask_margin 0.1016)
    (fp_text reference C88 (at 0 0.0508) (layer F.SilkS))
    (fp_text value 10nF (at 0 0.0508) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 221 VCC) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 114.2365 139.8651)
    (solder_mask_margin 0.1016)
    (fp_text reference C89 (at 0 0.0508) (layer F.SilkS))
    (fp_text value 10nF (at 0 0.0508) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 220 VAA) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 109.9185 136.3091 90)
    (solder_mask_margin 0.1016)
    (fp_text reference C90 (at 0 0.0508 90) (layer F.SilkS))
    (fp_text value 100pF (at 0 0.0508 90) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 220 VAA) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 110.9345 136.3091 90)
    (solder_mask_margin 0.1016)
    (fp_text reference C91 (at 0 0.0508 90) (layer F.SilkS))
    (fp_text value 100nF (at 0 0.0508 90) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 220 VAA) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 103.0605 140.1191 180)
    (solder_mask_margin 0.1016)
    (fp_text reference C92 (at 0 0.0508 180) (layer F.SilkS))
    (fp_text value 10nF (at 0 0.0508 180) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 220 VAA) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 103.0605 141.1351 180)
    (solder_mask_margin 0.1016)
    (fp_text reference C93 (at 0 0.0508 180) (layer F.SilkS))
    (fp_text value 10nF (at 0 0.0508 180) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 220 VAA) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 103.0605 143.5481 180)
    (solder_mask_margin 0.1016)
    (fp_text reference C94 (at 0 0.0508 180) (layer F.SilkS))
    (fp_text value 22pF (at 0 0.0508 180) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 220 VAA) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 92.456 123.46)
    (solder_mask_margin 0.1016)
    (fp_text reference C95 (at 0 0.0508) (layer F.SilkS))
    (fp_text value 22pF (at 0 0.0508) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 32 /baseband/TXBBQ+) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 33 /baseband/TXBBQ-) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 95.5802 123.46)
    (solder_mask_margin 0.1016)
    (fp_text reference C96 (at 0 0.0508) (layer F.SilkS))
    (fp_text value 22pF (at 0 0.0508) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 31 /baseband/TXBBI-) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 30 /baseband/TXBBI+) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 96.4184 118.5578 270)
    (solder_mask_margin 0.1016)
    (fp_text reference C97 (at 0 0.0508 270) (layer F.SilkS))
    (fp_text value 330nF (at 0 0.0508 270) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 11 /baseband/COM) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 97.4344 118.5578 270)
    (solder_mask_margin 0.1016)
    (fp_text reference C98 (at 0 0.0508 270) (layer F.SilkS))
    (fp_text value 330nF (at 0 0.0508 270) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 24 /baseband/REFN) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 106.9975 148.5011 270)
    (solder_mask_margin 0.1016)
    (fp_text reference C99 (at 0 0.0508 270) (layer F.SilkS))
    (fp_text value 22pF (at 0 0.0508 270) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 272 "Net-(C99-Pad2)") (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 273 "Net-(C99-Pad1)") (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 98.4504 118.5578 270)
    (solder_mask_margin 0.1016)
    (fp_text reference C100 (at 0 0.0508 270) (layer F.SilkS))
    (fp_text value 330nF (at 0 0.0508 270) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 25 /baseband/REFP) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 100.6475 123.7013)
    (solder_mask_margin 0.1016)
    (fp_text reference C101 (at 0 0.0508) (layer F.SilkS))
    (fp_text value 22pF (at 0 0.0508) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 15 /baseband/IA-) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 14 /baseband/IA+) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 108.0135 148.5011 270)
    (solder_mask_margin 0.1016)
    (fp_text reference C102 (at 0 0.0508 270) (layer F.SilkS))
    (fp_text value 22pF (at 0 0.0508 270) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 274 "Net-(C102-Pad2)") (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 275 "Net-(C102-Pad1)") (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 103.7717 123.7013)
    (solder_mask_margin 0.1016)
    (fp_text reference C103 (at 0 0.0508) (layer F.SilkS))
    (fp_text value 22pF (at 0 0.0508) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 20 /baseband/QA+) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 21 /baseband/QA-) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 110.0455 148.5011 270)
    (solder_mask_margin 0.1016)
    (fp_text reference C104 (at 0 0.0508 270) (layer F.SilkS))
    (fp_text value 3pF (at 0 0.0508 270) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 276 "Net-(C104-Pad2)") (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 277 "Net-(C104-Pad1)") (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0805 (layer C1F) (tedit 50998367)
    (at 87.1526 124.3524 90)
    (solder_mask_margin 0.1016)
    (fp_text reference C105 (at 0 0 90) (layer F.SilkS))
    (fp_text value 10uF (at 0 0 90) (layer F.SilkS) hide)
    (pad 2 smd rect (at 1.016 0 90) (size 1.15062 1.44018) (layers C1F F.Paste F.Mask)
      (net 193 GND) (die_length 0.08128) (solder_mask_margin 0.1016) (clearance 0.1778))
    (pad 1 smd rect (at -1.016 0 90) (size 1.15062 1.44018) (layers C1F F.Paste F.Mask)
      (net 278 "Net-(C105-Pad1)") (die_length -2147.483648) (solder_mask_margin 0.1016) (clearance 0.1778))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 111.9505 136.3091 90)
    (solder_mask_margin 0.1016)
    (fp_text reference C106 (at 0 0.0508 90) (layer F.SilkS))
    (fp_text value 1uF (at 0 0.0508 90) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 279 "Net-(C106-Pad1)") (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 104.4702 122.1646 90)
    (solder_mask_margin 0.1016)
    (fp_text reference C107 (at 0 0.0508 90) (layer F.SilkS))
    (fp_text value 22pF (at 0 0.0508 90) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 20 /baseband/QA+) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 103.2002 122.1646 90)
    (solder_mask_margin 0.1016)
    (fp_text reference C108 (at 0 0.0508 90) (layer F.SilkS))
    (fp_text value 22pF (at 0 0.0508 90) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 21 /baseband/QA-) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 101.346 122.1646 90)
    (solder_mask_margin 0.1016)
    (fp_text reference C109 (at 0 0.0508 90) (layer F.SilkS))
    (fp_text value 22pF (at 0 0.0508 90) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 15 /baseband/IA-) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 100.076 122.1646 90)
    (solder_mask_margin 0.1016)
    (fp_text reference C110 (at 0 0.0508 90) (layer F.SilkS))
    (fp_text value 22pF (at 0 0.0508 90) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 14 /baseband/IA+) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 111.0615 148.5011 270)
    (solder_mask_margin 0.1016)
    (fp_text reference C111 (at 0 0.0508 270) (layer F.SilkS))
    (fp_text value 3pF (at 0 0.0508 270) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 280 "Net-(C111-Pad2)") (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 281 "Net-(C111-Pad1)") (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 113.7285 138.3411 270)
    (solder_mask_margin 0.1016)
    (fp_text reference C112 (at 0 0.0508 270) (layer F.SilkS))
    (fp_text value 180pF (at 0 0.0508 270) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 12 /baseband/CPOUT+) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 13 /baseband/CPOUT-) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 123.1512 165.466 270)
    (solder_mask_margin 0.1016)
    (fp_text reference C113 (at 0 0.0508 270) (layer F.SilkS))
    (fp_text value 100nF (at 0 0.0508 270) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 221 VCC) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 116.7765 138.3411 270)
    (solder_mask_margin 0.1016)
    (fp_text reference C114 (at 0 0.0508 270) (layer F.SilkS))
    (fp_text value 3.3nF (at 0 0.0508 270) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 282 "Net-(C114-Pad2)") (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 283 "Net-(C114-Pad1)") (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 122.8142 161.6142 180)
    (solder_mask_margin 0.1016)
    (fp_text reference C115 (at 0 0.0508 180) (layer F.SilkS))
    (fp_text value 33pF (at 0 0.0508 180) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 37 /baseband/XTAL2) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 10 /baseband/CLK5) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 120.8584 160.5474 180)
    (solder_mask_margin 0.1016)
    (fp_text reference C116 (at 0 0.0508 180) (layer F.SilkS))
    (fp_text value 47pF (at 0 0.0508 180) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 37 /baseband/XTAL2) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 160.9 155.1 180)
    (solder_mask_margin 0.1016)
    (fp_text reference C118 (at 0 0.0508 180) (layer F.SilkS))
    (fp_text value 18pF (at 0 0.0508 180) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 119 /mcu/usb/power/RTCX1) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 129.2472 158.481 90)
    (solder_mask_margin 0.1016)
    (fp_text reference C119 (at 0 0.0508 90) (layer F.SilkS))
    (fp_text value 100nF (at 0 0.0508 90) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 221 VCC) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 131.628 160.6236 90)
    (solder_mask_margin 0.1016)
    (fp_text reference C120 (at 0 0.0508 90) (layer F.SilkS))
    (fp_text value 100nF (at 0 0.0508 90) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 221 VCC) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 122.0268 162.7064 180)
    (solder_mask_margin 0.1016)
    (fp_text reference C121 (at 0 0.0508 180) (layer F.SilkS))
    (fp_text value 100nF (at 0 0.0508 180) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 221 VCC) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 125.8368 158.3122 180)
    (solder_mask_margin 0.1016)
    (fp_text reference C122 (at 0 0.0508 180) (layer F.SilkS))
    (fp_text value 100nF (at 0 0.0508 180) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 221 VCC) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 108.9914 113.0587)
    (solder_mask_margin 0.1016)
    (fp_text reference C123 (at 0 0.0508) (layer F.SilkS))
    (fp_text value 100nF (at 0 0.0508) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 221 VCC) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 108.9914 112.0427)
    (solder_mask_margin 0.1016)
    (fp_text reference C124 (at 0 0.0508) (layer F.SilkS))
    (fp_text value 2.2uF (at 0 0.0508) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 221 VCC) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 173.467 117.7932 180)
    (solder_mask_margin 0.1016)
    (fp_text reference C125 (at 0 0.0508 180) (layer F.SilkS))
    (fp_text value 33pF (at 0 0.0508 180) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 284 "Net-(C125-Pad2)") (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 116 /mcu/usb/power/REG_OUT2) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0805 (layer C1F) (tedit 50998367)
    (at 169.53 117.4122)
    (solder_mask_margin 0.1016)
    (fp_text reference C126 (at 0 0) (layer F.SilkS))
    (fp_text value 10uF (at 0 0) (layer F.SilkS) hide)
    (pad 2 smd rect (at 1.016 0) (size 1.15062 1.44018) (layers C1F F.Paste F.Mask)
      (net 193 GND) (die_length 0.08128) (solder_mask_margin 0.1016) (clearance 0.1778))
    (pad 1 smd rect (at -1.016 0) (size 1.15062 1.44018) (layers C1F F.Paste F.Mask)
      (net 116 /mcu/usb/power/REG_OUT2) (die_length -2147.483648) (solder_mask_margin 0.1016) (clearance 0.1778))
  )
  (module hackrf:GSG-0805 (layer C1F) (tedit 50998367)
    (at 169.53 115.2532)
    (solder_mask_margin 0.1016)
    (fp_text reference C127 (at 0 0) (layer F.SilkS))
    (fp_text value 10uF (at 0 0) (layer F.SilkS) hide)
    (pad 2 smd rect (at 1.016 0) (size 1.15062 1.44018) (layers C1F F.Paste F.Mask)
      (net 193 GND) (die_length 0.08128) (solder_mask_margin 0.1016) (clearance 0.1778))
    (pad 1 smd rect (at -1.016 0) (size 1.15062 1.44018) (layers C1F F.Paste F.Mask)
      (net 116 /mcu/usb/power/REG_OUT2) (die_length -2147.483648) (solder_mask_margin 0.1016) (clearance 0.1778))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 150.84628 123.279349 135)
    (solder_mask_margin 0.1016)
    (fp_text reference C128 (at 0 0.0508 135) (layer F.SilkS))
    (fp_text value 100nF (at 0 0.0508 135) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 135) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 135) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 221 VCC) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 143.931482 125.344808 135)
    (solder_mask_margin 0.1016)
    (fp_text reference C129 (at 0 0.0508 135) (layer F.SilkS))
    (fp_text value 100nF (at 0 0.0508 135) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 135) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 135) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 221 VCC) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 137.555501 131.72079 135)
    (solder_mask_margin 0.1016)
    (fp_text reference C130 (at 0 0.0508 135) (layer F.SilkS))
    (fp_text value 100nF (at 0 0.0508 135) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 135) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 135) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 221 VCC) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 132.898 137.0016 180)
    (solder_mask_margin 0.1016)
    (fp_text reference C131 (at 0 0.0508 180) (layer F.SilkS))
    (fp_text value 100nF (at 0 0.0508 180) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 221 VCC) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 134.4982 145.7138 225)
    (solder_mask_margin 0.1016)
    (fp_text reference C132 (at 0 0.0508 225) (layer F.SilkS))
    (fp_text value 100nF (at 0 0.0508 225) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 225) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 225) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 221 VCC) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 140.429183 151.477353 225)
    (solder_mask_margin 0.1016)
    (fp_text reference C133 (at 0 0.0508 225) (layer F.SilkS))
    (fp_text value 100nF (at 0 0.0508 225) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 225) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 225) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 221 VCC) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 145.009113 156.057284 225)
    (solder_mask_margin 0.1016)
    (fp_text reference C134 (at 0 0.0508 225) (layer F.SilkS))
    (fp_text value 100nF (at 0 0.0508 225) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 225) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 225) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 221 VCC) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 153.809764 155.698074 315)
    (solder_mask_margin 0.1016)
    (fp_text reference C135 (at 0 0.0508 315) (layer F.SilkS))
    (fp_text value 100nF (at 0 0.0508 315) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 315) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 315) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 221 VCC) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 159.467325 150.040512 315)
    (solder_mask_margin 0.1016)
    (fp_text reference C136 (at 0 0.0508 315) (layer F.SilkS))
    (fp_text value 100nF (at 0 0.0508 315) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 315) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 315) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 159 /mcu/usb/power/VBAT) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 160.904166 148.603671 315)
    (solder_mask_margin 0.1016)
    (fp_text reference C137 (at 0 0.0508 315) (layer F.SilkS))
    (fp_text value 100nF (at 0 0.0508 315) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 315) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 315) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 221 VCC) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 162.969625 146.538212 315)
    (solder_mask_margin 0.1016)
    (fp_text reference C138 (at 0 0.0508 315) (layer F.SilkS))
    (fp_text value 100nF (at 0 0.0508 315) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 315) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 315) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 221 VCC) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 164.406466 145.101371 315)
    (solder_mask_margin 0.1016)
    (fp_text reference C139 (at 0 0.0508 315) (layer F.SilkS))
    (fp_text value 100nF (at 0 0.0508 315) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 315) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 315) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 221 VCC) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 164.945282 136.480325 315)
    (solder_mask_margin 0.1016)
    (fp_text reference C140 (at 0 0.0508 315) (layer F.SilkS))
    (fp_text value 100nF (at 0 0.0508 315) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 315) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 315) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 221 VCC) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 157.312064 127.589872 45)
    (solder_mask_margin 0.1016)
    (fp_text reference C141 (at 0 0.0508 45) (layer F.SilkS))
    (fp_text value 100nF (at 0 0.0508 45) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 45) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 45) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 221 VCC) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 160.095943 130.553356 45)
    (solder_mask_margin 0.1016)
    (fp_text reference C142 (at 0 0.0508 45) (layer F.SilkS))
    (fp_text value 100nF (at 0 0.0508 45) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 45) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 45) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 221 VCC) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0805 (layer C1F) (tedit 50998367)
    (at 174.483 112.0782 270)
    (solder_mask_margin 0.1016)
    (fp_text reference C143 (at 0 0 270) (layer F.SilkS))
    (fp_text value 10uF (at 0 0 270) (layer F.SilkS) hide)
    (pad 2 smd rect (at 1.016 0 270) (size 1.15062 1.44018) (layers C1F F.Paste F.Mask)
      (net 193 GND) (die_length 0.08128) (solder_mask_margin 0.1016) (clearance 0.1778))
    (pad 1 smd rect (at -1.016 0 270) (size 1.15062 1.44018) (layers C1F F.Paste F.Mask)
      (net 162 /mcu/usb/power/VIN) (die_length -2147.483648) (solder_mask_margin 0.1016) (clearance 0.1778))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 153.6192 160.5788 180)
    (solder_mask_margin 0.1016)
    (fp_text reference C144 (at 0 0.0508 180) (layer F.SilkS))
    (fp_text value 100nF (at 0 0.0508 180) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 221 VCC) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0805 (layer C1F) (tedit 50998367)
    (at 169.53 108.6492 180)
    (solder_mask_margin 0.1016)
    (fp_text reference C145 (at 0 0 180) (layer F.SilkS))
    (fp_text value 10uF (at 0 0 180) (layer F.SilkS) hide)
    (pad 2 smd rect (at 1.016 0 180) (size 1.15062 1.44018) (layers C1F F.Paste F.Mask)
      (net 115 /mcu/usb/power/REG_OUT1) (die_length 0.08128) (solder_mask_margin 0.1016) (clearance 0.1778))
    (pad 1 smd rect (at -1.016 0 180) (size 1.15062 1.44018) (layers C1F F.Paste F.Mask)
      (net 193 GND) (die_length -2147.483648) (solder_mask_margin 0.1016) (clearance 0.1778))
  )
  (module hackrf:GSG-0805 (layer C1F) (tedit 50998367)
    (at 169.53 106.4902 180)
    (solder_mask_margin 0.1016)
    (fp_text reference C146 (at 0 0 180) (layer F.SilkS))
    (fp_text value 10uF (at 0 0 180) (layer F.SilkS) hide)
    (pad 2 smd rect (at 1.016 0 180) (size 1.15062 1.44018) (layers C1F F.Paste F.Mask)
      (net 115 /mcu/usb/power/REG_OUT1) (die_length 0.08128) (solder_mask_margin 0.1016) (clearance 0.1778))
    (pad 1 smd rect (at -1.016 0 180) (size 1.15062 1.44018) (layers C1F F.Paste F.Mask)
      (net 193 GND) (die_length -2147.483648) (solder_mask_margin 0.1016) (clearance 0.1778))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 172.832 112.0782 270)
    (solder_mask_margin 0.1016)
    (fp_text reference C147 (at 0 0.0508 270) (layer F.SilkS))
    (fp_text value 100nF (at 0 0.0508 270) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 162 /mcu/usb/power/VIN) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 137.668 118.1608 270)
    (solder_mask_margin 0.1016)
    (fp_text reference C148 (at 0 0.0508 270) (layer F.SilkS))
    (fp_text value 100nF (at 0 0.0508 270) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 221 VCC) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 138.5876 111.7032)
    (solder_mask_margin 0.1016)
    (fp_text reference C149 (at 0 0.0508) (layer F.SilkS))
    (fp_text value 100nF (at 0 0.0508) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 221 VCC) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 130.81 105.5878 90)
    (solder_mask_margin 0.1016)
    (fp_text reference C150 (at 0 0.0508 90) (layer F.SilkS))
    (fp_text value 100nF (at 0 0.0508 90) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 221 VCC) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 117.094 108.3818 90)
    (solder_mask_margin 0.1016)
    (fp_text reference C151 (at 0 0.0508 90) (layer F.SilkS))
    (fp_text value 100nF (at 0 0.0508 90) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 5 +1.8V) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 124.4144 128.01)
    (solder_mask_margin 0.1016)
    (fp_text reference C152 (at 0 0.0508) (layer F.SilkS))
    (fp_text value 100nF (at 0 0.0508) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 5 +1.8V) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 114.554 117.0178 180)
    (solder_mask_margin 0.1016)
    (fp_text reference C153 (at 0 0.0508 180) (layer F.SilkS))
    (fp_text value 100nF (at 0 0.0508 180) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 221 VCC) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 118.4962 126.6892 180)
    (solder_mask_margin 0.1016)
    (fp_text reference C154 (at 0 0.0508 180) (layer F.SilkS))
    (fp_text value 100nF (at 0 0.0508 180) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 221 VCC) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0805 (layer C1F) (tedit 50998367)
    (at 177.3 117.8 180)
    (solder_mask_margin 0.1016)
    (fp_text reference C155 (at 0 0 180) (layer F.SilkS))
    (fp_text value DNP (at 0 0 180) (layer F.SilkS) hide)
    (pad 2 smd rect (at 1.016 0 180) (size 1.15062 1.44018) (layers C1F F.Paste F.Mask)
      (net 193 GND) (die_length 0.08128) (solder_mask_margin 0.1016) (clearance 0.1778))
    (pad 1 smd rect (at -1.016 0 180) (size 1.15062 1.44018) (layers C1F F.Paste F.Mask)
      (net 158 /mcu/usb/power/USB_SHIELD) (die_length -2147.483648) (solder_mask_margin 0.1016) (clearance 0.1778))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 122.7634 158.998 180)
    (solder_mask_margin 0.1016)
    (fp_text reference C156 (at 0 0.0508 180) (layer F.SilkS))
    (fp_text value 47pF (at 0 0.0508 180) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 97 /mcu/usb/power/GP_CLKIN) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 164.316664 134.235261 45)
    (solder_mask_margin 0.1016)
    (fp_text reference C157 (at 0 0.0508 45) (layer F.SilkS))
    (fp_text value 18pF (at 0 0.0508 45) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 45) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 45) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 165 /mcu/usb/power/XTAL1) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 164.855479 130.463554 315)
    (solder_mask_margin 0.1016)
    (fp_text reference C158 (at 0 0.0508 315) (layer F.SilkS))
    (fp_text value 18pF (at 0 0.0508 315) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 315) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 315) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 166 /mcu/usb/power/XTAL2) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 130.993 150.9716 180)
    (solder_mask_margin 0.1016)
    (fp_text reference C159 (at 0 0.0508 180) (layer F.SilkS))
    (fp_text value 100pF (at 0 0.0508 180) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 211 SGPIO_CLK) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 75.551 161.81 180)
    (solder_mask_margin 0.1016)
    (fp_text reference C160 (at 0 0.0508 180) (layer F.SilkS))
    (fp_text value 100pF (at 0 0.0508 180) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 285 "Net-(C160-Pad1)") (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 78.1057 168.1848 270)
    (solder_mask_margin 0.1016)
    (fp_text reference C161 (at 0 0.0508 270) (layer F.SilkS))
    (fp_text value 1uF (at 0 0.0508 270) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 220 VAA) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 76.694 163.08)
    (solder_mask_margin 0.1016)
    (fp_text reference C162 (at 0 0.0508) (layer F.SilkS))
    (fp_text value 10nF (at 0 0.0508) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 285 "Net-(C160-Pad1)") (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 70.598 151.777)
    (solder_mask_margin 0.1016)
    (fp_text reference C163 (at 0 0.0508) (layer F.SilkS))
    (fp_text value 10nF (at 0 0.0508) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 263 "Net-(C163-Pad2)") (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 162 151.9)
    (solder_mask_margin 0.1016)
    (fp_text reference C164 (at 0 0.0508) (layer F.SilkS))
    (fp_text value 18pF (at 0 0.0508) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 120 /mcu/usb/power/RTCX2) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 134.7014 166.7958 180)
    (solder_mask_margin 0.1016)
    (fp_text reference C165 (at 0 0.0508 180) (layer F.SilkS))
    (fp_text value 100pF (at 0 0.0508 180) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 170 CLKOUT) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 119.7154 166.1354 270)
    (solder_mask_margin 0.1016)
    (fp_text reference C166 (at 0 0.0508 270) (layer F.SilkS))
    (fp_text value 100nF (at 0 0.0508 270) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 220 VAA) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 81.7932 120.1106 270)
    (solder_mask_margin 0.1016)
    (fp_text reference C167 (at 0 0.0508 270) (layer F.SilkS))
    (fp_text value 100nF (at 0 0.0508 270) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 221 VCC) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 139.756 127.502 180)
    (solder_mask_margin 0.1016)
    (fp_text reference C168 (at 0 0.0508 180) (layer F.SilkS))
    (fp_text value 100pF (at 0 0.0508 180) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 212 SSP1_MISO) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 127.381 169.9006 180)
    (solder_mask_margin 0.1016)
    (fp_text reference C169 (at 0 0.0508 180) (layer F.SilkS))
    (fp_text value DNP (at 0 0.0508 180) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 35 /baseband/XB) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 122.5 168.2 90)
    (solder_mask_margin 0.1016)
    (fp_text reference C170 (at 0 0.0508 90) (layer F.SilkS))
    (fp_text value DNP (at 0 0.0508 90) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 34 /baseband/XA) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 72.8 166.8 270)
    (solder_mask_margin 0.1016)
    (fp_text reference C171 (at 0 0.0508 270) (layer F.SilkS))
    (fp_text value 1uF (at 0 0.0508 270) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 220 VAA) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 66.2 161.5 90)
    (solder_mask_margin 0.1016)
    (fp_text reference D1 (at 0 0.0508 90) (layer F.SilkS))
    (fp_text value GSG-DIODE-TVS-BI (at 0 0.0508 90) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 270 "Net-(C64-Pad2)") (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 173.03 165.3734 90)
    (solder_mask_margin 0.1016)
    (fp_text reference D3 (at 0 0.0508 90) (layer F.SilkS))
    (fp_text value GSG-DIODE-TVS-BI (at 0 0.0508 90) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 169 CLKIN) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 175.6778 151 180)
    (solder_mask_margin 0.1016)
    (fp_text reference D9 (at 0 0.0508 180) (layer F.SilkS))
    (fp_text value GSG-DIODE-TVS-BI (at 0 0.0508 180) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 170 CLKOUT) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0805 (layer C1F) (tedit 50998367)
    (at 171 122.05 180)
    (solder_mask_margin 0.1016)
    (fp_text reference FB1 (at 0 0 180) (layer F.SilkS))
    (fp_text value FILTER (at 0 0 180) (layer F.SilkS) hide)
    (pad 2 smd rect (at 1.016 0 180) (size 1.15062 1.44018) (layers C1F F.Paste F.Mask)
      (net 160 /mcu/usb/power/VBUS) (die_length 0.08128) (solder_mask_margin 0.1016) (clearance 0.1778))
    (pad 1 smd rect (at -1.016 0 180) (size 1.15062 1.44018) (layers C1F F.Paste F.Mask)
      (net 292 "Net-(FB1-Pad1)") (die_length -2147.483648) (solder_mask_margin 0.1016) (clearance 0.1778))
  )
  (module hackrf:GSG-0805 (layer C1F) (tedit 50998367)
    (at 83.9216 122.5296 180)
    (solder_mask_margin 0.1016)
    (fp_text reference FB2 (at 0 0 180) (layer F.SilkS))
    (fp_text value FILTER (at 0 0 180) (layer F.SilkS) hide)
    (pad 2 smd rect (at 1.016 0 180) (size 1.15062 1.44018) (layers C1F F.Paste F.Mask)
      (net 278 "Net-(C105-Pad1)") (die_length 0.08128) (solder_mask_margin 0.1016) (clearance 0.1778))
    (pad 1 smd rect (at -1.016 0 180) (size 1.15062 1.44018) (layers C1F F.Paste F.Mask)
      (net 293 "Net-(FB2-Pad1)") (die_length -2147.483648) (solder_mask_margin 0.1016) (clearance 0.1778))
  )
  (module hackrf:GSG-0805 (layer C1F) (tedit 50998367)
    (at 171 127.8 180)
    (solder_mask_margin 0.1016)
    (fp_text reference FB3 (at 0 0 180) (layer F.SilkS))
    (fp_text value FILTER (at 0 0 180) (layer F.SilkS) hide)
    (pad 2 smd rect (at 1.016 0 180) (size 1.15062 1.44018) (layers C1F F.Paste F.Mask)
      (net 193 GND) (die_length 0.08128) (solder_mask_margin 0.1016) (clearance 0.1778))
    (pad 1 smd rect (at -1.016 0 180) (size 1.15062 1.44018) (layers C1F F.Paste F.Mask)
      (net 294 "Net-(FB3-Pad1)") (die_length -2147.483648) (solder_mask_margin 0.1016) (clearance 0.1778))
  )
  (module hackrf:GSG-USB-MICROB-FCI-10103592-EXT (layer C1F) (tedit 52F281B1)
    (at 180 124 180)
    (fp_text reference J1 (at 2.49936 0 180) (layer F.SilkS))
    (fp_text value USB-MICRO-B (at 2.49936 0 180) (layer F.SilkS) hide)
    (pad 5 smd rect (at 4.025 -1.3 180) (size 1.75 0.4) (layers C1F F.Paste F.Mask)
      (net 294 "Net-(FB3-Pad1)") (solder_mask_margin 0.1016) (clearance 0.2032))
    (pad 4 smd rect (at 4.025 -0.65 180) (size 1.75 0.4) (layers C1F F.Paste F.Mask)
      (net 295 "Net-(J1-Pad4)") (solder_mask_margin 0.1016) (clearance 0.2032))
    (pad 3 smd rect (at 4.025 0 180) (size 1.75 0.4) (layers C1F F.Paste F.Mask)
      (net 296 "Net-(J1-Pad3)") (solder_mask_margin 0.1016) (clearance 0.2032))
    (pad 2 smd rect (at 4.025 0.65 180) (size 1.75 0.4) (layers C1F F.Paste F.Mask)
      (net 297 "Net-(J1-Pad2)") (solder_mask_margin 0.1016) (clearance 0.2032))
    (pad 1 smd rect (at 4.025 1.3 180) (size 1.75 0.4) (layers C1F F.Paste F.Mask)
      (net 292 "Net-(FB1-Pad1)") (solder_mask_margin 0.1016) (clearance 0.2032))
    (pad 0 smd rect (at 1.15 -0.9375 180) (size 2.1 1.375) (layers C1F F.Paste F.Mask)
      (net 158 /mcu/usb/power/USB_SHIELD))
    (pad 0 smd rect (at 1.15 0.9375 180) (size 2.1 1.375) (layers C1F F.Paste F.Mask)
      (net 158 /mcu/usb/power/USB_SHIELD))
    (pad 0 smd rect (at 4.23 -2.83 180) (size 1.46 2.14) (layers C1F F.Paste F.Mask)
      (net 158 /mcu/usb/power/USB_SHIELD) (solder_paste_margin_ratio -0.05))
    (pad 0 smd rect (at 4.23 2.83 180) (size 1.46 2.14) (layers C1F F.Paste F.Mask)
      (net 158 /mcu/usb/power/USB_SHIELD) (solder_paste_margin_ratio -0.05))
    (pad 0 smd rect (at 2.575 -2.9875 180) (size 1.35 1.825) (layers C1F F.Mask)
      (net 158 /mcu/usb/power/USB_SHIELD))
    (pad 0 smd rect (at 2.575 2.9875 180) (size 1.35 1.825) (layers C1F F.Mask)
      (net 158 /mcu/usb/power/USB_SHIELD))
    (pad 0 smd rect (at 1.15 -4 180) (size 2.1 1.75) (layers C1F F.Paste F.Mask)
      (net 158 /mcu/usb/power/USB_SHIELD) (solder_paste_margin_ratio -0.05))
    (pad 0 smd rect (at 1.15 4 180) (size 2.1 1.75) (layers C1F F.Paste F.Mask)
      (net 158 /mcu/usb/power/USB_SHIELD) (solder_paste_margin_ratio -0.05))
    (pad 0 thru_hole circle (at 1.2 -4.125 180) (size 1.5 1.5) (drill 0.9) (layers *.Cu *.Mask)
      (net 158 /mcu/usb/power/USB_SHIELD))
    (pad 0 thru_hole circle (at 1.2 4.125 180) (size 1.5 1.5) (drill 0.9) (layers *.Cu *.Mask)
      (net 158 /mcu/usb/power/USB_SHIELD))
    (pad 0 thru_hole circle (at 4.23 -2.49 180) (size 1.4 1.4) (drill 0.7) (layers *.Cu *.Mask)
      (net 158 /mcu/usb/power/USB_SHIELD))
    (pad 0 thru_hole circle (at 4.23 2.49 180) (size 1.4 1.4) (drill 0.7) (layers *.Cu *.Mask)
      (net 158 /mcu/usb/power/USB_SHIELD))
  )
  (module hackrf:GSG-SHIELD-BMI-S-230 (layer C1F) (tedit 527E94FB)
    (at 93 152)
    (tags SHIELD)
    (fp_text reference J2 (at 0 21) (layer F.SilkS))
    (fp_text value RF-SHIELD-FRAME (at 0 21) (layer F.SilkS) hide)
    (pad 0 smd rect (at -23.875 18.95) (size 3.85 1) (layers C1F F.Mask)
      (net 193 GND))
    (pad 0 smd rect (at -18 18.95) (size 3.8 1) (layers C1F F.Mask)
      (net 193 GND))
    (pad 0 smd rect (at -12 18.95) (size 3.8 1) (layers C1F F.Mask)
      (net 193 GND))
    (pad 0 smd rect (at -6 18.95) (size 3.8 1) (layers C1F F.Mask)
      (net 193 GND))
    (pad 0 smd rect (at 0 18.95) (size 3.8 1) (layers C1F F.Mask)
      (net 193 GND))
    (pad 0 smd rect (at 6 18.95) (size 3.8 1) (layers C1F F.Mask)
      (net 193 GND))
    (pad 0 smd rect (at 12 18.95) (size 3.8 1) (layers C1F F.Mask)
      (net 193 GND))
    (pad 0 smd rect (at 18 18.95) (size 3.8 1) (layers C1F F.Mask)
      (net 193 GND))
    (pad 0 smd rect (at 23.875 18.95) (size 3.85 1) (layers C1F F.Mask)
      (net 193 GND))
    (pad 0 smd rect (at 25.3 17.775 90) (size 3.35 1) (layers C1F F.Mask)
      (net 193 GND))
    (pad 0 smd rect (at 25.3 12 90) (size 3.8 1) (layers C1F F.Mask)
      (net 193 GND))
    (pad 0 smd rect (at 25.3 6 90) (size 3.8 1) (layers C1F F.Mask)
      (net 193 GND))
    (pad 0 smd rect (at 25.3 0 90) (size 3.8 1) (layers C1F F.Mask)
      (net 193 GND))
    (pad 0 smd rect (at 25.3 -6 90) (size 3.8 1) (layers C1F F.Mask)
      (net 193 GND))
    (pad 0 smd rect (at 25.3 -12 90) (size 3.8 1) (layers C1F F.Mask)
      (net 193 GND))
    (pad 0 smd rect (at 25.3 -17.775 90) (size 3.35 1) (layers C1F F.Mask)
      (net 193 GND))
    (pad 0 smd rect (at 23.875 -18.95) (size 3.85 1) (layers C1F F.Mask)
      (net 193 GND))
    (pad 0 smd rect (at 18 -18.95) (size 3.8 1) (layers C1F F.Mask)
      (net 193 GND))
    (pad 0 smd rect (at 12 -18.95) (size 3.8 1) (layers C1F F.Mask)
      (net 193 GND))
    (pad 0 smd rect (at 6 -18.95) (size 3.8 1) (layers C1F F.Mask)
      (net 193 GND))
    (pad 0 smd rect (at 0 -18.95) (size 3.8 1) (layers C1F F.Mask)
      (net 193 GND))
    (pad 0 smd rect (at -6 -18.95) (size 3.8 1) (layers C1F F.Mask)
      (net 193 GND))
    (pad 0 smd rect (at -12 -18.95) (size 3.8 1) (layers C1F F.Mask)
      (net 193 GND))
    (pad 0 smd rect (at -18 -18.95) (size 3.8 1) (layers C1F F.Mask)
      (net 193 GND))
    (pad 0 smd rect (at -23.875 -18.95) (size 3.85 1) (layers C1F F.Mask)
      (net 193 GND))
    (pad 0 smd rect (at -25.3 -17.775 90) (size 3.35 1) (layers C1F F.Mask)
      (net 193 GND))
    (pad 0 smd rect (at -25.3 -12 90) (size 3.8 1) (layers C1F F.Mask)
      (net 193 GND))
    (pad 0 smd rect (at -25.3 -6 90) (size 3.8 1) (layers C1F F.Mask)
      (net 193 GND))
    (pad 0 smd rect (at -25.3 0 90) (size 3.8 1) (layers C1F F.Mask)
      (net 193 GND))
    (pad 0 smd rect (at -25.3 6 90) (size 3.8 1) (layers C1F F.Mask)
      (net 193 GND))
    (pad 0 smd rect (at -25.3 12 90) (size 3.8 1) (layers C1F F.Mask)
      (net 193 GND))
    (pad 0 smd rect (at -25.3 17.775 90) (size 3.35 1) (layers C1F F.Mask)
      (net 193 GND))
  )
  (module hackrf:GSG-NULL-MODULE (layer C1F) (tedit 52804A31)
    (at 105.96 172.82)
    (fp_text reference J3 (at 0 2) (layer F.SilkS) hide)
    (fp_text value RF-SHIELD-COVER (at 0 0) (layer F.SilkS) hide)
  )
  (module hackrf:GSG-HOLE126MIL-COPPER (layer C1F) (tedit 528F8568)
    (at 64 104)
    (fp_text reference J4 (at 0 0) (layer F.SilkS) hide)
    (fp_text value MOUNTING_HOLE (at 0 0) (layer F.SilkS) hide)
    (pad 1 thru_hole circle (at 0 0) (size 5.6 5.6) (drill 3.2004) (layers *.Cu *.Mask)
      (net 193 GND))
    (pad 1 thru_hole circle (at 0 -2.2) (size 0.6 0.6) (drill 0.381) (layers *.Cu *.Mask)
      (net 193 GND))
    (pad 1 thru_hole circle (at -2.2 0) (size 0.6 0.6) (drill 0.381) (layers *.Cu *.Mask)
      (net 193 GND))
    (pad 1 thru_hole circle (at 0 2.2) (size 0.6 0.6) (drill 0.381) (layers *.Cu *.Mask)
      (net 193 GND))
    (pad 1 thru_hole circle (at 2.2 0) (size 0.6 0.6) (drill 0.381) (layers *.Cu *.Mask)
      (net 193 GND))
    (pad 1 thru_hole circle (at 1.55 -1.55) (size 0.6 0.6) (drill 0.381) (layers *.Cu *.Mask)
      (net 193 GND))
    (pad 1 thru_hole circle (at -1.55 -1.55) (size 0.6 0.6) (drill 0.381) (layers *.Cu *.Mask)
      (net 193 GND))
    (pad 1 thru_hole circle (at -1.55 1.55) (size 0.6 0.6) (drill 0.381) (layers *.Cu *.Mask)
      (net 193 GND))
    (pad 1 thru_hole circle (at 1.55 1.55) (size 0.6 0.6) (drill 0.381) (layers *.Cu *.Mask)
      (net 193 GND))
  )
  (module hackrf:GSG-HOLE126MIL-COPPER (layer C1F) (tedit 528F8568)
    (at 64 171)
    (fp_text reference J5 (at 0 0) (layer F.SilkS) hide)
    (fp_text value MOUNTING_HOLE (at 0 0) (layer F.SilkS) hide)
    (pad 1 thru_hole circle (at 0 0) (size 5.6 5.6) (drill 3.2004) (layers *.Cu *.Mask)
      (net 193 GND))
    (pad 1 thru_hole circle (at 0 -2.2) (size 0.6 0.6) (drill 0.381) (layers *.Cu *.Mask)
      (net 193 GND))
    (pad 1 thru_hole circle (at -2.2 0) (size 0.6 0.6) (drill 0.381) (layers *.Cu *.Mask)
      (net 193 GND))
    (pad 1 thru_hole circle (at 0 2.2) (size 0.6 0.6) (drill 0.381) (layers *.Cu *.Mask)
      (net 193 GND))
    (pad 1 thru_hole circle (at 2.2 0) (size 0.6 0.6) (drill 0.381) (layers *.Cu *.Mask)
      (net 193 GND))
    (pad 1 thru_hole circle (at 1.55 -1.55) (size 0.6 0.6) (drill 0.381) (layers *.Cu *.Mask)
      (net 193 GND))
    (pad 1 thru_hole circle (at -1.55 -1.55) (size 0.6 0.6) (drill 0.381) (layers *.Cu *.Mask)
      (net 193 GND))
    (pad 1 thru_hole circle (at -1.55 1.55) (size 0.6 0.6) (drill 0.381) (layers *.Cu *.Mask)
      (net 193 GND))
    (pad 1 thru_hole circle (at 1.55 1.55) (size 0.6 0.6) (drill 0.381) (layers *.Cu *.Mask)
      (net 193 GND))
  )
  (module hackrf:GSG-HOLE126MIL-COPPER (layer C1F) (tedit 528F8568)
    (at 176 171)
    (fp_text reference J6 (at 0 0) (layer F.SilkS) hide)
    (fp_text value MOUNTING_HOLE (at 0 0) (layer F.SilkS) hide)
    (pad 1 thru_hole circle (at 0 0) (size 5.6 5.6) (drill 3.2004) (layers *.Cu *.Mask)
      (net 193 GND))
    (pad 1 thru_hole circle (at 0 -2.2) (size 0.6 0.6) (drill 0.381) (layers *.Cu *.Mask)
      (net 193 GND))
    (pad 1 thru_hole circle (at -2.2 0) (size 0.6 0.6) (drill 0.381) (layers *.Cu *.Mask)
      (net 193 GND))
    (pad 1 thru_hole circle (at 0 2.2) (size 0.6 0.6) (drill 0.381) (layers *.Cu *.Mask)
      (net 193 GND))
    (pad 1 thru_hole circle (at 2.2 0) (size 0.6 0.6) (drill 0.381) (layers *.Cu *.Mask)
      (net 193 GND))
    (pad 1 thru_hole circle (at 1.55 -1.55) (size 0.6 0.6) (drill 0.381) (layers *.Cu *.Mask)
      (net 193 GND))
    (pad 1 thru_hole circle (at -1.55 -1.55) (size 0.6 0.6) (drill 0.381) (layers *.Cu *.Mask)
      (net 193 GND))
    (pad 1 thru_hole circle (at -1.55 1.55) (size 0.6 0.6) (drill 0.381) (layers *.Cu *.Mask)
      (net 193 GND))
    (pad 1 thru_hole circle (at 1.55 1.55) (size 0.6 0.6) (drill 0.381) (layers *.Cu *.Mask)
      (net 193 GND))
  )
  (module hackrf:GSG-HOLE126MIL-COPPER (layer C1F) (tedit 528F8568)
    (at 176 104)
    (fp_text reference J7 (at 0 0) (layer F.SilkS) hide)
    (fp_text value MOUNTING_HOLE (at 0 0) (layer F.SilkS) hide)
    (pad 1 thru_hole circle (at 0 0) (size 5.6 5.6) (drill 3.2004) (layers *.Cu *.Mask)
      (net 193 GND))
    (pad 1 thru_hole circle (at 0 -2.2) (size 0.6 0.6) (drill 0.381) (layers *.Cu *.Mask)
      (net 193 GND))
    (pad 1 thru_hole circle (at -2.2 0) (size 0.6 0.6) (drill 0.381) (layers *.Cu *.Mask)
      (net 193 GND))
    (pad 1 thru_hole circle (at 0 2.2) (size 0.6 0.6) (drill 0.381) (layers *.Cu *.Mask)
      (net 193 GND))
    (pad 1 thru_hole circle (at 2.2 0) (size 0.6 0.6) (drill 0.381) (layers *.Cu *.Mask)
      (net 193 GND))
    (pad 1 thru_hole circle (at 1.55 -1.55) (size 0.6 0.6) (drill 0.381) (layers *.Cu *.Mask)
      (net 193 GND))
    (pad 1 thru_hole circle (at -1.55 -1.55) (size 0.6 0.6) (drill 0.381) (layers *.Cu *.Mask)
      (net 193 GND))
    (pad 1 thru_hole circle (at -1.55 1.55) (size 0.6 0.6) (drill 0.381) (layers *.Cu *.Mask)
      (net 193 GND))
    (pad 1 thru_hole circle (at 1.55 1.55) (size 0.6 0.6) (drill 0.381) (layers *.Cu *.Mask)
      (net 193 GND))
  )
  (module hackrf:GSG-HOLE126MIL-COPPER (layer C1F) (tedit 528F8568)
    (at 126 104)
    (fp_text reference J8 (at 0 0) (layer F.SilkS) hide)
    (fp_text value MOUNTING_HOLE (at 0 0) (layer F.SilkS) hide)
    (pad 1 thru_hole circle (at 0 0) (size 5.6 5.6) (drill 3.2004) (layers *.Cu *.Mask)
      (net 193 GND))
    (pad 1 thru_hole circle (at 0 -2.2) (size 0.6 0.6) (drill 0.381) (layers *.Cu *.Mask)
      (net 193 GND))
    (pad 1 thru_hole circle (at -2.2 0) (size 0.6 0.6) (drill 0.381) (layers *.Cu *.Mask)
      (net 193 GND))
    (pad 1 thru_hole circle (at 0 2.2) (size 0.6 0.6) (drill 0.381) (layers *.Cu *.Mask)
      (net 193 GND))
    (pad 1 thru_hole circle (at 2.2 0) (size 0.6 0.6) (drill 0.381) (layers *.Cu *.Mask)
      (net 193 GND))
    (pad 1 thru_hole circle (at 1.55 -1.55) (size 0.6 0.6) (drill 0.381) (layers *.Cu *.Mask)
      (net 193 GND))
    (pad 1 thru_hole circle (at -1.55 -1.55) (size 0.6 0.6) (drill 0.381) (layers *.Cu *.Mask)
      (net 193 GND))
    (pad 1 thru_hole circle (at -1.55 1.55) (size 0.6 0.6) (drill 0.381) (layers *.Cu *.Mask)
      (net 193 GND))
    (pad 1 thru_hole circle (at 1.55 1.55) (size 0.6 0.6) (drill 0.381) (layers *.Cu *.Mask)
      (net 193 GND))
  )
  (module hackrf:GSG-HOLE126MIL-COPPER (layer C1F) (tedit 528F8568)
    (at 131 144)
    (fp_text reference J9 (at 0 0) (layer F.SilkS) hide)
    (fp_text value MOUNTING_HOLE (at 0 0) (layer F.SilkS) hide)
    (pad 1 thru_hole circle (at 0 0) (size 5.6 5.6) (drill 3.2004) (layers *.Cu *.Mask)
      (net 193 GND))
    (pad 1 thru_hole circle (at 0 -2.2) (size 0.6 0.6) (drill 0.381) (layers *.Cu *.Mask)
      (net 193 GND))
    (pad 1 thru_hole circle (at -2.2 0) (size 0.6 0.6) (drill 0.381) (layers *.Cu *.Mask)
      (net 193 GND))
    (pad 1 thru_hole circle (at 0 2.2) (size 0.6 0.6) (drill 0.381) (layers *.Cu *.Mask)
      (net 193 GND))
    (pad 1 thru_hole circle (at 2.2 0) (size 0.6 0.6) (drill 0.381) (layers *.Cu *.Mask)
      (net 193 GND))
    (pad 1 thru_hole circle (at 1.55 -1.55) (size 0.6 0.6) (drill 0.381) (layers *.Cu *.Mask)
      (net 193 GND))
    (pad 1 thru_hole circle (at -1.55 -1.55) (size 0.6 0.6) (drill 0.381) (layers *.Cu *.Mask)
      (net 193 GND))
    (pad 1 thru_hole circle (at -1.55 1.55) (size 0.6 0.6) (drill 0.381) (layers *.Cu *.Mask)
      (net 193 GND))
    (pad 1 thru_hole circle (at 1.55 1.55) (size 0.6 0.6) (drill 0.381) (layers *.Cu *.Mask)
      (net 193 GND))
  )
  (module hackrf:GSG-TEST-POINT-S1751-46R (layer C1F) (tedit 5293E03C)
    (at 114 129.5 270)
    (fp_text reference J10 (at 0 0 270) (layer F.SilkS))
    (fp_text value GND_CLIP (at 0 0 270) (layer F.SilkS) hide)
    (pad 1 smd rect (at 0 0 270) (size 3.65 2.05) (layers C1F F.Paste F.Mask)
      (net 193 GND))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 95.1604 162.3356)
    (solder_mask_margin 0.1016)
    (fp_text reference L1 (at 0 0.0508) (layer F.SilkS))
    (fp_text value DNP (at 0 0.0508) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 298 "Net-(L1-Pad2)") (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 299 "Net-(L1-Pad1)") (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0603 (layer C1F) (tedit 4CFF2E39)
    (at 98.691 159.7956 270)
    (solder_mask_margin 0.1016)
    (fp_text reference L2 (at 0 0 270) (layer F.SilkS))
    (fp_text value 10uH (at 0 0 270) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.762 0 270) (size 0.8636 0.8636) (layers C1F F.Paste F.Mask)
      (net 220 VAA) (die_length 0.57404) (solder_mask_margin 0.1016) (clearance 0.1778))
    (pad 1 smd rect (at -0.762 0 270) (size 0.8636 0.8636) (layers C1F F.Paste F.Mask)
      (net 300 "Net-(L2-Pad1)") (die_length -2147.483648) (solder_mask_margin 0.1016) (clearance 0.1778))
  )
  (module hackrf:GSG-0603 (layer C1F) (tedit 4CFF2E39)
    (at 98.691 156.7476 90)
    (solder_mask_margin 0.1016)
    (fp_text reference L3 (at 0 0 90) (layer F.SilkS))
    (fp_text value 10uH (at 0 0 90) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.762 0 90) (size 0.8636 0.8636) (layers C1F F.Paste F.Mask)
      (net 220 VAA) (die_length 0.57404) (solder_mask_margin 0.1016) (clearance 0.1778))
    (pad 1 smd rect (at -0.762 0 90) (size 0.8636 0.8636) (layers C1F F.Paste F.Mask)
      (net 301 "Net-(L3-Pad1)") (die_length -2147.483648) (solder_mask_margin 0.1016) (clearance 0.1778))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 97.421 158.2716 270)
    (solder_mask_margin 0.1016)
    (fp_text reference L4 (at 0 0.0508 270) (layer F.SilkS))
    (fp_text value DNP (at 0 0.0508 270) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 300 "Net-(L2-Pad1)") (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 301 "Net-(L3-Pad1)") (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0603 (layer C1F) (tedit 4CFF2E39)
    (at 73.138 152.92)
    (solder_mask_margin 0.1016)
    (fp_text reference L5 (at 0 0) (layer F.SilkS))
    (fp_text value 10uH (at 0 0) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.762 0) (size 0.8636 0.8636) (layers C1F F.Paste F.Mask)
      (net 260 "Net-(C50-Pad1)") (die_length 0.57404) (solder_mask_margin 0.1016) (clearance 0.1778))
    (pad 1 smd rect (at -0.762 0) (size 0.8636 0.8636) (layers C1F F.Paste F.Mask)
      (net 263 "Net-(C163-Pad2)") (die_length -2147.483648) (solder_mask_margin 0.1016) (clearance 0.1778))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 107.5055 150.0251)
    (solder_mask_margin 0.1016)
    (fp_text reference L6 (at 0 0.0508) (layer F.SilkS))
    (fp_text value DNP (at 0 0.0508) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 274 "Net-(C102-Pad2)") (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 272 "Net-(C99-Pad2)") (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 107.5055 146.9771)
    (solder_mask_margin 0.1016)
    (fp_text reference L7 (at 0 0.0508) (layer F.SilkS))
    (fp_text value 6.2nH (at 0 0.0508) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 275 "Net-(C102-Pad1)") (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 273 "Net-(C99-Pad1)") (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 110.5535 150.0251)
    (solder_mask_margin 0.1016)
    (fp_text reference L8 (at 0 0.0508) (layer F.SilkS))
    (fp_text value DNP (at 0 0.0508) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 280 "Net-(C111-Pad2)") (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 276 "Net-(C104-Pad2)") (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 110.5535 146.9771)
    (solder_mask_margin 0.1016)
    (fp_text reference L9 (at 0 0.0508) (layer F.SilkS))
    (fp_text value DNP (at 0 0.0508) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 281 "Net-(C111-Pad1)") (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 277 "Net-(C104-Pad1)") (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-NRG4026 (layer C1F) (tedit 4F8A5596)
    (at 165.212 115.7612 270)
    (fp_text reference L10 (at 0 0 270) (layer F.SilkS))
    (fp_text value 4u7 (at 0 0 270) (layer F.SilkS) hide)
    (pad 1 smd rect (at -1.39954 0 270) (size 1.19888 3.70078) (layers C1F F.Paste F.Mask)
      (net 302 "Net-(L10-Pad1)") (die_length -2147.483648))
    (pad 2 smd rect (at 1.39954 0 270) (size 1.19888 3.70078) (layers C1F F.Paste F.Mask)
      (net 116 /mcu/usb/power/REG_OUT2) (die_length -2147.483648))
  )
  (module hackrf:GSG-NRG4026 (layer C1F) (tedit 4F8A5596)
    (at 165.212 108.1412 270)
    (fp_text reference L11 (at 0 0 270) (layer F.SilkS))
    (fp_text value 4u7 (at 0 0 270) (layer F.SilkS) hide)
    (pad 1 smd rect (at -1.39954 0 270) (size 1.19888 3.70078) (layers C1F F.Paste F.Mask)
      (net 115 /mcu/usb/power/REG_OUT1) (die_length -2147.483648))
    (pad 2 smd rect (at 1.39954 0 270) (size 1.19888 3.70078) (layers C1F F.Paste F.Mask)
      (net 303 "Net-(L11-Pad2)") (die_length -2147.483648))
  )
  (module hackrf:GSG-0603 (layer C1F) (tedit 4CFF2E39)
    (at 77.329 160.921 90)
    (solder_mask_margin 0.1016)
    (fp_text reference L12 (at 0 0 90) (layer F.SilkS))
    (fp_text value 10uH (at 0 0 90) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.762 0 90) (size 0.8636 0.8636) (layers C1F F.Paste F.Mask)
      (net 269 "Net-(C62-Pad2)") (die_length 0.57404) (solder_mask_margin 0.1016) (clearance 0.1778))
    (pad 1 smd rect (at -0.762 0 90) (size 0.8636 0.8636) (layers C1F F.Paste F.Mask)
      (net 285 "Net-(C160-Pad1)") (die_length -2147.483648) (solder_mask_margin 0.1016) (clearance 0.1778))
  )
  (module hackrf:GSG-0603 (layer C1F) (tedit 4CFF2E39)
    (at 69.4 161.8 90)
    (solder_mask_margin 0.1016)
    (fp_text reference L13 (at 0 0 90) (layer F.SilkS))
    (fp_text value 10uH (at 0 0 90) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.762 0 90) (size 0.8636 0.8636) (layers C1F F.Paste F.Mask)
      (net 270 "Net-(C64-Pad2)") (die_length 0.57404) (solder_mask_margin 0.1016) (clearance 0.1778))
    (pad 1 smd rect (at -0.762 0 90) (size 0.8636 0.8636) (layers C1F F.Paste F.Mask)
      (net 304 "Net-(L13-Pad1)") (die_length -2147.483648) (solder_mask_margin 0.1016) (clearance 0.1778))
  )
  (module hackrf:GSG-HEADER-1x2 (layer C1F) (tedit 4F8A5E8A)
    (at 146.36 112.77)
    (tags CONN)
    (fp_text reference P1 (at 0 0) (layer F.SilkS))
    (fp_text value 1V8 (at 0 0) (layer F.SilkS) hide)
    (pad 1 thru_hole rect (at -1.27 0) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 5 +1.8V) (die_length 0.08382))
    (pad 2 thru_hole circle (at 1.27 0) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 116 /mcu/usb/power/REG_OUT2) (die_length 0.06096))
  )
  (module hackrf:GSG-SMA-73251-2120 (layer C1F) (tedit 52DD8040)
    (at 178.98 145 180)
    (fp_text reference P2 (at 1.99898 0 180) (layer F.SilkS))
    (fp_text value CLKOUT (at 1.99898 4.0005 180) (layer F.SilkS) hide)
    (pad 1 smd rect (at 2.095 0 180) (size 4.19 1.78) (layers C1F F.Mask)
      (net 170 CLKOUT) (die_length -2147.483648))
    (pad 2 smd rect (at 2.095 -3.4925 180) (size 4.19 2.665) (layers C1F F.Mask)
      (net 193 GND))
    (pad 2 smd rect (at 2.095 3.4925 180) (size 4.19 2.665) (layers C1F F.Mask)
      (net 193 GND) (die_length 509.13792))
    (pad 2 smd rect (at 2.095 -3.4925 180) (size 4.19 2.665) (layers C4B B.Mask)
      (net 193 GND))
    (pad 2 smd rect (at 2.095 3.4925 180) (size 4.19 2.665) (layers C4B B.Mask)
      (net 193 GND) (die_length 483.12832))
    (pad 2 thru_hole circle (at 3.5 2.5 180) (size 0.6 0.6) (drill 0.381) (layers *.Cu)
      (net 193 GND))
    (pad 2 thru_hole circle (at 3.5 3.5 180) (size 0.6 0.6) (drill 0.381) (layers *.Cu)
      (net 193 GND))
    (pad 2 thru_hole circle (at 3.5 4.5 180) (size 0.6 0.6) (drill 0.381) (layers *.Cu)
      (net 193 GND))
    (pad 2 thru_hole circle (at 2.5 2.5 180) (size 0.6 0.6) (drill 0.381) (layers *.Cu)
      (net 193 GND))
    (pad 2 thru_hole circle (at 2.5 3.5 180) (size 0.6 0.6) (drill 0.381) (layers *.Cu)
      (net 193 GND))
    (pad 2 thru_hole circle (at 2.5 4.5 180) (size 0.6 0.6) (drill 0.381) (layers *.Cu)
      (net 193 GND))
    (pad 2 thru_hole circle (at 1.5 2.5 180) (size 0.6 0.6) (drill 0.381) (layers *.Cu)
      (net 193 GND))
    (pad 2 thru_hole circle (at 1.5 3.5 180) (size 0.6 0.6) (drill 0.381) (layers *.Cu)
      (net 193 GND))
    (pad 2 thru_hole circle (at 1.5 4.5 180) (size 0.6 0.6) (drill 0.381) (layers *.Cu)
      (net 193 GND))
    (pad 2 thru_hole circle (at 3.5 -2.5 180) (size 0.6 0.6) (drill 0.381) (layers *.Cu)
      (net 193 GND))
    (pad 2 thru_hole circle (at 3.5 -3.5 180) (size 0.6 0.6) (drill 0.381) (layers *.Cu)
      (net 193 GND))
    (pad 2 thru_hole circle (at 3.5 -4.5 180) (size 0.6 0.6) (drill 0.381) (layers *.Cu)
      (net 193 GND))
    (pad 2 thru_hole circle (at 2.5 -2.5 180) (size 0.6 0.6) (drill 0.381) (layers *.Cu)
      (net 193 GND))
    (pad 2 thru_hole circle (at 2.5 -3.5 180) (size 0.6 0.6) (drill 0.381) (layers *.Cu)
      (net 193 GND))
    (pad 2 thru_hole circle (at 2.5 -4.5 180) (size 0.6 0.6) (drill 0.381) (layers *.Cu)
      (net 193 GND))
    (pad 2 thru_hole circle (at 1.5 -2.5 180) (size 0.6 0.6) (drill 0.381) (layers *.Cu)
      (net 193 GND))
    (pad 2 thru_hole circle (at 1.5 -3.5 180) (size 0.6 0.6) (drill 0.381) (layers *.Cu)
      (net 193 GND))
    (pad 2 thru_hole circle (at 1.5 -4.5 180) (size 0.6 0.6) (drill 0.381) (layers *.Cu)
      (net 193 GND))
  )
  (module hackrf:GSG-HEADER-NOMARK-1x2 (layer C1F) (tedit 5281A360)
    (at 145.09 119.12 270)
    (tags CONN)
    (fp_text reference P3 (at 0 0 270) (layer F.SilkS))
    (fp_text value GND (at 0 0 270) (layer F.SilkS) hide)
    (pad 1 thru_hole rect (at -1.27 0 270) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 193 GND) (die_length 0.08382))
    (pad 2 thru_hole circle (at 1.27 0 270) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 193 GND) (die_length 0.06096))
  )
  (module hackrf:GSG-SMA-73251-2120 (layer C1F) (tedit 52DD8040)
    (at 61.02 161)
    (fp_text reference P4 (at 1.99898 0) (layer F.SilkS))
    (fp_text value ANTENNA (at 1.99898 4.0005) (layer F.SilkS) hide)
    (pad 1 smd rect (at 2.095 0) (size 4.19 1.78) (layers C1F F.Mask)
      (net 270 "Net-(C64-Pad2)") (die_length -2147.483648))
    (pad 2 smd rect (at 2.095 -3.4925) (size 4.19 2.665) (layers C1F F.Mask)
      (net 193 GND))
    (pad 2 smd rect (at 2.095 3.4925) (size 4.19 2.665) (layers C1F F.Mask)
      (net 193 GND) (die_length 509.13792))
    (pad 2 smd rect (at 2.095 -3.4925) (size 4.19 2.665) (layers C4B B.Mask)
      (net 193 GND))
    (pad 2 smd rect (at 2.095 3.4925) (size 4.19 2.665) (layers C4B B.Mask)
      (net 193 GND) (die_length 483.12832))
    (pad 2 thru_hole circle (at 3.5 2.5) (size 0.6 0.6) (drill 0.381) (layers *.Cu)
      (net 193 GND))
    (pad 2 thru_hole circle (at 3.5 3.5) (size 0.6 0.6) (drill 0.381) (layers *.Cu)
      (net 193 GND))
    (pad 2 thru_hole circle (at 3.5 4.5) (size 0.6 0.6) (drill 0.381) (layers *.Cu)
      (net 193 GND))
    (pad 2 thru_hole circle (at 2.5 2.5) (size 0.6 0.6) (drill 0.381) (layers *.Cu)
      (net 193 GND))
    (pad 2 thru_hole circle (at 2.5 3.5) (size 0.6 0.6) (drill 0.381) (layers *.Cu)
      (net 193 GND))
    (pad 2 thru_hole circle (at 2.5 4.5) (size 0.6 0.6) (drill 0.381) (layers *.Cu)
      (net 193 GND))
    (pad 2 thru_hole circle (at 1.5 2.5) (size 0.6 0.6) (drill 0.381) (layers *.Cu)
      (net 193 GND))
    (pad 2 thru_hole circle (at 1.5 3.5) (size 0.6 0.6) (drill 0.381) (layers *.Cu)
      (net 193 GND))
    (pad 2 thru_hole circle (at 1.5 4.5) (size 0.6 0.6) (drill 0.381) (layers *.Cu)
      (net 193 GND))
    (pad 2 thru_hole circle (at 3.5 -2.5) (size 0.6 0.6) (drill 0.381) (layers *.Cu)
      (net 193 GND))
    (pad 2 thru_hole circle (at 3.5 -3.5) (size 0.6 0.6) (drill 0.381) (layers *.Cu)
      (net 193 GND))
    (pad 2 thru_hole circle (at 3.5 -4.5) (size 0.6 0.6) (drill 0.381) (layers *.Cu)
      (net 193 GND))
    (pad 2 thru_hole circle (at 2.5 -2.5) (size 0.6 0.6) (drill 0.381) (layers *.Cu)
      (net 193 GND))
    (pad 2 thru_hole circle (at 2.5 -3.5) (size 0.6 0.6) (drill 0.381) (layers *.Cu)
      (net 193 GND))
    (pad 2 thru_hole circle (at 2.5 -4.5) (size 0.6 0.6) (drill 0.381) (layers *.Cu)
      (net 193 GND))
    (pad 2 thru_hole circle (at 1.5 -2.5) (size 0.6 0.6) (drill 0.381) (layers *.Cu)
      (net 193 GND))
    (pad 2 thru_hole circle (at 1.5 -3.5) (size 0.6 0.6) (drill 0.381) (layers *.Cu)
      (net 193 GND))
    (pad 2 thru_hole circle (at 1.5 -4.5) (size 0.6 0.6) (drill 0.381) (layers *.Cu)
      (net 193 GND))
  )
  (module hackrf:GSG-HEADER-2x3 (layer C1F) (tedit 4F8A5FD1)
    (at 89.21 106.42 180)
    (tags CONN)
    (fp_text reference P5 (at 0 0 180) (layer F.SilkS))
    (fp_text value LEDS (at 0 0 180) (layer F.SilkS) hide)
    (pad 1 thru_hole rect (at -2.54 1.27 180) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 193 GND) (die_length 0.08382))
    (pad 2 thru_hole circle (at -2.54 -1.27 180) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 221 VCC) (die_length -2147.483648))
    (pad 3 thru_hole circle (at 0 1.27 180) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 107 /mcu/usb/power/LED1) (die_length 0.06096))
    (pad 4 thru_hole circle (at 0 -1.27 180) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 108 /mcu/usb/power/LED2) (die_length -2147.483648))
    (pad 5 thru_hole circle (at 2.54 1.27 180) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 4 !VAA_ENABLE) (die_length 0.12192))
    (pad 6 thru_hole circle (at 2.54 -1.27 180) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 109 /mcu/usb/power/LED3) (die_length 0.12192))
  )
  (module hackrf:GSG-TESTPOINT-50MIL (layer C1F) (tedit 50997FDC)
    (at 97.155 160.0708)
    (fp_text reference P6 (at 0 0) (layer F.SilkS))
    (fp_text value GPO4 (at 0 0) (layer F.SilkS) hide)
    (pad 1 smd circle (at 0 0) (size 1.27 1.27) (layers C1F F.Mask)
      (net 305 "Net-(P6-Pad1)") (die_length 0.1651))
  )
  (module hackrf:GSG-TESTPOINT-50MIL (layer C1F) (tedit 50997FDC)
    (at 88.7222 161.163)
    (fp_text reference P7 (at 0 0) (layer F.SilkS))
    (fp_text value GPO2 (at 0 0) (layer F.SilkS) hide)
    (pad 1 smd circle (at 0 0) (size 1.27 1.27) (layers C1F F.Mask)
      (net 306 "Net-(P7-Pad1)") (die_length 0.1651))
  )
  (module hackrf:GSG-HEADER-1x2 (layer C1F) (tedit 4F8A5E8A)
    (at 159.06 112.77)
    (tags CONN)
    (fp_text reference P8 (at 0 0) (layer F.SilkS))
    (fp_text value VCC (at 0 0) (layer F.SilkS) hide)
    (pad 1 thru_hole rect (at -1.27 0) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 221 VCC) (die_length 0.08382))
    (pad 2 thru_hole circle (at 1.27 0) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 115 /mcu/usb/power/REG_OUT1) (die_length 0.06096))
  )
  (module hackrf:GSG-HEADER-2x8 (layer C1F) (tedit 4F8A6071)
    (at 98.1 129.28 180)
    (tags CONN)
    (fp_text reference P9 (at 0 0 180) (layer F.SilkS))
    (fp_text value BASEBAND (at 0 0 180) (layer F.SilkS) hide)
    (pad 1 thru_hole rect (at -8.89 1.27 180) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 193 GND) (die_length 0.08382))
    (pad 2 thru_hole circle (at -8.89 -1.27 180) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 193 GND) (die_length -2147.483648))
    (pad 3 thru_hole circle (at -6.35 1.27 180) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 193 GND) (die_length 0.06096))
    (pad 4 thru_hole circle (at -6.35 -1.27 180) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 29 /baseband/RXBBQ-) (die_length -2147.483648))
    (pad 5 thru_hole circle (at -3.81 1.27 180) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 27 /baseband/RXBBI-) (die_length 0.12192))
    (pad 6 thru_hole circle (at -3.81 -1.27 180) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 28 /baseband/RXBBQ+) (die_length 0.12192))
    (pad 7 thru_hole circle (at -1.27 1.27 180) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 26 /baseband/RXBBI+) (die_length 0.12192))
    (pad 8 thru_hole circle (at -1.27 -1.27 180) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 193 GND) (die_length 0.08382))
    (pad 9 thru_hole circle (at 1.27 1.27 180) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 193 GND) (die_length -2147.483648))
    (pad 10 thru_hole circle (at 1.27 -1.27 180) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 31 /baseband/TXBBI-) (die_length 0.24638))
    (pad 11 thru_hole circle (at 3.81 1.27 180) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 32 /baseband/TXBBQ+) (die_length -2147.483648))
    (pad 12 thru_hole circle (at 3.81 -1.27 180) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 30 /baseband/TXBBI+) (die_length -2147.483648))
    (pad 13 thru_hole circle (at 6.35 1.27 180) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 33 /baseband/TXBBQ-) (die_length 0.10668))
    (pad 14 thru_hole circle (at 6.35 -1.27 180) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 193 GND) (die_length 0.04318))
    (pad 15 thru_hole circle (at 8.89 1.27 180) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 193 GND) (die_length 0.02286))
    (pad 16 thru_hole circle (at 8.89 -1.27 180) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 193 GND) (die_length 0.25146))
  )
  (module hackrf:GSG-TESTPOINT-50MIL (layer C1F) (tedit 50997FDC)
    (at 87.7622 159.1758)
    (fp_text reference P13 (at 0 0) (layer F.SilkS))
    (fp_text value GPO1 (at 0 0) (layer F.SilkS) hide)
    (pad 1 smd circle (at 0 0) (size 1.27 1.27) (layers C1F F.Mask)
      (net 38 /frontend/!ANT_BIAS) (die_length 0.1651))
  )
  (module hackrf:GSG-TESTPOINT-50MIL (layer C1F) (tedit 50997FDC)
    (at 114.991 143.7072 90)
    (fp_text reference P14 (at 0 0 90) (layer F.SilkS))
    (fp_text value XCVR_CLKOUT (at 0 0 90) (layer F.SilkS) hide)
    (pad 1 smd circle (at 0 0 90) (size 1.27 1.27) (layers C1F F.Mask)
      (net 36 /baseband/XCVR_CLKOUT) (die_length 0.1651))
  )
  (module hackrf:GSG-TESTPOINT-50MIL (layer C1F) (tedit 50997FDC)
    (at 130.175 169.2402 90)
    (fp_text reference P15 (at 0 0 90) (layer F.SilkS))
    (fp_text value INTR (at 0 0 90) (layer F.SilkS) hide)
    (pad 1 smd circle (at 0 0 90) (size 1.27 1.27) (layers C1F F.Mask)
      (net 18 /baseband/INTR) (die_length 0.1651))
  )
  (module hackrf:GSG-SMA-73251-2120 (layer C1F) (tedit 52DD8040)
    (at 178.98 163 180)
    (fp_text reference P16 (at 1.99898 0 180) (layer F.SilkS))
    (fp_text value CLKIN (at 1.99898 4.0005 180) (layer F.SilkS) hide)
    (pad 1 smd rect (at 2.095 0 180) (size 4.19 1.78) (layers C1F F.Mask)
      (net 169 CLKIN) (die_length -2147.483648))
    (pad 2 smd rect (at 2.095 -3.4925 180) (size 4.19 2.665) (layers C1F F.Mask)
      (net 193 GND))
    (pad 2 smd rect (at 2.095 3.4925 180) (size 4.19 2.665) (layers C1F F.Mask)
      (net 193 GND) (die_length 509.13792))
    (pad 2 smd rect (at 2.095 -3.4925 180) (size 4.19 2.665) (layers C4B B.Mask)
      (net 193 GND))
    (pad 2 smd rect (at 2.095 3.4925 180) (size 4.19 2.665) (layers C4B B.Mask)
      (net 193 GND) (die_length 483.12832))
    (pad 2 thru_hole circle (at 3.5 2.5 180) (size 0.6 0.6) (drill 0.381) (layers *.Cu)
      (net 193 GND))
    (pad 2 thru_hole circle (at 3.5 3.5 180) (size 0.6 0.6) (drill 0.381) (layers *.Cu)
      (net 193 GND))
    (pad 2 thru_hole circle (at 3.5 4.5 180) (size 0.6 0.6) (drill 0.381) (layers *.Cu)
      (net 193 GND))
    (pad 2 thru_hole circle (at 2.5 2.5 180) (size 0.6 0.6) (drill 0.381) (layers *.Cu)
      (net 193 GND))
    (pad 2 thru_hole circle (at 2.5 3.5 180) (size 0.6 0.6) (drill 0.381) (layers *.Cu)
      (net 193 GND))
    (pad 2 thru_hole circle (at 2.5 4.5 180) (size 0.6 0.6) (drill 0.381) (layers *.Cu)
      (net 193 GND))
    (pad 2 thru_hole circle (at 1.5 2.5 180) (size 0.6 0.6) (drill 0.381) (layers *.Cu)
      (net 193 GND))
    (pad 2 thru_hole circle (at 1.5 3.5 180) (size 0.6 0.6) (drill 0.381) (layers *.Cu)
      (net 193 GND))
    (pad 2 thru_hole circle (at 1.5 4.5 180) (size 0.6 0.6) (drill 0.381) (layers *.Cu)
      (net 193 GND))
    (pad 2 thru_hole circle (at 3.5 -2.5 180) (size 0.6 0.6) (drill 0.381) (layers *.Cu)
      (net 193 GND))
    (pad 2 thru_hole circle (at 3.5 -3.5 180) (size 0.6 0.6) (drill 0.381) (layers *.Cu)
      (net 193 GND))
    (pad 2 thru_hole circle (at 3.5 -4.5 180) (size 0.6 0.6) (drill 0.381) (layers *.Cu)
      (net 193 GND))
    (pad 2 thru_hole circle (at 2.5 -2.5 180) (size 0.6 0.6) (drill 0.381) (layers *.Cu)
      (net 193 GND))
    (pad 2 thru_hole circle (at 2.5 -3.5 180) (size 0.6 0.6) (drill 0.381) (layers *.Cu)
      (net 193 GND))
    (pad 2 thru_hole circle (at 2.5 -4.5 180) (size 0.6 0.6) (drill 0.381) (layers *.Cu)
      (net 193 GND))
    (pad 2 thru_hole circle (at 1.5 -2.5 180) (size 0.6 0.6) (drill 0.381) (layers *.Cu)
      (net 193 GND))
    (pad 2 thru_hole circle (at 1.5 -3.5 180) (size 0.6 0.6) (drill 0.381) (layers *.Cu)
      (net 193 GND))
    (pad 2 thru_hole circle (at 1.5 -4.5 180) (size 0.6 0.6) (drill 0.381) (layers *.Cu)
      (net 193 GND))
  )
  (module hackrf:GSG-TESTPOINT-50MIL (layer C1F) (tedit 50997FDC)
    (at 87.2796 155.696)
    (fp_text reference P17 (at 0 0) (layer F.SilkS))
    (fp_text value GPO6 (at 0 0) (layer F.SilkS) hide)
    (pad 1 smd circle (at 0 0) (size 1.27 1.27) (layers C1F F.Mask)
      (net 307 "Net-(P17-Pad1)") (die_length 0.1651))
  )
  (module hackrf:GSG-TESTPOINT-50MIL (layer C1F) (tedit 50997FDC)
    (at 133.35 165.1 180)
    (fp_text reference P18 (at 0 0 180) (layer F.SilkS))
    (fp_text value OEB (at 0 0 180) (layer F.SilkS) hide)
    (pad 1 smd circle (at 0 0 180) (size 1.27 1.27) (layers C1F F.Mask)
      (net 19 /baseband/OEB) (die_length 0.1651))
  )
  (module hackrf:GSG-TESTPOINT-50MIL (layer C1F) (tedit 50997FDC)
    (at 96.8554 161.665)
    (fp_text reference P19 (at 0 0) (layer F.SilkS))
    (fp_text value GPO3 (at 0 0) (layer F.SilkS) hide)
    (pad 1 smd circle (at 0 0) (size 1.27 1.27) (layers C1F F.Mask)
      (net 308 "Net-(P19-Pad1)") (die_length 0.1651))
  )
  (module hackrf:GSG-HEADER-2x11 (layer C1F) (tedit 52878E74)
    (at 171.76 143.25 90)
    (tags CONN)
    (fp_text reference P20 (at 0 0 90) (layer F.SilkS))
    (fp_text value GPIO (at 0 0 90) (layer F.SilkS) hide)
    (pad 1 thru_hole rect (at -12.7 1.27 90) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 159 /mcu/usb/power/VBAT) (die_length 0.08382))
    (pad 2 thru_hole circle (at -12.7 -1.27 90) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 121 /mcu/usb/power/RTC_ALARM) (die_length -2147.483648))
    (pad 3 thru_hole circle (at -10.16 1.27 90) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 221 VCC) (die_length 0.06096))
    (pad 4 thru_hole circle (at -10.16 -1.27 90) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 164 /mcu/usb/power/WAKEUP) (die_length -2147.483648))
    (pad 5 thru_hole circle (at -7.62 1.27 90) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 95 /mcu/usb/power/GPIO3_8) (die_length 0.12192))
    (pad 6 thru_hole circle (at -7.62 -1.27 90) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 96 /mcu/usb/power/GPIO3_9) (die_length 0.12192))
    (pad 7 thru_hole circle (at -5.08 1.27 90) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 89 /mcu/usb/power/GPIO3_10) (die_length 0.12192))
    (pad 8 thru_hole circle (at -5.08 -1.27 90) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 90 /mcu/usb/power/GPIO3_11) (die_length 0.08382))
    (pad 9 thru_hole circle (at -2.54 1.27 90) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 91 /mcu/usb/power/GPIO3_12) (die_length -2147.483648))
    (pad 10 thru_hole circle (at -2.54 -1.27 90) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 92 /mcu/usb/power/GPIO3_13) (die_length 0.24638))
    (pad 11 thru_hole circle (at 0 1.27 90) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 93 /mcu/usb/power/GPIO3_14) (die_length -2147.483648))
    (pad 12 thru_hole circle (at 0 -1.27 90) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 94 /mcu/usb/power/GPIO3_15) (die_length -2147.483648))
    (pad 13 thru_hole circle (at 2.54 1.27 90) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 193 GND) (die_length 0.10668))
    (pad 14 thru_hole circle (at 2.54 -1.27 90) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 46 /mcu/usb/power/ADC0_6) (die_length 0.04318))
    (pad 15 thru_hole circle (at 5.08 1.27 90) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 193 GND) (die_length 0.02286))
    (pad 16 thru_hole circle (at 5.08 -1.27 90) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 44 /mcu/usb/power/ADC0_2) (die_length 0.25146))
    (pad 17 thru_hole circle (at 7.62 1.27 90) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 161 /mcu/usb/power/VBUSCTRL) (die_length -2147.483648))
    (pad 18 thru_hole circle (at 7.62 -1.27 90) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 45 /mcu/usb/power/ADC0_5) (die_length -2147.483648))
    (pad 19 thru_hole circle (at 10.16 1.27 90) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 193 GND) (die_length 0.08382))
    (pad 20 thru_hole circle (at 10.16 -1.27 90) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 43 /mcu/usb/power/ADC0_0) (die_length 0.08382))
    (pad 21 thru_hole circle (at 12.7 1.27 90) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 160 /mcu/usb/power/VBUS) (die_length -2147.483648))
    (pad 22 thru_hole circle (at 12.7 -1.27 90) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 162 /mcu/usb/power/VIN) (die_length 0.08382))
  )
  (module hackrf:GSG-TESTPOINT-50MIL (layer C1F) (tedit 50997FDC)
    (at 87.3304 157.4486)
    (fp_text reference P21 (at 0 0) (layer F.SilkS))
    (fp_text value REF_IN (at 0 0) (layer F.SilkS) hide)
    (pad 1 smd circle (at 0 0) (size 1.27 1.27) (layers C1F F.Mask)
      (net 39 /frontend/REF_IN) (die_length 0.1651))
  )
  (module hackrf:GSG-HEADER-2x13 (layer C1F) (tedit 527F1853)
    (at 152.71 164.84 180)
    (tags CONN)
    (fp_text reference P22 (at 0 0 180) (layer F.SilkS))
    (fp_text value I2S (at 0 0 180) (layer F.SilkS) hide)
    (pad 1 thru_hole rect (at -15.24 1.27 180) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 170 CLKOUT) (die_length 0.08382))
    (pad 2 thru_hole circle (at -15.24 -1.27 180) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 169 CLKIN) (die_length -2147.483648))
    (pad 3 thru_hole circle (at -12.7 1.27 180) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 117 /mcu/usb/power/RESET) (die_length 0.06096))
    (pad 4 thru_hole circle (at -12.7 -1.27 180) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 193 GND) (die_length -2147.483648))
    (pad 5 thru_hole circle (at -10.16 1.27 180) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 98 /mcu/usb/power/I2C1_SCL) (die_length 0.12192))
    (pad 6 thru_hole circle (at -10.16 -1.27 180) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 99 /mcu/usb/power/I2C1_SDA) (die_length 0.12192))
    (pad 7 thru_hole circle (at -7.62 1.27 180) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 147 /mcu/usb/power/SPIFI_MISO) (die_length 0.12192))
    (pad 8 thru_hole circle (at -7.62 -1.27 180) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 149 /mcu/usb/power/SPIFI_SCK) (die_length 0.08382))
    (pad 9 thru_hole circle (at -5.08 1.27 180) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 148 /mcu/usb/power/SPIFI_MOSI) (die_length -2147.483648))
    (pad 10 thru_hole circle (at -5.08 -1.27 180) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 193 GND) (die_length 0.24638))
    (pad 11 thru_hole circle (at -2.54 1.27 180) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 221 VCC) (die_length -2147.483648))
    (pad 12 thru_hole circle (at -2.54 -1.27 180) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 101 /mcu/usb/power/I2S0_RX_SCK) (die_length -2147.483648))
    (pad 13 thru_hole circle (at 0 1.27 180) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 102 /mcu/usb/power/I2S0_RX_SDA) (die_length 0.10668))
    (pad 14 thru_hole circle (at 0 -1.27 180) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 100 /mcu/usb/power/I2S0_RX_MCLK) (die_length 0.04318))
    (pad 15 thru_hole circle (at 2.54 1.27 180) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 103 /mcu/usb/power/I2S0_RX_WS) (die_length 0.02286))
    (pad 16 thru_hole circle (at 2.54 -1.27 180) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 105 /mcu/usb/power/I2S0_TX_SCK) (die_length 0.25146))
    (pad 17 thru_hole circle (at 5.08 1.27 180) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 104 /mcu/usb/power/I2S0_TX_MCLK) (die_length -2147.483648))
    (pad 18 thru_hole circle (at 5.08 -1.27 180) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 193 GND) (die_length -2147.483648))
    (pad 19 thru_hole circle (at 7.62 1.27 180) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 156 /mcu/usb/power/U0_RXD) (die_length 0.08382))
    (pad 20 thru_hole circle (at 7.62 -1.27 180) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 157 /mcu/usb/power/U0_TXD) (die_length 0.08382))
    (pad 21 thru_hole circle (at 10.16 1.27 180) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 114 /mcu/usb/power/P2_9) (die_length -2147.483648))
    (pad 22 thru_hole circle (at 10.16 -1.27 180) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 112 /mcu/usb/power/P2_13) (die_length 0.08382))
    (pad 23 thru_hole circle (at 12.7 1.27 180) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 113 /mcu/usb/power/P2_8) (die_length -2147.483648))
    (pad 24 thru_hole circle (at 12.7 -1.27 180) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 210 SDA) (die_length -2147.483648))
    (pad 25 thru_hole circle (at 15.24 1.27 180) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 168 CLK6))
    (pad 26 thru_hole circle (at 15.24 -1.27 180) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 209 SCL))
  )
  (module hackrf:GSG-TESTPOINT-50MIL (layer C1F) (tedit 50997FDC)
    (at 155.7326 123.2602 315)
    (fp_text reference P23 (at 0 0 315) (layer F.SilkS))
    (fp_text value DBGEN (at 0 0 315) (layer F.SilkS) hide)
    (pad 1 smd circle (at 0 0 315) (size 1.27 1.27) (layers C1F F.Mask)
      (net 84 /mcu/usb/power/DBGEN) (die_length 0.1651))
  )
  (module hackrf:GSG-TESTPOINT-50MIL (layer C1F) (tedit 50997FDC)
    (at 155.7274 125.1966 315)
    (fp_text reference P24 (at 0 0 315) (layer F.SilkS))
    (fp_text value TRST (at 0 0 315) (layer F.SilkS) hide)
    (pad 1 smd circle (at 0 0 315) (size 1.27 1.27) (layers C1F F.Mask)
      (net 309 "Net-(P24-Pad1)") (die_length 0.1651))
  )
  (module hackrf:GSG-HEADER-1x6 (layer C1F) (tedit 4F8A5F5A)
    (at 143.82 158.49)
    (tags CONN)
    (fp_text reference P25 (at 0 0) (layer F.SilkS))
    (fp_text value LPC_ISP (at 0 0) (layer F.SilkS) hide)
    (pad 1 thru_hole rect (at -6.35 0) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 193 GND) (die_length 0.08382))
    (pad 2 thru_hole circle (at -3.81 0) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 106 /mcu/usb/power/ISP) (die_length 0.06096))
    (pad 3 thru_hole circle (at -1.27 0) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 310 "Net-(P25-Pad3)") (die_length 0.08382))
    (pad 4 thru_hole circle (at 1.27 0) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 156 /mcu/usb/power/U0_RXD) (die_length -2147.483648))
    (pad 5 thru_hole circle (at 3.81 0) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 157 /mcu/usb/power/U0_TXD) (die_length -2147.483648))
    (pad 6 thru_hole circle (at 6.35 0) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 117 /mcu/usb/power/RESET))
  )
  (module hackrf:GSG-50MIL-HEADER-2x5-TH (layer C1F) (tedit 50998120)
    (at 152.2976 117.0066 270)
    (fp_text reference P26 (at 0 0 270) (layer F.SilkS))
    (fp_text value LPC_JTAG (at 0 0 270) (layer F.SilkS) hide)
    (pad 1 thru_hole rect (at -2.54 0.635 270) (size 1.0668 1.0668) (drill 0.7112) (layers *.Cu *.Mask)
      (net 221 VCC) (die_length -2147.483648))
    (pad 2 thru_hole circle (at -2.54 -0.635 270) (size 1.0668 1.0668) (drill 0.7112) (layers *.Cu *.Mask)
      (net 155 /mcu/usb/power/TMS) (die_length 0.04318))
    (pad 3 thru_hole circle (at -1.27 0.635 270) (size 1.0668 1.0668) (drill 0.7112) (layers *.Cu *.Mask)
      (net 193 GND) (die_length -2147.483648))
    (pad 4 thru_hole circle (at -1.27 -0.635 270) (size 1.0668 1.0668) (drill 0.7112) (layers *.Cu *.Mask)
      (net 152 /mcu/usb/power/TCK) (die_length -2147.483648))
    (pad 5 thru_hole circle (at 0 0.635 270) (size 1.0668 1.0668) (drill 0.7112) (layers *.Cu *.Mask)
      (net 193 GND) (die_length -2147.483648))
    (pad 6 thru_hole circle (at 0 -0.635 270) (size 1.0668 1.0668) (drill 0.7112) (layers *.Cu *.Mask)
      (net 154 /mcu/usb/power/TDO) (die_length -2147.483648))
    (pad 7 thru_hole circle (at 1.27 0.635 270) (size 1.0668 1.0668) (drill 0.7112) (layers *.Cu *.Mask)
      (net 311 "Net-(P26-Pad7)") (die_length 0.08128))
    (pad 8 thru_hole circle (at 1.27 -0.635 270) (size 1.0668 1.0668) (drill 0.7112) (layers *.Cu *.Mask)
      (net 153 /mcu/usb/power/TDI) (die_length -2147.483648))
    (pad 9 thru_hole circle (at 2.54 0.635 270) (size 1.0668 1.0668) (drill 0.7112) (layers *.Cu *.Mask)
      (net 193 GND) (die_length 0.7747))
    (pad 10 thru_hole circle (at 2.54 -0.635 270) (size 1.0668 1.0668) (drill 0.7112) (layers *.Cu *.Mask)
      (net 117 /mcu/usb/power/RESET) (die_length 0.27178))
  )
  (module hackrf:GSG-TESTPOINT-50MIL (layer C1F) (tedit 50997FDC)
    (at 94.29 148.3046)
    (fp_text reference P27 (at 0 0) (layer F.SilkS))
    (fp_text value MIXER_SDATA (at 0 0) (layer F.SilkS) hide)
    (pad 1 smd circle (at 0 0) (size 1.27 1.27) (layers C1F F.Mask)
      (net 200 MIXER_SDATA) (die_length 0.1651))
  )
  (module hackrf:GSG-HEADER-2x11 (layer C1F) (tedit 52878E74)
    (at 123.5 143.25 90)
    (tags CONN)
    (fp_text reference P28 (at 0 0 90) (layer F.SilkS))
    (fp_text value SD (at 0 0 90) (layer F.SilkS) hide)
    (pad 1 thru_hole rect (at -12.7 1.27 90) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 221 VCC) (die_length 0.08382))
    (pad 2 thru_hole circle (at -12.7 -1.27 90) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 193 GND) (die_length -2147.483648))
    (pad 3 thru_hole circle (at -10.16 1.27 90) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 122 /mcu/usb/power/SD_CD) (die_length 0.06096))
    (pad 4 thru_hole circle (at -10.16 -1.27 90) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 128 /mcu/usb/power/SD_DAT3) (die_length -2147.483648))
    (pad 5 thru_hole circle (at -7.62 1.27 90) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 127 /mcu/usb/power/SD_DAT2) (die_length 0.12192))
    (pad 6 thru_hole circle (at -7.62 -1.27 90) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 126 /mcu/usb/power/SD_DAT1) (die_length 0.12192))
    (pad 7 thru_hole circle (at -5.08 1.27 90) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 125 /mcu/usb/power/SD_DAT0) (die_length 0.12192))
    (pad 8 thru_hole circle (at -5.08 -1.27 90) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 130 /mcu/usb/power/SD_VOLT0) (die_length 0.08382))
    (pad 9 thru_hole circle (at -2.54 1.27 90) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 124 /mcu/usb/power/SD_CMD) (die_length -2147.483648))
    (pad 10 thru_hole circle (at -2.54 -1.27 90) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 129 /mcu/usb/power/SD_POW) (die_length 0.24638))
    (pad 11 thru_hole circle (at 0 1.27 90) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 123 /mcu/usb/power/SD_CLK) (die_length -2147.483648))
    (pad 12 thru_hole circle (at 0 -1.27 90) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 193 GND) (die_length -2147.483648))
    (pad 13 thru_hole circle (at 2.54 1.27 90) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 192 GCK2) (die_length 0.10668))
    (pad 14 thru_hole circle (at 2.54 -1.27 90) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 191 GCK1) (die_length 0.04318))
    (pad 15 thru_hole circle (at 5.08 1.27 90) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 48 /mcu/usb/power/B1AUX14) (die_length 0.02286))
    (pad 16 thru_hole circle (at 5.08 -1.27 90) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 47 /mcu/usb/power/B1AUX13) (die_length 0.25146))
    (pad 17 thru_hole circle (at 7.62 1.27 90) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 80 /mcu/usb/power/CPLD_TCK) (die_length -2147.483648))
    (pad 18 thru_hole circle (at 7.62 -1.27 90) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 72 /mcu/usb/power/BANK2F3M2) (die_length -2147.483648))
    (pad 19 thru_hole circle (at 10.16 1.27 90) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 81 /mcu/usb/power/CPLD_TDI) (die_length 0.08382))
    (pad 20 thru_hole circle (at 10.16 -1.27 90) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 76 /mcu/usb/power/BANK2F3M6) (die_length 0.08382))
    (pad 21 thru_hole circle (at 12.7 1.27 90) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 68 /mcu/usb/power/BANK2F3M12) (die_length -2147.483648))
    (pad 22 thru_hole circle (at 12.7 -1.27 90) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 74 /mcu/usb/power/BANK2F3M4) (die_length 0.08382))
  )
  (module hackrf:GSG-HEADER-1x2 (layer C1F) (tedit 4F8A5E8A)
    (at 131.12 133.09)
    (tags CONN)
    (fp_text reference P29 (at 0 0) (layer F.SilkS))
    (fp_text value CPLD_JTAG (at 0 0) (layer F.SilkS) hide)
    (pad 1 thru_hole rect (at -1.27 0) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 83 /mcu/usb/power/CPLD_TMS) (die_length 0.08382))
    (pad 2 thru_hole circle (at 1.27 0) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 82 /mcu/usb/power/CPLD_TDO) (die_length 0.06096))
  )
  (module hackrf:GSG-HEADER-2x10 (layer C1F) (tedit 4F8A60A9)
    (at 148.9 106.42 180)
    (tags CONN)
    (fp_text reference P30 (at 0 0 180) (layer F.SilkS))
    (fp_text value BANK2_AUX (at 0 0 180) (layer F.SilkS) hide)
    (pad 1 thru_hole rect (at -11.43 1.27 180) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 221 VCC) (die_length 0.08382))
    (pad 2 thru_hole circle (at -11.43 -1.27 180) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 193 GND) (die_length -2147.483648))
    (pad 3 thru_hole circle (at -8.89 1.27 180) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 56 /mcu/usb/power/B2AUX16) (die_length 0.06096))
    (pad 4 thru_hole circle (at -8.89 -1.27 180) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 55 /mcu/usb/power/B2AUX15) (die_length -2147.483648))
    (pad 5 thru_hole circle (at -6.35 1.27 180) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 54 /mcu/usb/power/B2AUX14) (die_length 0.12192))
    (pad 6 thru_hole circle (at -6.35 -1.27 180) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 53 /mcu/usb/power/B2AUX13) (die_length 0.12192))
    (pad 7 thru_hole circle (at -3.81 1.27 180) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 52 /mcu/usb/power/B2AUX12) (die_length 0.12192))
    (pad 8 thru_hole circle (at -3.81 -1.27 180) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 51 /mcu/usb/power/B2AUX11) (die_length 0.08382))
    (pad 9 thru_hole circle (at -1.27 1.27 180) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 50 /mcu/usb/power/B2AUX10) (die_length -2147.483648))
    (pad 10 thru_hole circle (at -1.27 -1.27 180) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 64 /mcu/usb/power/B2AUX9) (die_length 0.24638))
    (pad 11 thru_hole circle (at 1.27 1.27 180) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 63 /mcu/usb/power/B2AUX8) (die_length -2147.483648))
    (pad 12 thru_hole circle (at 1.27 -1.27 180) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 62 /mcu/usb/power/B2AUX7) (die_length -2147.483648))
    (pad 13 thru_hole circle (at 3.81 1.27 180) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 61 /mcu/usb/power/B2AUX6) (die_length 0.10668))
    (pad 14 thru_hole circle (at 3.81 -1.27 180) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 60 /mcu/usb/power/B2AUX5) (die_length 0.04318))
    (pad 15 thru_hole circle (at 6.35 1.27 180) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 59 /mcu/usb/power/B2AUX4) (die_length 0.02286))
    (pad 16 thru_hole circle (at 6.35 -1.27 180) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 58 /mcu/usb/power/B2AUX3) (die_length 0.25146))
    (pad 17 thru_hole circle (at 8.89 1.27 180) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 57 /mcu/usb/power/B2AUX2) (die_length -2147.483648))
    (pad 18 thru_hole circle (at 8.89 -1.27 180) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 49 /mcu/usb/power/B2AUX1) (die_length -2147.483648))
    (pad 19 thru_hole circle (at 11.43 1.27 180) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 88 /mcu/usb/power/GCK0) (die_length 0.08382))
    (pad 20 thru_hole circle (at 11.43 -1.27 180) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 193 GND) (die_length 0.08382))
  )
  (module hackrf:GSG-TESTPOINT-50MIL (layer C1F) (tedit 50997FDC)
    (at 96.4744 153.4862)
    (fp_text reference P31 (at 0 0) (layer F.SilkS))
    (fp_text value MIXER_SCLK (at 0 0) (layer F.SilkS) hide)
    (pad 1 smd circle (at 0 0) (size 1.27 1.27) (layers C1F F.Mask)
      (net 199 MIXER_SCLK) (die_length 0.1651))
  )
  (module hackrf:GSG-TESTPOINT-50MIL (layer C1F) (tedit 50997FDC)
    (at 99.7204 151.13)
    (fp_text reference P32 (at 0 0) (layer F.SilkS))
    (fp_text value MIXER_ENX (at 0 0) (layer F.SilkS) hide)
    (pad 1 smd circle (at 0 0) (size 1.27 1.27) (layers C1F F.Mask)
      (net 197 MIXER_ENX) (die_length 0.1651))
  )
  (module hackrf:GSG-TESTPOINT-50MIL (layer C1F) (tedit 50997FDC)
    (at 99.8526 153.5116)
    (fp_text reference P33 (at 0 0) (layer F.SilkS))
    (fp_text value MIXER_RESETX (at 0 0) (layer F.SilkS) hide)
    (pad 1 smd circle (at 0 0) (size 1.27 1.27) (layers C1F F.Mask)
      (net 198 MIXER_RESETX) (die_length 0.1651))
  )
  (module hackrf:GSG-TESTPOINT-50MIL (layer C1F) (tedit 50997FDC)
    (at 105.2628 161.538)
    (fp_text reference P34 (at 0 0) (layer F.SilkS))
    (fp_text value MIX_BYPASS (at 0 0) (layer F.SilkS) hide)
    (pad 1 smd circle (at 0 0) (size 1.27 1.27) (layers C1F F.Mask)
      (net 201 MIX_BYPASS) (die_length 0.1651))
  )
  (module hackrf:GSG-TESTPOINT-50MIL (layer C1F) (tedit 50997FDC)
    (at 109.7586 163.3668)
    (fp_text reference P35 (at 0 0) (layer F.SilkS))
    (fp_text value !MIX_BYPASS (at 0 0) (layer F.SilkS) hide)
    (pad 1 smd circle (at 0 0) (size 1.27 1.27) (layers C1F F.Mask)
      (net 1 !MIX_BYPASS) (die_length 0.1651))
  )
  (module hackrf:GSG-HEADER-1x2 (layer C1F) (tedit 4F8A5E8A)
    (at 84.13 126.74 90)
    (tags CONN)
    (fp_text reference P36 (at 0 0 90) (layer F.SilkS))
    (fp_text value VAA (at 0 0 90) (layer F.SilkS) hide)
    (pad 1 thru_hole rect (at -1.27 0 90) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 220 VAA) (die_length 0.08382))
    (pad 2 thru_hole circle (at 1.27 0 90) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 278 "Net-(C105-Pad1)") (die_length 0.06096))
  )
  (module hackrf:GSG-TESTPOINT-50MIL (layer C1F) (tedit 50997FDC)
    (at 133.7108 155.7468)
    (fp_text reference P37 (at 0 0) (layer F.SilkS))
    (fp_text value SCL (at 0 0) (layer F.SilkS) hide)
    (pad 1 smd circle (at 0 0) (size 1.27 1.27) (layers C1F F.Mask)
      (net 209 SCL) (die_length 0.1651))
  )
  (module hackrf:GSG-TESTPOINT-50MIL (layer C1F) (tedit 50997FDC)
    (at 134.0156 150.3366)
    (fp_text reference P38 (at 0 0) (layer F.SilkS))
    (fp_text value SDA (at 0 0) (layer F.SilkS) hide)
    (pad 1 smd circle (at 0 0) (size 1.27 1.27) (layers C1F F.Mask)
      (net 210 SDA) (die_length 0.1651))
  )
  (module hackrf:GSG-TESTPOINT-50MIL (layer C1F) (tedit 50997FDC)
    (at 98.3286 106.3184)
    (fp_text reference P39 (at 0 0) (layer F.SilkS))
    (fp_text value SSP1_SCK (at 0 0) (layer F.SilkS) hide)
    (pad 1 smd circle (at 0 0) (size 1.27 1.27) (layers C1F F.Mask)
      (net 214 SSP1_SCK) (die_length 0.1651))
  )
  (module hackrf:GSG-TESTPOINT-50MIL (layer C1F) (tedit 50997FDC)
    (at 136.454 128.264)
    (fp_text reference P40 (at 0 0) (layer F.SilkS))
    (fp_text value SSP1_MOSI (at 0 0) (layer F.SilkS) hide)
    (pad 1 smd circle (at 0 0) (size 1.27 1.27) (layers C1F F.Mask)
      (net 213 SSP1_MOSI) (die_length 0.1651))
  )
  (module hackrf:GSG-TESTPOINT-50MIL (layer C1F) (tedit 50997FDC)
    (at 141.534 128.518 180)
    (fp_text reference P41 (at 0 0 180) (layer F.SilkS))
    (fp_text value SSP1_MISO (at 0 0 180) (layer F.SilkS) hide)
    (pad 1 smd circle (at 0 0 180) (size 1.27 1.27) (layers C1F F.Mask)
      (net 212 SSP1_MISO) (die_length 0.1651))
  )
  (module hackrf:GSG-TESTPOINT-50MIL (layer C1F) (tedit 50997FDC)
    (at 94.2392 142.996)
    (fp_text reference P42 (at 0 0) (layer F.SilkS))
    (fp_text value TX (at 0 0) (layer F.SilkS) hide)
    (pad 1 smd circle (at 0 0) (size 1.27 1.27) (layers C1F F.Mask)
      (net 215 TX) (die_length 0.1651))
  )
  (module hackrf:GSG-TESTPOINT-50MIL (layer C1F) (tedit 50997FDC)
    (at 102.926 161.9952)
    (fp_text reference P43 (at 0 0) (layer F.SilkS))
    (fp_text value RX (at 0 0) (layer F.SilkS) hide)
    (pad 1 smd circle (at 0 0) (size 1.27 1.27) (layers C1F F.Mask)
      (net 204 RX) (die_length 0.1651))
  )
  (module hackrf:GSG-TESTPOINT-50MIL (layer C1F) (tedit 50997FDC)
    (at 86.2382 138.043)
    (fp_text reference P44 (at 0 0) (layer F.SilkS))
    (fp_text value HP (at 0 0) (layer F.SilkS) hide)
    (pad 1 smd circle (at 0 0) (size 1.27 1.27) (layers C1F F.Mask)
      (net 194 HP) (die_length 0.1651))
  )
  (module hackrf:GSG-TESTPOINT-50MIL (layer C1F) (tedit 50997FDC)
    (at 86.0604 144.7994)
    (fp_text reference P45 (at 0 0) (layer F.SilkS))
    (fp_text value LP (at 0 0) (layer F.SilkS) hide)
    (pad 1 smd circle (at 0 0) (size 1.27 1.27) (layers C1F F.Mask)
      (net 195 LP) (die_length 0.1651))
  )
  (module hackrf:GSG-TESTPOINT-50MIL (layer C1F) (tedit 50997FDC)
    (at 81.463 149.2952)
    (fp_text reference P46 (at 0 0) (layer F.SilkS))
    (fp_text value TX_MIX_BP (at 0 0) (layer F.SilkS) hide)
    (pad 1 smd circle (at 0 0) (size 1.27 1.27) (layers C1F F.Mask)
      (net 219 TX_MIX_BP) (die_length 0.1651))
  )
  (module hackrf:GSG-TESTPOINT-50MIL (layer C1F) (tedit 50997FDC)
    (at 73.335 141.1672)
    (fp_text reference P47 (at 0 0) (layer F.SilkS))
    (fp_text value RX_MIX_BP (at 0 0) (layer F.SilkS) hide)
    (pad 1 smd circle (at 0 0) (size 1.27 1.27) (layers C1F F.Mask)
      (net 208 RX_MIX_BP) (die_length 0.1651))
  )
  (module hackrf:GSG-TESTPOINT-50MIL (layer C1F) (tedit 50997FDC)
    (at 82.1234 154.8324)
    (fp_text reference P48 (at 0 0) (layer F.SilkS))
    (fp_text value TX_AMP (at 0 0) (layer F.SilkS) hide)
    (pad 1 smd circle (at 0 0) (size 1.27 1.27) (layers C1F F.Mask)
      (net 217 TX_AMP) (die_length 0.1651))
  )
  (module hackrf:GSG-TESTPOINT-50MIL (layer C1F) (tedit 50997FDC)
    (at 78.1812 150.0378)
    (fp_text reference P49 (at 0 0) (layer F.SilkS))
    (fp_text value RX_AMP (at 0 0) (layer F.SilkS) hide)
    (pad 1 smd circle (at 0 0) (size 1.27 1.27) (layers C1F F.Mask)
      (net 206 RX_AMP) (die_length 0.1651))
  )
  (module hackrf:GSG-TESTPOINT-50MIL (layer C1F) (tedit 50997FDC)
    (at 144.0232 154.3498)
    (fp_text reference P50 (at 0 0) (layer F.SilkS))
    (fp_text value AMP_BYPASS (at 0 0) (layer F.SilkS) hide)
    (pad 1 smd circle (at 0 0) (size 1.27 1.27) (layers C1F F.Mask)
      (net 167 AMP_BYPASS) (die_length 0.1651))
  )
  (module hackrf:GSG-TESTPOINT-50MIL (layer C1F) (tedit 50997FDC)
    (at 74.7066 166.3894)
    (fp_text reference P51 (at 0 0) (layer F.SilkS))
    (fp_text value !TX_AMP_PWR (at 0 0) (layer F.SilkS) hide)
    (pad 1 smd circle (at 0 0) (size 1.27 1.27) (layers C1F F.Mask)
      (net 3 !TX_AMP_PWR) (die_length 0.1651))
  )
  (module hackrf:GSG-TESTPOINT-50MIL (layer C1F) (tedit 50997FDC)
    (at 71.9836 146.7104)
    (fp_text reference P52 (at 0 0) (layer F.SilkS))
    (fp_text value !RX_AMP_PWR (at 0 0) (layer F.SilkS) hide)
    (pad 1 smd circle (at 0 0) (size 1.27 1.27) (layers C1F F.Mask)
      (net 2 !RX_AMP_PWR) (die_length 0.1651))
  )
  (module hackrf:GSG-TESTPOINT-50MIL (layer C1F) (tedit 50997FDC)
    (at 132.009 135.5284)
    (fp_text reference P53 (at 0 0) (layer F.SilkS))
    (fp_text value CS_XCVR (at 0 0) (layer F.SilkS) hide)
    (pad 1 smd circle (at 0 0) (size 1.27 1.27) (layers C1F F.Mask)
      (net 172 CS_XCVR) (die_length 0.1651))
  )
  (module hackrf:GSG-TESTPOINT-50MIL (layer C1F) (tedit 50997FDC)
    (at 95.6362 108.833)
    (fp_text reference P54 (at 0 0) (layer F.SilkS))
    (fp_text value CS_AD (at 0 0) (layer F.SilkS) hide)
    (pad 1 smd circle (at 0 0) (size 1.27 1.27) (layers C1F F.Mask)
      (net 171 CS_AD) (die_length 0.1651))
  )
  (module hackrf:GSG-TESTPOINT-50MIL (layer C1F) (tedit 50997FDC)
    (at 103.307 145.6884)
    (fp_text reference P55 (at 0 0) (layer F.SilkS))
    (fp_text value TXENABLE (at 0 0) (layer F.SilkS) hide)
    (pad 1 smd circle (at 0 0) (size 1.27 1.27) (layers C1F F.Mask)
      (net 216 TXENABLE) (die_length 0.1651))
  )
  (module hackrf:GSG-TESTPOINT-50MIL (layer C1F) (tedit 50997FDC)
    (at 104.5516 146.9838)
    (fp_text reference P56 (at 0 0) (layer F.SilkS))
    (fp_text value RXENABLE (at 0 0) (layer F.SilkS) hide)
    (pad 1 smd circle (at 0 0) (size 1.27 1.27) (layers C1F F.Mask)
      (net 205 RXENABLE) (die_length 0.1651))
  )
  (module hackrf:GSG-TESTPOINT-50MIL (layer C1F) (tedit 50997FDC)
    (at 120.0456 143.9358)
    (fp_text reference P57 (at 0 0) (layer F.SilkS))
    (fp_text value XTAL2 (at 0 0) (layer F.SilkS) hide)
    (pad 1 smd circle (at 0 0) (size 1.27 1.27) (layers C1F F.Mask)
      (net 37 /baseband/XTAL2) (die_length 0.1651))
  )
  (module hackrf:GSG-TESTPOINT-50MIL (layer C1F) (tedit 50997FDC)
    (at 111.3334 123.4634)
    (fp_text reference P58 (at 0 0) (layer F.SilkS))
    (fp_text value GCK1 (at 0 0) (layer F.SilkS) hide)
    (pad 1 smd circle (at 0 0) (size 1.27 1.27) (layers C1F F.Mask)
      (net 191 GCK1) (die_length 0.1651))
  )
  (module hackrf:GSG-TESTPOINT-50MIL (layer C1F) (tedit 50997FDC)
    (at 128.5546 152.6734)
    (fp_text reference P59 (at 0 0) (layer F.SilkS))
    (fp_text value GCK2 (at 0 0) (layer F.SilkS) hide)
    (pad 1 smd circle (at 0 0) (size 1.27 1.27) (layers C1F F.Mask)
      (net 192 GCK2) (die_length 0.1651))
  )
  (module hackrf:GSG-TESTPOINT-50MIL (layer C1F) (tedit 50997FDC)
    (at 131.5518 156.7374)
    (fp_text reference P60 (at 0 0) (layer F.SilkS))
    (fp_text value SGPIO_CLK (at 0 0) (layer F.SilkS) hide)
    (pad 1 smd circle (at 0 0) (size 1.27 1.27) (layers C1F F.Mask)
      (net 211 SGPIO_CLK) (die_length 0.1651))
  )
  (module hackrf:GSG-TESTPOINT-50MIL (layer C1F) (tedit 50997FDC)
    (at 111.9684 119.5772)
    (fp_text reference P61 (at 0 0) (layer F.SilkS))
    (fp_text value DA0 (at 0 0) (layer F.SilkS) hide)
    (pad 1 smd circle (at 0 0) (size 1.27 1.27) (layers C1F F.Mask)
      (net 173 DA0) (die_length 0.1651))
  )
  (module hackrf:GSG-TESTPOINT-50MIL (layer C1F) (tedit 50997FDC)
    (at 113.8936 111.4552)
    (fp_text reference P62 (at 0 0) (layer F.SilkS))
    (fp_text value DA7 (at 0 0) (layer F.SilkS) hide)
    (pad 1 smd circle (at 0 0) (size 1.27 1.27) (layers C1F F.Mask)
      (net 180 DA7) (die_length 0.1651))
  )
  (module hackrf:GSG-TESTPOINT-50MIL (layer C1F) (tedit 50997FDC)
    (at 113.5634 109.474)
    (fp_text reference P63 (at 0 0) (layer F.SilkS))
    (fp_text value DD0 (at 0 0) (layer F.SilkS) hide)
    (pad 1 smd circle (at 0 0) (size 1.27 1.27) (layers C1F F.Mask)
      (net 181 DD0) (die_length 0.1651))
  )
  (module hackrf:GSG-TESTPOINT-50MIL (layer C1F) (tedit 50997FDC)
    (at 103.9368 105.283)
    (fp_text reference P64 (at 0 0) (layer F.SilkS))
    (fp_text value DD9 (at 0 0) (layer F.SilkS) hide)
    (pad 1 smd circle (at 0 0) (size 1.27 1.27) (layers C1F F.Mask)
      (net 190 DD9) (die_length 0.1651))
  )
  (module hackrf:GSG-TESTPOINT-50MIL (layer C1F) (tedit 50997FDC)
    (at 111.4858 114.294)
    (fp_text reference P65 (at 0 0) (layer F.SilkS))
    (fp_text value DA4 (at 0 0) (layer F.SilkS) hide)
    (pad 1 smd circle (at 0 0) (size 1.27 1.27) (layers C1F F.Mask)
      (net 177 DA4) (die_length 0.1651))
  )
  (module hackrf:GSG-TESTPOINT-50MIL (layer C1F) (tedit 50997FDC)
    (at 119.436 107.4614)
    (fp_text reference P66 (at 0 0) (layer F.SilkS))
    (fp_text value DD5 (at 0 0) (layer F.SilkS) hide)
    (pad 1 smd circle (at 0 0) (size 1.27 1.27) (layers C1F F.Mask)
      (net 186 DD5) (die_length 0.1651))
  )
  (module hackrf:GSG-TESTPOINT-50MIL (layer C1F) (tedit 50997FDC)
    (at 166.1466 138.1954)
    (fp_text reference P67 (at 0 0) (layer F.SilkS))
    (fp_text value RSSI (at 0 0) (layer F.SilkS) hide)
    (pad 1 smd circle (at 0 0) (size 1.27 1.27) (layers C1F F.Mask)
      (net 203 RSSI) (die_length 0.1651))
  )
  (module hackrf:GSG-TESTPOINT-50MIL (layer C1F) (tedit 50997FDC)
    (at 158.171 151.7844)
    (fp_text reference P68 (at 0 0) (layer F.SilkS))
    (fp_text value SPIFI_CS (at 0 0) (layer F.SilkS) hide)
    (pad 1 smd circle (at 0 0) (size 1.27 1.27) (layers C1F F.Mask)
      (net 146 /mcu/usb/power/SPIFI_CS) (die_length 0.1651))
  )
  (module hackrf:GSG-TESTPOINT-50MIL (layer C1F) (tedit 50997FDC)
    (at 158.3488 120.4408)
    (fp_text reference P69 (at 0 0) (layer F.SilkS))
    (fp_text value VREGMODE (at 0 0) (layer F.SilkS) hide)
    (pad 1 smd circle (at 0 0) (size 1.27 1.27) (layers C1F F.Mask)
      (net 163 /mcu/usb/power/VREGMODE) (die_length 0.1651))
  )
  (module hackrf:GSG-TESTPOINT-50MIL (layer C1F) (tedit 50997FDC)
    (at 67.0358 129.8388)
    (fp_text reference P70 (at 0 0) (layer F.SilkS))
    (fp_text value EN_1V8 (at 0 0) (layer F.SilkS) hide)
    (pad 1 smd circle (at 0 0) (size 1.27 1.27) (layers C1F F.Mask)
      (net 87 /mcu/usb/power/EN1V8) (die_length 0.1651))
  )
  (module hackrf:GSG-TESTPOINT-50MIL (layer C1F) (tedit 50997FDC)
    (at 167.1626 129.0768)
    (fp_text reference P71 (at 0 0) (layer F.SilkS))
    (fp_text value ID (at 0 0) (layer F.SilkS) hide)
    (pad 1 smd circle (at 0 0) (size 1.27 1.27) (layers C1F F.Mask)
      (net 295 "Net-(J1-Pad4)") (die_length 0.1651))
  )
  (module hackrf:GSG-TESTPOINT-50MIL (layer C1F) (tedit 50997FDC)
    (at 162.6414 129.407)
    (fp_text reference P72 (at 0 0) (layer F.SilkS))
    (fp_text value GP_CLKIN (at 0 0) (layer F.SilkS) hide)
    (pad 1 smd circle (at 0 0) (size 1.27 1.27) (layers C1F F.Mask)
      (net 97 /mcu/usb/power/GP_CLKIN) (die_length 0.1651))
  )
  (module hackrf:GSG-TESTPOINT-50MIL (layer C1F) (tedit 50997FDC)
    (at 139.7814 122.2188)
    (fp_text reference P73 (at 0 0) (layer F.SilkS))
    (fp_text value P1_2 (at 0 0) (layer F.SilkS) hide)
    (pad 1 smd circle (at 0 0) (size 1.27 1.27) (layers C1F F.Mask)
      (net 111 /mcu/usb/power/P1_2) (die_length 0.1651))
  )
  (module hackrf:GSG-TESTPOINT-50MIL (layer C1F) (tedit 50997FDC)
    (at 142.1384 123.0884)
    (fp_text reference P74 (at 0 0) (layer F.SilkS))
    (fp_text value P1_1 (at 0 0) (layer F.SilkS) hide)
    (pad 1 smd circle (at 0 0) (size 1.27 1.27) (layers C1F F.Mask)
      (net 110 /mcu/usb/power/P1_1) (die_length 0.1651))
  )
  (module hackrf:GSG-TESTPOINT-50MIL (layer C1F) (tedit 50997FDC)
    (at 147.249 115.4878)
    (fp_text reference P75 (at 0 0) (layer F.SilkS))
    (fp_text value GP_CLKIN (at 0 0) (layer F.SilkS) hide)
    (pad 1 smd circle (at 0 0) (size 1.27 1.27) (layers C1F F.Mask)
      (net 131 /mcu/usb/power/SGPIO0) (die_length 0.1651))
  )
  (module hackrf:GSG-TESTPOINT-50MIL (layer C1F) (tedit 50997FDC)
    (at 142.3976 120.8218)
    (fp_text reference P76 (at 0 0) (layer F.SilkS))
    (fp_text value GP_CLKIN (at 0 0) (layer F.SilkS) hide)
    (pad 1 smd circle (at 0 0) (size 1.27 1.27) (layers C1F F.Mask)
      (net 144 /mcu/usb/power/SGPIO7) (die_length 0.1651))
  )
  (module hackrf:GSG-TESTPOINT-50MIL (layer C1F) (tedit 50997FDC)
    (at 142.1944 114.675)
    (fp_text reference P77 (at 0 0) (layer F.SilkS))
    (fp_text value GP_CLKIN (at 0 0) (layer F.SilkS) hide)
    (pad 1 smd circle (at 0 0) (size 1.27 1.27) (layers C1F F.Mask)
      (net 145 /mcu/usb/power/SGPIO9) (die_length 0.1651))
  )
  (module hackrf:GSG-TESTPOINT-50MIL (layer C1F) (tedit 50997FDC)
    (at 133.7108 126.5622)
    (fp_text reference P78 (at 0 0) (layer F.SilkS))
    (fp_text value GP_CLKIN (at 0 0) (layer F.SilkS) hide)
    (pad 1 smd circle (at 0 0) (size 1.27 1.27) (layers C1F F.Mask)
      (net 133 /mcu/usb/power/SGPIO10) (die_length 0.1651))
  )
  (module hackrf:GSG-TESTPOINT-50MIL (layer C1F) (tedit 50997FDC)
    (at 135.0824 133.4202)
    (fp_text reference P79 (at 0 0) (layer F.SilkS))
    (fp_text value GP_CLKIN (at 0 0) (layer F.SilkS) hide)
    (pad 1 smd circle (at 0 0) (size 1.27 1.27) (layers C1F F.Mask)
      (net 134 /mcu/usb/power/SGPIO11) (die_length 0.1651))
  )
  (module hackrf:GSG-HEADER-NOMARK-1x2 (layer C1F) (tedit 5281A360)
    (at 178.11 131.82 270)
    (tags CONN)
    (fp_text reference P80 (at 0 0 270) (layer F.SilkS))
    (fp_text value SHIELD (at 0 0 270) (layer F.SilkS) hide)
    (pad 1 thru_hole rect (at -1.27 0 270) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 158 /mcu/usb/power/USB_SHIELD) (die_length 0.08382))
    (pad 2 thru_hole circle (at 1.27 0 270) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 158 /mcu/usb/power/USB_SHIELD) (die_length 0.06096))
  )
  (module hackrf:GSG-TESTPOINT-50MIL (layer C1F) (tedit 50997FDC)
    (at 167.0356 158.0328)
    (fp_text reference P81 (at 0 0) (layer F.SilkS))
    (fp_text value SPIFI_SIO2 (at 0 0) (layer F.SilkS) hide)
    (pad 1 smd circle (at 0 0) (size 1.27 1.27) (layers C1F F.Mask)
      (net 150 /mcu/usb/power/SPIFI_SIO2) (die_length 0.1651))
  )
  (module hackrf:GSG-TESTPOINT-50MIL (layer C1F) (tedit 50997FDC)
    (at 154.2594 158.2868)
    (fp_text reference P82 (at 0 0) (layer F.SilkS))
    (fp_text value SPIFI_SIO3 (at 0 0) (layer F.SilkS) hide)
    (pad 1 smd circle (at 0 0) (size 1.27 1.27) (layers C1F F.Mask)
      (net 151 /mcu/usb/power/SPIFI_SIO3) (die_length 0.1651))
  )
  (module hackrf:GSG-TESTPOINT-50MIL (layer C1F) (tedit 50997FDC)
    (at 112.0446 159.6584)
    (fp_text reference P83 (at 0 0) (layer F.SilkS))
    (fp_text value GND (at 0 0) (layer F.SilkS) hide)
    (pad 1 smd circle (at 0 0) (size 1.27 1.27) (layers C1F F.Mask)
      (net 193 GND) (die_length 0.1651))
  )
  (module hackrf:GSG-TESTPOINT-50MIL (layer C1F) (tedit 50997FDC)
    (at 102.7736 166.999)
    (fp_text reference P84 (at 0 0) (layer F.SilkS))
    (fp_text value GND (at 0 0) (layer F.SilkS) hide)
    (pad 1 smd circle (at 0 0) (size 1.27 1.27) (layers C1F F.Mask)
      (net 193 GND) (die_length 0.1651))
  )
  (module hackrf:GSG-TESTPOINT-50MIL (layer C1F) (tedit 50997FDC)
    (at 97.1856 148.4062)
    (fp_text reference P85 (at 0 0) (layer F.SilkS))
    (fp_text value GND (at 0 0) (layer F.SilkS) hide)
    (pad 1 smd circle (at 0 0) (size 1.27 1.27) (layers C1F F.Mask)
      (net 193 GND) (die_length 0.1651))
  )
  (module hackrf:GSG-TESTPOINT-50MIL (layer C1F) (tedit 50997FDC)
    (at 91.5722 140.8116)
    (fp_text reference P86 (at 0 0) (layer F.SilkS))
    (fp_text value GND (at 0 0) (layer F.SilkS) hide)
    (pad 1 smd circle (at 0 0) (size 1.27 1.27) (layers C1F F.Mask)
      (net 193 GND) (die_length 0.1651))
  )
  (module hackrf:GSG-TESTPOINT-50MIL (layer C1F) (tedit 50997FDC)
    (at 74.4 164.4)
    (fp_text reference P87 (at 0 0) (layer F.SilkS))
    (fp_text value GND (at 0 0) (layer F.SilkS) hide)
    (pad 1 smd circle (at 0 0) (size 1.27 1.27) (layers C1F F.Mask)
      (net 193 GND) (die_length 0.1651))
  )
  (module hackrf:GSG-TESTPOINT-50MIL (layer C1F) (tedit 50997FDC)
    (at 81.8948 151.8098)
    (fp_text reference P88 (at 0 0) (layer F.SilkS))
    (fp_text value GND (at 0 0) (layer F.SilkS) hide)
    (pad 1 smd circle (at 0 0) (size 1.27 1.27) (layers C1F F.Mask)
      (net 193 GND) (die_length 0.1651))
  )
  (module hackrf:GSG-TESTPOINT-50MIL (layer C1F) (tedit 50997FDC)
    (at 87.1272 161.9952)
    (fp_text reference P89 (at 0 0) (layer F.SilkS))
    (fp_text value GND (at 0 0) (layer F.SilkS) hide)
    (pad 1 smd circle (at 0 0) (size 1.27 1.27) (layers C1F F.Mask)
      (net 193 GND) (die_length 0.1651))
  )
  (module hackrf:GSG-TESTPOINT-50MIL (layer C1F) (tedit 50997FDC)
    (at 69.4488 146.5774)
    (fp_text reference P90 (at 0 0) (layer F.SilkS))
    (fp_text value GND (at 0 0) (layer F.SilkS) hide)
    (pad 1 smd circle (at 0 0) (size 1.27 1.27) (layers C1F F.Mask)
      (net 193 GND) (die_length 0.1651))
  )
  (module hackrf:GSG-TESTPOINT-50MIL (layer C1F) (tedit 50997FDC)
    (at 105.2628 152.6226)
    (fp_text reference P91 (at 0 0) (layer F.SilkS))
    (fp_text value GND (at 0 0) (layer F.SilkS) hide)
    (pad 1 smd circle (at 0 0) (size 1.27 1.27) (layers C1F F.Mask)
      (net 193 GND) (die_length 0.1651))
  )
  (module hackrf:GSG-TESTPOINT-50MIL (layer C1F) (tedit 50997FDC)
    (at 113.4416 151.5812)
    (fp_text reference P92 (at 0 0) (layer F.SilkS))
    (fp_text value GND (at 0 0) (layer F.SilkS) hide)
    (pad 1 smd circle (at 0 0) (size 1.27 1.27) (layers C1F F.Mask)
      (net 193 GND) (die_length 0.1651))
  )
  (module gsg-modules:SOT23GDS (layer C1F) (tedit 52FD6616)
    (at 72.376 150.38)
    (descr "Module CMS SOT23 Transistor GDS")
    (tags "CMS SOT")
    (attr smd)
    (fp_text reference Q1 (at -0.0044 0.0312) (layer F.SilkS))
    (fp_text value MOSFET_P (at 0 0) (layer F.SilkS) hide)
    (pad S smd rect (at -0.889 -1.016) (size 0.9144 0.9144) (layers C1F F.Paste F.Mask)
      (net 220 VAA))
    (pad G smd rect (at 0.889 -1.016) (size 0.9144 0.9144) (layers C1F F.Paste F.Mask)
      (net 2 !RX_AMP_PWR))
    (pad D smd rect (at 0 1.016) (size 0.9144 0.9144) (layers C1F F.Paste F.Mask)
      (net 263 "Net-(C163-Pad2)"))
    (model smd/cms_sot23.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.13 0.15 0.15))
      (rotate (xyz 0 0 0))
    )
  )
  (module gsg-modules:SOT23GDS (layer C1F) (tedit 52FD6616)
    (at 77.2167 165.3908 180)
    (descr "Module CMS SOT23 Transistor GDS")
    (tags "CMS SOT")
    (attr smd)
    (fp_text reference Q2 (at -0.0044 0.0312 180) (layer F.SilkS))
    (fp_text value MOSFET_P (at 0 0 180) (layer F.SilkS) hide)
    (pad S smd rect (at -0.889 -1.016 180) (size 0.9144 0.9144) (layers C1F F.Paste F.Mask)
      (net 220 VAA))
    (pad G smd rect (at 0.889 -1.016 180) (size 0.9144 0.9144) (layers C1F F.Paste F.Mask)
      (net 3 !TX_AMP_PWR))
    (pad D smd rect (at 0 1.016 180) (size 0.9144 0.9144) (layers C1F F.Paste F.Mask)
      (net 285 "Net-(C160-Pad1)"))
    (model smd/cms_sot23.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.13 0.15 0.15))
      (rotate (xyz 0 0 0))
    )
  )
  (module gsg-modules:SOT23GDS (layer C1F) (tedit 52FD6616)
    (at 85.0444 119.6788)
    (descr "Module CMS SOT23 Transistor GDS")
    (tags "CMS SOT")
    (attr smd)
    (fp_text reference Q3 (at -0.0044 0.0312) (layer F.SilkS))
    (fp_text value MOSFET_P (at 0 0) (layer F.SilkS) hide)
    (pad S smd rect (at -0.889 -1.016) (size 0.9144 0.9144) (layers C1F F.Paste F.Mask)
      (net 221 VCC))
    (pad G smd rect (at 0.889 -1.016) (size 0.9144 0.9144) (layers C1F F.Paste F.Mask)
      (net 4 !VAA_ENABLE))
    (pad D smd rect (at 0 1.016) (size 0.9144 0.9144) (layers C1F F.Paste F.Mask)
      (net 293 "Net-(FB2-Pad1)"))
    (model smd/cms_sot23.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.13 0.15 0.15))
      (rotate (xyz 0 0 0))
    )
  )
  (module gsg-modules:SOT23GDS (layer C1F) (tedit 52FD6616)
    (at 70.8 164.2 180)
    (descr "Module CMS SOT23 Transistor GDS")
    (tags "CMS SOT")
    (attr smd)
    (fp_text reference Q4 (at -0.0044 0.0312 180) (layer F.SilkS))
    (fp_text value MOSFET_P (at 0 0 180) (layer F.SilkS) hide)
    (pad S smd rect (at -0.889 -1.016 180) (size 0.9144 0.9144) (layers C1F F.Paste F.Mask)
      (net 220 VAA))
    (pad G smd rect (at 0.889 -1.016 180) (size 0.9144 0.9144) (layers C1F F.Paste F.Mask)
      (net 38 /frontend/!ANT_BIAS))
    (pad D smd rect (at 0 1.016 180) (size 0.9144 0.9144) (layers C1F F.Paste F.Mask)
      (net 304 "Net-(L13-Pad1)"))
    (model smd/cms_sot23.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.13 0.15 0.15))
      (rotate (xyz 0 0 0))
    )
  )
  (module gsg-modules:SOT23GDS (layer C1F) (tedit 52FD6616)
    (at 166.299 121.5584 270)
    (descr "Module CMS SOT23 Transistor GDS")
    (tags "CMS SOT")
    (attr smd)
    (fp_text reference Q5 (at -0.0044 0.0312 270) (layer F.SilkS))
    (fp_text value MOSFET_P (at 0 0 270) (layer F.SilkS) hide)
    (pad S smd rect (at -0.889 -1.016 270) (size 0.9144 0.9144) (layers C1F F.Paste F.Mask)
      (net 160 /mcu/usb/power/VBUS))
    (pad G smd rect (at 0.889 -1.016 270) (size 0.9144 0.9144) (layers C1F F.Paste F.Mask)
      (net 161 /mcu/usb/power/VBUSCTRL))
    (pad D smd rect (at 0 1.016 270) (size 0.9144 0.9144) (layers C1F F.Paste F.Mask)
      (net 162 /mcu/usb/power/VIN))
    (model smd/cms_sot23.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.13 0.15 0.15))
      (rotate (xyz 0 0 0))
    )
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 89.0644 152.6836 270)
    (solder_mask_margin 0.1016)
    (fp_text reference R1 (at 0 0.0508 270) (layer F.SilkS))
    (fp_text value 470 (at 0 0.0508 270) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 226 "Net-(C12-Pad1)") (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 227 "Net-(C13-Pad1)") (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 89.6994 149.6356 180)
    (solder_mask_margin 0.1016)
    (fp_text reference R2 (at 0 0.0508 180) (layer F.SilkS))
    (fp_text value 470 (at 0 0.0508 180) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 227 "Net-(C13-Pad1)") (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 229 "Net-(C14-Pad1)") (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 91.3504 152.6836 90)
    (solder_mask_margin 0.1016)
    (fp_text reference R3 (at 0 0.0508 90) (layer F.SilkS))
    (fp_text value 22k (at 0 0.0508 90) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 230 "Net-(C15-Pad2)") (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 228 "Net-(C14-Pad2)") (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 94.373 152.328 270)
    (solder_mask_margin 0.1016)
    (fp_text reference R4 (at 0 0.0508 270) (layer F.SilkS))
    (fp_text value 51k (at 0 0.0508 270) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 312 "Net-(R4-Pad2)") (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 138.359 130.931 315)
    (solder_mask_margin 0.1016)
    (fp_text reference R5 (at 0 0.0508 315) (layer F.SilkS))
    (fp_text value 10k (at 0 0.0508 315) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 315) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 198 MIXER_RESETX) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 315) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 221 VCC) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 139.121 130.169 315)
    (solder_mask_margin 0.1016)
    (fp_text reference R6 (at 0 0.0508 315) (layer F.SilkS))
    (fp_text value 10k (at 0 0.0508 315) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 315) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 197 MIXER_ENX) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 315) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 221 VCC) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 67.874 123.946 90)
    (solder_mask_margin 0.1016)
    (fp_text reference R7 (at 0 0.0508 90) (layer F.SilkS))
    (fp_text value 10k (at 0 0.0508 90) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 313 "Net-(R30-Pad2)") (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 91.821 121.936 270)
    (solder_mask_margin 0.1016)
    (fp_text reference R8 (at 0 0.0508 270) (layer F.SilkS))
    (fp_text value 1k (at 0 0.0508 270) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 33 /baseband/TXBBQ-) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 22 /baseband/QD+) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 93.091 121.936 270)
    (solder_mask_margin 0.1016)
    (fp_text reference R9 (at 0 0.0508 270) (layer F.SilkS))
    (fp_text value 1k (at 0 0.0508 270) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 32 /baseband/TXBBQ+) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 23 /baseband/QD-) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 94.9452 121.936 270)
    (solder_mask_margin 0.1016)
    (fp_text reference R10 (at 0 0.0508 270) (layer F.SilkS))
    (fp_text value 1k (at 0 0.0508 270) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 30 /baseband/TXBBI+) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 17 /baseband/ID-) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 146.0298 123.3872 180)
    (solder_mask_margin 0.1016)
    (fp_text reference R11 (at 0 0.0508 180) (layer F.SilkS))
    (fp_text value 10k (at 0 0.0508 180) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 4 !VAA_ENABLE) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 221 VCC) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 167.1626 130.9818 90)
    (solder_mask_margin 0.1016)
    (fp_text reference R12 (at 0 0.0508 90) (layer F.SilkS))
    (fp_text value 10k (at 0 0.0508 90) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 295 "Net-(J1-Pad4)") (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 221 VCC) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 96.2152 121.936 270)
    (solder_mask_margin 0.1016)
    (fp_text reference R13 (at 0 0.0508 270) (layer F.SilkS))
    (fp_text value 1k (at 0 0.0508 270) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 31 /baseband/TXBBI-) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 16 /baseband/ID+) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 96.2152 124.984 270)
    (solder_mask_margin 0.1016)
    (fp_text reference R14 (at 0 0.0508 270) (layer F.SilkS))
    (fp_text value 4k7 (at 0 0.0508 270) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 31 /baseband/TXBBI-) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 94.9452 124.984 270)
    (solder_mask_margin 0.1016)
    (fp_text reference R15 (at 0 0.0508 270) (layer F.SilkS))
    (fp_text value 4k7 (at 0 0.0508 270) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 30 /baseband/TXBBI+) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 93.091 124.984 270)
    (solder_mask_margin 0.1016)
    (fp_text reference R16 (at 0 0.0508 270) (layer F.SilkS))
    (fp_text value 4k7 (at 0 0.0508 270) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 32 /baseband/TXBBQ+) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 91.821 124.984 270)
    (solder_mask_margin 0.1016)
    (fp_text reference R17 (at 0 0.0508 270) (layer F.SilkS))
    (fp_text value 4k7 (at 0 0.0508 270) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 33 /baseband/TXBBQ-) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 63.302 133.344)
    (solder_mask_margin 0.1016)
    (fp_text reference R18 (at 0 0.0508) (layer F.SilkS))
    (fp_text value 1k8 (at 0 0.0508) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 220 VAA) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 286 "Net-(D2-Pad2)") (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 68.9662 112.0588 90)
    (solder_mask_margin 0.1016)
    (fp_text reference R19 (at 0 0.0508 90) (layer F.SilkS))
    (fp_text value 39 (at 0 0.0508 90) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 314 "Net-(R19-Pad2)") (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 117 /mcu/usb/power/RESET) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 100.0125 125.2253 270)
    (solder_mask_margin 0.1016)
    (fp_text reference R20 (at 0 0.0508 270) (layer F.SilkS))
    (fp_text value 0 (at 0 0.0508 270) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 26 /baseband/RXBBI+) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 14 /baseband/IA+) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 101.2825 125.2253 270)
    (solder_mask_margin 0.1016)
    (fp_text reference R21 (at 0 0.0508 270) (layer F.SilkS))
    (fp_text value 0 (at 0 0.0508 270) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 27 /baseband/RXBBI-) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 15 /baseband/IA-) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 103.1367 125.2253 270)
    (solder_mask_margin 0.1016)
    (fp_text reference R22 (at 0 0.0508 270) (layer F.SilkS))
    (fp_text value 0 (at 0 0.0508 270) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 28 /baseband/RXBBQ+) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 21 /baseband/QA-) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 104.4067 125.2253 270)
    (solder_mask_margin 0.1016)
    (fp_text reference R23 (at 0 0.0508 270) (layer F.SilkS))
    (fp_text value 0 (at 0 0.0508 270) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 29 /baseband/RXBBQ-) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 20 /baseband/QA+) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 75.6927 168.8198 180)
    (solder_mask_margin 0.1016)
    (fp_text reference R24 (at 0 0.0508 180) (layer F.SilkS))
    (fp_text value 10k (at 0 0.0508 180) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 220 VAA) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 3 !TX_AMP_PWR) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 115.2525 138.8491)
    (solder_mask_margin 0.1016)
    (fp_text reference R25 (at 0 0.0508) (layer F.SilkS))
    (fp_text value 475 (at 0 0.0508) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 282 "Net-(C114-Pad2)") (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 12 /baseband/CPOUT+) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 115.2525 137.8331)
    (solder_mask_margin 0.1016)
    (fp_text reference R26 (at 0 0.0508) (layer F.SilkS))
    (fp_text value 475 (at 0 0.0508) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 283 "Net-(C114-Pad1)") (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 13 /baseband/CPOUT-) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 134.168 161.3094)
    (solder_mask_margin 0.1016)
    (fp_text reference R27 (at 0 0.0508) (layer F.SilkS))
    (fp_text value 1k8 (at 0 0.0508) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 210 SDA) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 221 VCC) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 133.4314 158.1852)
    (solder_mask_margin 0.1016)
    (fp_text reference R28 (at 0 0.0508) (layer F.SilkS))
    (fp_text value 1k8 (at 0 0.0508) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 209 SCL) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 221 VCC) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 73.9 147.967 180)
    (solder_mask_margin 0.1016)
    (fp_text reference R29 (at 0 0.0508 180) (layer F.SilkS))
    (fp_text value 10k (at 0 0.0508 180) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 2 !RX_AMP_PWR) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 220 VAA) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 68.9662 125.0128 90)
    (solder_mask_margin 0.1016)
    (fp_text reference R30 (at 0 0.0508 90) (layer F.SilkS))
    (fp_text value 39 (at 0 0.0508 90) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 313 "Net-(R30-Pad2)") (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 113 /mcu/usb/power/P2_8) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 127.437 157.8296 270)
    (solder_mask_margin 0.1016)
    (fp_text reference R31 (at 0 0.0508 270) (layer F.SilkS))
    (fp_text value 39 (at 0 0.0508 270) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 6 /baseband/CLK0) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 191 GCK1) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 128.5546 156.4072 270)
    (solder_mask_margin 0.1016)
    (fp_text reference R32 (at 0 0.0508 270) (layer F.SilkS))
    (fp_text value 39 (at 0 0.0508 270) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 7 /baseband/CLK1) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 192 GCK2) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 134.93 165.1956 90)
    (solder_mask_margin 0.1016)
    (fp_text reference R33 (at 0 0.0508 90) (layer F.SilkS))
    (fp_text value 39 (at 0 0.0508 90) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 9 /baseband/CLK3) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 170 CLKOUT) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 123.8758 160.1216)
    (solder_mask_margin 0.1016)
    (fp_text reference R34 (at 0 0.0508) (layer F.SilkS))
    (fp_text value 39 (at 0 0.0508) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 196 MCU_CLK) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 97 /mcu/usb/power/GP_CLKIN) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0805 (layer C1F) (tedit 50998367)
    (at 177.3 115.6 180)
    (solder_mask_margin 0.1016)
    (fp_text reference R35 (at 0 0 180) (layer F.SilkS))
    (fp_text value DNP (at 0 0 180) (layer F.SilkS) hide)
    (pad 2 smd rect (at 1.016 0 180) (size 1.15062 1.44018) (layers C1F F.Paste F.Mask)
      (net 193 GND) (die_length 0.08128) (solder_mask_margin 0.1016) (clearance 0.1778))
    (pad 1 smd rect (at -1.016 0 180) (size 1.15062 1.44018) (layers C1F F.Paste F.Mask)
      (net 158 /mcu/usb/power/USB_SHIELD) (die_length -2147.483648) (solder_mask_margin 0.1016) (clearance 0.1778))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 70.8 166.6)
    (solder_mask_margin 0.1016)
    (fp_text reference R36 (at 0 0.0508) (layer F.SilkS))
    (fp_text value 10k (at 0 0.0508) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 220 VAA) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 38 /frontend/!ANT_BIAS) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 160.838 124.9366)
    (solder_mask_margin 0.1016)
    (fp_text reference R37 (at 0 0.0508) (layer F.SilkS))
    (fp_text value 10k (at 0 0.0508) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 161 /mcu/usb/power/VBUSCTRL) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 139.756 126.232)
    (solder_mask_margin 0.1016)
    (fp_text reference R41 (at 0 0.0508) (layer F.SilkS))
    (fp_text value 10k (at 0 0.0508) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 222 XCVR_EN) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 173.467 115.7612 180)
    (solder_mask_margin 0.1016)
    (fp_text reference R46 (at 0 0.0508 180) (layer F.SilkS))
    (fp_text value 162k (at 0 0.0508 180) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 284 "Net-(C125-Pad2)") (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 173.467 116.7772 180)
    (solder_mask_margin 0.1016)
    (fp_text reference R47 (at 0 0.0508 180) (layer F.SilkS))
    (fp_text value 330k (at 0 0.0508 180) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 284 "Net-(C125-Pad2)") (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 116 /mcu/usb/power/REG_OUT2) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 165.283 150.235 180)
    (solder_mask_margin 0.1016)
    (fp_text reference R48 (at 0 0.0508 180) (layer F.SilkS))
    (fp_text value 10k (at 0 0.0508 180) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 164 /mcu/usb/power/WAKEUP) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 221 VCC) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 67.874 110.992 270)
    (solder_mask_margin 0.1016)
    (fp_text reference R49 (at 0 0.0508 270) (layer F.SilkS))
    (fp_text value 10k (at 0 0.0508 270) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 314 "Net-(R19-Pad2)") (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 221 VCC) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 159.9236 119.3486 180)
    (solder_mask_margin 0.1016)
    (fp_text reference R51 (at 0 0.0508 180) (layer F.SilkS))
    (fp_text value 10k (at 0 0.0508 180) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 163 /mcu/usb/power/VREGMODE) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 315 "Net-(R51-Pad1)") (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 177.15 108.7762 90)
    (solder_mask_margin 0.1016)
    (fp_text reference R52 (at 0 0.0508 90) (layer F.SilkS))
    (fp_text value 10k (at 0 0.0508 90) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 316 "Net-(R52-Pad2)") (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 162 /mcu/usb/power/VIN) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 163.434 111.9512)
    (solder_mask_margin 0.1016)
    (fp_text reference R54 (at 0 0.0508) (layer F.SilkS))
    (fp_text value 10k (at 0 0.0508) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 87 /mcu/usb/power/EN1V8) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 173.467 109.4112 180)
    (solder_mask_margin 0.1016)
    (fp_text reference R55 (at 0 0.0508 180) (layer F.SilkS))
    (fp_text value 162k (at 0 0.0508 180) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 317 "Net-(R55-Pad2)") (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 173.467 108.3952 180)
    (solder_mask_margin 0.1016)
    (fp_text reference R56 (at 0 0.0508 180) (layer F.SilkS))
    (fp_text value 715k (at 0 0.0508 180) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 317 "Net-(R55-Pad2)") (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 115 /mcu/usb/power/REG_OUT1) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 165.675 125.275)
    (solder_mask_margin 0.1016)
    (fp_text reference R57 (at 0 0.0508) (layer F.SilkS))
    (fp_text value 0 (at 0 0.0508) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 296 "Net-(J1-Pad3)") (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 86 /mcu/usb/power/DP) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 165.675 124.475)
    (solder_mask_margin 0.1016)
    (fp_text reference R58 (at 0 0.0508) (layer F.SilkS))
    (fp_text value 0 (at 0 0.0508) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 297 "Net-(J1-Pad2)") (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 85 /mcu/usb/power/DM) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 141.026 156.3818 180)
    (solder_mask_margin 0.1016)
    (fp_text reference R59 (at 0 0.0508 180) (layer F.SilkS))
    (fp_text value 10k (at 0 0.0508 180) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 106 /mcu/usb/power/ISP) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 221 VCC) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 159.9744 121.66)
    (solder_mask_margin 0.1016)
    (fp_text reference R62 (at 0 0.0508) (layer F.SilkS))
    (fp_text value 0 (at 0 0.0508) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 160 /mcu/usb/power/VBUS) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 318 "Net-(R62-Pad1)") (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 156.1898 120.0344 270)
    (solder_mask_margin 0.1016)
    (fp_text reference R63 (at 0 0.0508 270) (layer F.SilkS))
    (fp_text value 10k (at 0 0.0508 270) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 221 VCC) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 154 /mcu/usb/power/TDO) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 155.0468 121.1266 90)
    (solder_mask_margin 0.1016)
    (fp_text reference R64 (at 0 0.0508 90) (layer F.SilkS))
    (fp_text value 10k (at 0 0.0508 90) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 221 VCC) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 84 /mcu/usb/power/DBGEN) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 159.9998 122.8284 180)
    (solder_mask_margin 0.1016)
    (fp_text reference R65 (at 0 0.0508 180) (layer F.SilkS))
    (fp_text value 10k (at 0 0.0508 180) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 318 "Net-(R62-Pad1)") (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 156.8502 116.8086 180)
    (solder_mask_margin 0.1016)
    (fp_text reference R66 (at 0 0.0508 180) (layer F.SilkS))
    (fp_text value 10k (at 0 0.0508 180) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 152 /mcu/usb/power/TCK) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 221 VCC) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 139.756 123.692 180)
    (solder_mask_margin 0.1016)
    (fp_text reference R67 (at 0 0.0508 180) (layer F.SilkS))
    (fp_text value 10k (at 0 0.0508 180) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 221 VCC) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 110 /mcu/usb/power/P1_1) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 139.756 124.962 180)
    (solder_mask_margin 0.1016)
    (fp_text reference R68 (at 0 0.0508 180) (layer F.SilkS))
    (fp_text value 10k (at 0 0.0508 180) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 111 /mcu/usb/power/P1_2) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 158.120287 128.398095 45)
    (solder_mask_margin 0.1016)
    (fp_text reference R69 (at 0 0.0508 45) (layer F.SilkS))
    (fp_text value 12k (at 0 0.0508 45) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 45) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 45) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 118 /mcu/usb/power/RREF) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 63.302 137.916)
    (solder_mask_margin 0.1016)
    (fp_text reference R72 (at 0 0.0508) (layer F.SilkS))
    (fp_text value 470 (at 0 0.0508) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 107 /mcu/usb/power/LED1) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 287 "Net-(D4-Pad2)") (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 63.302 142.488)
    (solder_mask_margin 0.1016)
    (fp_text reference R73 (at 0 0.0508) (layer F.SilkS))
    (fp_text value 1k (at 0 0.0508) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 108 /mcu/usb/power/LED2) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 288 "Net-(D5-Pad2)") (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 63.302 147.06)
    (solder_mask_margin 0.1016)
    (fp_text reference R74 (at 0 0.0508) (layer F.SilkS))
    (fp_text value 1k8 (at 0 0.0508) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 109 /mcu/usb/power/LED3) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 289 "Net-(D6-Pad2)") (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 63.048 116.707)
    (solder_mask_margin 0.1016)
    (fp_text reference R75 (at 0 0.0508) (layer F.SilkS))
    (fp_text value 470 (at 0 0.0508) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 221 VCC) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 290 "Net-(D7-Pad2)") (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 63.302 129.407)
    (solder_mask_margin 0.1016)
    (fp_text reference R76 (at 0 0.0508) (layer F.SilkS))
    (fp_text value 1k (at 0 0.0508) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 87 /mcu/usb/power/EN1V8) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 291 "Net-(D8-Pad2)") (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 140.335 114.7318 180)
    (solder_mask_margin 0.1016)
    (fp_text reference R77 (at 0 0.0508 180) (layer F.SilkS))
    (fp_text value 39 (at 0 0.0508 180) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 65 /mcu/usb/power/BANK2F3M1) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 145 /mcu/usb/power/SGPIO9) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 140.335 115.7478 180)
    (solder_mask_margin 0.1016)
    (fp_text reference R78 (at 0 0.0508 180) (layer F.SilkS))
    (fp_text value 39 (at 0 0.0508 180) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 72 /mcu/usb/power/BANK2F3M2) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 136 /mcu/usb/power/SGPIO13) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 140.335 116.7638 180)
    (solder_mask_margin 0.1016)
    (fp_text reference R79 (at 0 0.0508 180) (layer F.SilkS))
    (fp_text value 39 (at 0 0.0508 180) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 73 /mcu/usb/power/BANK2F3M3) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 131 /mcu/usb/power/SGPIO0) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 140.335 117.7798 180)
    (solder_mask_margin 0.1016)
    (fp_text reference R80 (at 0 0.0508 180) (layer F.SilkS))
    (fp_text value 39 (at 0 0.0508 180) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 74 /mcu/usb/power/BANK2F3M4) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 137 /mcu/usb/power/SGPIO14) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 140.335 118.7958 180)
    (solder_mask_margin 0.1016)
    (fp_text reference R81 (at 0 0.0508 180) (layer F.SilkS))
    (fp_text value 39 (at 0 0.0508 180) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 75 /mcu/usb/power/BANK2F3M5) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 132 /mcu/usb/power/SGPIO1) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 131.5772 169.285 270)
    (solder_mask_margin 0.1016)
    (fp_text reference R85 (at 0 0.0508 270) (layer F.SilkS))
    (fp_text value 10k (at 0 0.0508 270) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 270) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 169 CLKIN) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 140.335 119.8118 180)
    (solder_mask_margin 0.1016)
    (fp_text reference R86 (at 0 0.0508 180) (layer F.SilkS))
    (fp_text value 39 (at 0 0.0508 180) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 76 /mcu/usb/power/BANK2F3M6) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 138 /mcu/usb/power/SGPIO15) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 140.335 120.8278 180)
    (solder_mask_margin 0.1016)
    (fp_text reference R87 (at 0 0.0508 180) (layer F.SilkS))
    (fp_text value 39 (at 0 0.0508 180) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 77 /mcu/usb/power/BANK2F3M7) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 144 /mcu/usb/power/SGPIO7) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 134.3458 128.4672 90)
    (solder_mask_margin 0.1016)
    (fp_text reference R88 (at 0 0.0508 90) (layer F.SilkS))
    (fp_text value 39 (at 0 0.0508 90) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 78 /mcu/usb/power/BANK2F3M8) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 133 /mcu/usb/power/SGPIO10) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 132.8166 128.4986 90)
    (solder_mask_margin 0.1016)
    (fp_text reference R89 (at 0 0.0508 90) (layer F.SilkS))
    (fp_text value 39 (at 0 0.0508 90) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 79 /mcu/usb/power/BANK2F3M9) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 139 /mcu/usb/power/SGPIO2) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 131.8006 128.4986 90)
    (solder_mask_margin 0.1016)
    (fp_text reference R90 (at 0 0.0508 90) (layer F.SilkS))
    (fp_text value 39 (at 0 0.0508 90) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 66 /mcu/usb/power/BANK2F3M10) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 140 /mcu/usb/power/SGPIO3) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 130.7846 128.4986 90)
    (solder_mask_margin 0.1016)
    (fp_text reference R91 (at 0 0.0508 90) (layer F.SilkS))
    (fp_text value 39 (at 0 0.0508 90) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 67 /mcu/usb/power/BANK2F3M11) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 134 /mcu/usb/power/SGPIO11) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 141.026 155.188 180)
    (solder_mask_margin 0.1016)
    (fp_text reference R93 (at 0 0.0508 180) (layer F.SilkS))
    (fp_text value 10k (at 0 0.0508 180) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 193 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 114 /mcu/usb/power/P2_9) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 132.2122 162.427 180)
    (solder_mask_margin 0.1016)
    (fp_text reference R94 (at 0 0.0508 180) (layer F.SilkS))
    (fp_text value 39 (at 0 0.0508 180) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 8 /baseband/CLK2) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 211 SGPIO_CLK) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 129.7686 128.4986 90)
    (solder_mask_margin 0.1016)
    (fp_text reference R96 (at 0 0.0508 90) (layer F.SilkS))
    (fp_text value 39 (at 0 0.0508 90) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 68 /mcu/usb/power/BANK2F3M12) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 135 /mcu/usb/power/SGPIO12) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 128.707 128.518 90)
    (solder_mask_margin 0.1016)
    (fp_text reference R98 (at 0 0.0508 90) (layer F.SilkS))
    (fp_text value 39 (at 0 0.0508 90) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 69 /mcu/usb/power/BANK2F3M14) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 141 /mcu/usb/power/SGPIO4) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 127.691 128.518 90)
    (solder_mask_margin 0.1016)
    (fp_text reference R99 (at 0 0.0508 90) (layer F.SilkS))
    (fp_text value 39 (at 0 0.0508 90) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 70 /mcu/usb/power/BANK2F3M15) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 142 /mcu/usb/power/SGPIO5) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 126.675 128.518 90)
    (solder_mask_margin 0.1016)
    (fp_text reference R100 (at 0 0.0508 90) (layer F.SilkS))
    (fp_text value 39 (at 0 0.0508 90) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 71 /mcu/usb/power/BANK2F3M16) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 143 /mcu/usb/power/SGPIO6) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 128.1042 168.006 180)
    (solder_mask_margin 0.1016)
    (fp_text reference R104 (at 0 0.0508 180) (layer F.SilkS))
    (fp_text value 10k (at 0 0.0508 180) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 18 /baseband/INTR) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 180) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 221 VCC) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-0402 (layer C1F) (tedit 4FB6CFE4)
    (at 131.7872 165.212 90)
    (solder_mask_margin 0.1016)
    (fp_text reference R105 (at 0 0.0508 90) (layer F.SilkS))
    (fp_text value 10k (at 0 0.0508 90) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 19 /baseband/OEB) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.5334 0 90) (size 0.508 0.5588) (layers C1F F.Paste F.Mask)
      (net 221 VCC) (die_length -2147.483648) (solder_mask_margin 0.1016))
  )
  (module hackrf:GSG-SWITCH-FSMRA (layer C1F) (tedit 527ECBC8)
    (at 62.7 124.4 270)
    (fp_text reference SW1 (at 0 1.8 270) (layer F.SilkS))
    (fp_text value DFU (at 0 1.8 270) (layer F.SilkS) hide)
    (pad 1 thru_hole circle (at -2.25 0 270) (size 1.5 1.5) (drill 0.99) (layers *.Cu *.Mask)
      (net 221 VCC) (die_length -2147.483648))
    (pad 2 thru_hole circle (at 2.25 0 270) (size 1.5 1.5) (drill 0.99) (layers *.Cu *.Mask)
      (net 313 "Net-(R30-Pad2)"))
    (pad 0 thru_hole circle (at 3.505 -2.49 270) (size 2 2) (drill 1.3) (layers *.Cu *.Mask)
      (net 193 GND))
    (pad 0 thru_hole circle (at -3.505 -2.49 270) (size 2 2) (drill 1.3) (layers *.Cu *.Mask)
      (net 193 GND))
  )
  (module hackrf:GSG-SWITCH-FSMRA (layer C1F) (tedit 527ECBC8)
    (at 62.7 111.4 270)
    (fp_text reference SW2 (at 0 1.8 270) (layer F.SilkS))
    (fp_text value RESET (at 0 1.8 270) (layer F.SilkS) hide)
    (pad 1 thru_hole circle (at -2.25 0 270) (size 1.5 1.5) (drill 0.99) (layers *.Cu *.Mask)
      (net 193 GND) (die_length -2147.483648))
    (pad 2 thru_hole circle (at 2.25 0 270) (size 1.5 1.5) (drill 0.99) (layers *.Cu *.Mask)
      (net 314 "Net-(R19-Pad2)"))
    (pad 0 thru_hole circle (at 3.505 -2.49 270) (size 2 2) (drill 1.3) (layers *.Cu *.Mask)
      (net 193 GND))
    (pad 0 thru_hole circle (at -3.505 -2.49 270) (size 2 2) (drill 1.3) (layers *.Cu *.Mask)
      (net 193 GND))
  )
  (module hackrf:GSG-B0310J50100AHF (layer C1F) (tedit 50997E90)
    (at 95.1604 164.1136 270)
    (fp_text reference T1 (at 0 0 270) (layer F.SilkS))
    (fp_text value MIX_IN_BALUN (at 0 0 270) (layer F.SilkS) hide)
    (pad 1 smd rect (at 0.6604 -0.4953 270) (size 0.40894 0.3302) (layers C1F F.Paste F.Mask)
      (net 247 "Net-(C28-Pad1)") (die_length -2147.483648))
    (pad 2 smd rect (at 0 -0.4953 270) (size 0.40894 0.3302) (layers C1F F.Paste F.Mask)
      (net 241 "Net-(C25-Pad1)") (die_length -2147.483648))
    (pad 3 smd rect (at -0.6604 -0.4953 270) (size 0.40894 0.3302) (layers C1F F.Paste F.Mask)
      (net 298 "Net-(L1-Pad2)") (die_length -2147.483648))
    (pad 4 smd rect (at -0.6604 0.4953 270) (size 0.40894 0.3302) (layers C1F F.Paste F.Mask)
      (net 299 "Net-(L1-Pad1)") (die_length 0.01524))
    (pad 5 smd rect (at 0 0.4953 270) (size 0.40894 0.3302) (layers C1F F.Paste F.Mask))
    (pad 6 smd rect (at 0.6604 0.4953 270) (size 0.40894 0.3302) (layers C1F F.Paste F.Mask)
      (die_length 0.08128))
  )
  (module hackrf:GSG-B0310J50100AHF (layer C1F) (tedit 50997E90)
    (at 100.723 158.2716)
    (fp_text reference T2 (at 0 0) (layer F.SilkS))
    (fp_text value MIX_OUT_BALUN (at 0 0) (layer F.SilkS) hide)
    (pad 1 smd rect (at 0.6604 -0.4953) (size 0.40894 0.3302) (layers C1F F.Paste F.Mask)
      (net 256 "Net-(C46-Pad2)") (die_length -2147.483648))
    (pad 2 smd rect (at 0 -0.4953) (size 0.40894 0.3302) (layers C1F F.Paste F.Mask)
      (net 259 "Net-(C49-Pad2)") (die_length -2147.483648))
    (pad 3 smd rect (at -0.6604 -0.4953) (size 0.40894 0.3302) (layers C1F F.Paste F.Mask)
      (net 301 "Net-(L3-Pad1)") (die_length -2147.483648))
    (pad 4 smd rect (at -0.6604 0.4953) (size 0.40894 0.3302) (layers C1F F.Paste F.Mask)
      (net 300 "Net-(L2-Pad1)") (die_length 0.01524))
    (pad 5 smd rect (at 0 0.4953) (size 0.40894 0.3302) (layers C1F F.Paste F.Mask))
    (pad 6 smd rect (at 0.6604 0.4953) (size 0.40894 0.3302) (layers C1F F.Paste F.Mask)
      (die_length 0.08128))
  )
  (module hackrf:GSG-2500BL14M100 (layer C1F) (tedit 4F5D90A4)
    (at 107.5055 151.5491 90)
    (fp_text reference T3 (at 0 0 90) (layer F.SilkS))
    (fp_text value RX_BALUN (at 0 0 90) (layer F.SilkS) hide)
    (pad 1 smd rect (at -0.50038 0.42418 90) (size 0.24892 0.55118) (layers C1F F.Paste F.Mask)
      (net 207 RX_IF) (die_length 0.08128))
    (pad 2 smd rect (at 0 0.42418 90) (size 0.24892 0.55118) (layers C1F F.Paste F.Mask)
      (net 193 GND) (die_length 0.08128))
    (pad 3 smd rect (at 0.50038 0.42418 90) (size 0.24892 0.55118) (layers C1F F.Paste F.Mask)
      (net 274 "Net-(C102-Pad2)") (die_length 871.97184))
    (pad 4 smd rect (at 0.50038 -0.42418 90) (size 0.24892 0.55118) (layers C1F F.Paste F.Mask)
      (net 272 "Net-(C99-Pad2)") (die_length 0.22098))
    (pad 5 smd rect (at 0 -0.42418 90) (size 0.24892 0.55118) (layers C1F F.Paste F.Mask)
      (net 193 GND) (die_length -2147.483648))
    (pad 6 smd rect (at -0.50038 -0.42418 90) (size 0.24892 0.55118) (layers C1F F.Paste F.Mask)
      (die_length -2147.483648))
  )
  (module hackrf:GSG-2500BL14M100 (layer C1F) (tedit 4F5D90A4)
    (at 110.5535 151.5491 90)
    (fp_text reference T4 (at 0 0 90) (layer F.SilkS))
    (fp_text value TX_BALUN (at 0 0 90) (layer F.SilkS) hide)
    (pad 1 smd rect (at -0.50038 0.42418 90) (size 0.24892 0.55118) (layers C1F F.Paste F.Mask)
      (net 218 TX_IF) (die_length 0.08128))
    (pad 2 smd rect (at 0 0.42418 90) (size 0.24892 0.55118) (layers C1F F.Paste F.Mask)
      (net 193 GND) (die_length 0.08128))
    (pad 3 smd rect (at 0.50038 0.42418 90) (size 0.24892 0.55118) (layers C1F F.Paste F.Mask)
      (net 280 "Net-(C111-Pad2)") (die_length 871.97184))
    (pad 4 smd rect (at 0.50038 -0.42418 90) (size 0.24892 0.55118) (layers C1F F.Paste F.Mask)
      (net 276 "Net-(C104-Pad2)") (die_length 0.22098))
    (pad 5 smd rect (at 0 -0.42418 90) (size 0.24892 0.55118) (layers C1F F.Paste F.Mask)
      (net 193 GND) (die_length -2147.483648))
    (pad 6 smd rect (at -0.50038 -0.42418 90) (size 0.24892 0.55118) (layers C1F F.Paste F.Mask)
      (die_length -2147.483648))
  )
  (module hackrf:GSG-SKY13350-385LF (layer C1F) (tedit 526ED53C)
    (at 105.433 167.0522 270)
    (solder_paste_ratio -0.02)
    (fp_text reference U1 (at 0 0 270) (layer F.SilkS))
    (fp_text value SKY13350 (at 0 0 270) (layer F.SilkS) hide)
    (pad 1 smd rect (at -0.6435 -0.24892 270) (size 0.645 0.23) (layers C1F F.Paste F.Mask)
      (net 1 !MIX_BYPASS) (die_length -2147.483648))
    (pad 3 smd rect (at 0 0.552 270) (size 0.3 0.813) (layers C1F F.Paste F.Mask)
      (net 193 GND) (die_length -2147.483648))
    (pad 4 smd rect (at 0.6435 0.24892 270) (size 0.645 0.23) (layers C1F F.Paste F.Mask)
      (net 251 "Net-(C32-Pad1)") (die_length 0.0508))
    (pad 5 smd rect (at 0.6435 -0.24892 270) (size 0.645 0.23) (layers C1F F.Paste F.Mask)
      (net 201 MIX_BYPASS) (die_length 10.53846))
    (pad 6 smd rect (at 0 -0.552 270) (size 0.3 0.813) (layers C1F F.Paste F.Mask)
      (net 223 "Net-(C8-Pad2)") (die_length -2147.483648))
    (pad 2 smd rect (at -0.6435 0.24892 270) (size 0.645 0.23) (layers C1F F.Paste F.Mask)
      (net 238 "Net-(C21-Pad1)") (die_length -2147.483648))
  )
  (module hackrf:GSG-SKY13350-385LF (layer C1F) (tedit 526ED53C)
    (at 89.8858 144.8786)
    (solder_paste_ratio -0.02)
    (fp_text reference U2 (at 0 0) (layer F.SilkS))
    (fp_text value SKY13350 (at 0 0) (layer F.SilkS) hide)
    (pad 1 smd rect (at -0.6435 -0.24892) (size 0.645 0.23) (layers C1F F.Paste F.Mask)
      (net 204 RX) (die_length -2147.483648))
    (pad 3 smd rect (at 0 0.552) (size 0.3 0.813) (layers C1F F.Paste F.Mask)
      (net 193 GND) (die_length -2147.483648))
    (pad 4 smd rect (at 0.6435 0.24892) (size 0.645 0.23) (layers C1F F.Paste F.Mask)
      (net 239 "Net-(C23-Pad2)") (die_length 0.0508))
    (pad 5 smd rect (at 0.6435 -0.24892) (size 0.645 0.23) (layers C1F F.Paste F.Mask)
      (net 215 TX) (die_length 10.53846))
    (pad 6 smd rect (at 0 -0.552) (size 0.3 0.813) (layers C1F F.Paste F.Mask)
      (net 235 "Net-(C20-Pad2)") (die_length -2147.483648))
    (pad 2 smd rect (at -0.6435 0.24892) (size 0.645 0.23) (layers C1F F.Paste F.Mask)
      (net 224 "Net-(C9-Pad2)") (die_length -2147.483648))
  )
  (module hackrf:GSG-LP0603 (layer C1F) (tedit 4FE3B99C)
    (at 81.0308 142.9542)
    (fp_text reference U3 (at 0 0) (layer F.SilkS))
    (fp_text value RX_LOWPASS_FILTER (at 0 0) (layer F.SilkS) hide)
    (pad 2 smd rect (at -0.62484 0.35052) (size 0.50038 0.39878) (layers C1F F.Paste F.Mask)
      (net 193 GND) (die_length 3.40614))
    (pad 3 smd rect (at 0.62484 0.35052) (size 0.50038 0.39878) (layers C1F F.Paste F.Mask)
      (net 193 GND) (die_length -2147.483648))
    (pad 4 smd rect (at 0.62484 -0.35052) (size 0.50038 0.39878) (layers C1F F.Paste F.Mask)
      (net 232 "Net-(C17-Pad1)") (die_length -2147.483648))
    (pad 1 smd rect (at -0.62484 -0.35052) (size 0.50038 0.39878) (layers C1F F.Paste F.Mask)
      (net 233 "Net-(C18-Pad2)") (die_length -2147.483648))
  )
  (module hackrf:GSG-SKY13350-385LF (layer C1F) (tedit 526ED53C)
    (at 77.3478 140.4142 90)
    (solder_paste_ratio -0.02)
    (fp_text reference U5 (at 0 0 90) (layer F.SilkS))
    (fp_text value SKY13350 (at 0 0 90) (layer F.SilkS) hide)
    (pad 1 smd rect (at -0.6435 -0.24892 90) (size 0.645 0.23) (layers C1F F.Paste F.Mask)
      (net 195 LP) (die_length -2147.483648))
    (pad 3 smd rect (at 0 0.552 90) (size 0.3 0.813) (layers C1F F.Paste F.Mask)
      (net 193 GND) (die_length -2147.483648))
    (pad 4 smd rect (at 0.6435 0.24892 90) (size 0.645 0.23) (layers C1F F.Paste F.Mask)
      (net 242 "Net-(C26-Pad2)") (die_length 0.0508))
    (pad 5 smd rect (at 0.6435 -0.24892 90) (size 0.645 0.23) (layers C1F F.Paste F.Mask)
      (net 194 HP) (die_length 10.53846))
    (pad 6 smd rect (at 0 -0.552 90) (size 0.3 0.813) (layers C1F F.Paste F.Mask)
      (net 248 "Net-(C31-Pad2)") (die_length -2147.483648))
    (pad 2 smd rect (at -0.6435 0.24892 90) (size 0.645 0.23) (layers C1F F.Paste F.Mask)
      (net 234 "Net-(C18-Pad1)") (die_length -2147.483648))
  )
  (module hackrf:GSG-SKY13350-385LF (layer C1F) (tedit 526ED53C)
    (at 84.4598 140.4142 270)
    (solder_paste_ratio -0.02)
    (fp_text reference U6 (at 0 0 270) (layer F.SilkS))
    (fp_text value SKY13350 (at 0 0 270) (layer F.SilkS) hide)
    (pad 1 smd rect (at -0.6435 -0.24892 270) (size 0.645 0.23) (layers C1F F.Paste F.Mask)
      (net 194 HP) (die_length -2147.483648))
    (pad 3 smd rect (at 0 0.552 270) (size 0.3 0.813) (layers C1F F.Paste F.Mask)
      (net 193 GND) (die_length -2147.483648))
    (pad 4 smd rect (at 0.6435 0.24892 270) (size 0.645 0.23) (layers C1F F.Paste F.Mask)
      (net 231 "Net-(C17-Pad2)") (die_length 0.0508))
    (pad 5 smd rect (at 0.6435 -0.24892 270) (size 0.645 0.23) (layers C1F F.Paste F.Mask)
      (net 195 LP) (die_length 10.53846))
    (pad 6 smd rect (at 0 -0.552 270) (size 0.3 0.813) (layers C1F F.Paste F.Mask)
      (net 236 "Net-(C20-Pad1)") (die_length -2147.483648))
    (pad 2 smd rect (at -0.6435 0.24892 270) (size 0.645 0.23) (layers C1F F.Paste F.Mask)
      (net 244 "Net-(C27-Pad2)") (die_length -2147.483648))
  )
  (module hackrf:GSG-SKY13350-385LF (layer C1F) (tedit 526ED53C)
    (at 98.9704 166.2726)
    (solder_paste_ratio -0.02)
    (fp_text reference U7 (at 0 0) (layer F.SilkS))
    (fp_text value SKY13350 (at 0 0) (layer F.SilkS) hide)
    (pad 1 smd rect (at -0.6435 -0.24892) (size 0.645 0.23) (layers C1F F.Paste F.Mask)
      (net 204 RX) (die_length -2147.483648))
    (pad 3 smd rect (at 0 0.552) (size 0.3 0.813) (layers C1F F.Paste F.Mask)
      (net 193 GND) (die_length -2147.483648))
    (pad 4 smd rect (at 0.6435 0.24892) (size 0.645 0.23) (layers C1F F.Paste F.Mask)
      (net 237 "Net-(C21-Pad2)") (die_length 0.0508))
    (pad 5 smd rect (at 0.6435 -0.24892) (size 0.645 0.23) (layers C1F F.Paste F.Mask)
      (net 215 TX) (die_length 10.53846))
    (pad 6 smd rect (at 0 -0.552) (size 0.3 0.813) (layers C1F F.Paste F.Mask)
      (net 246 "Net-(C28-Pad2)") (die_length -2147.483648))
    (pad 2 smd rect (at -0.6435 0.24892) (size 0.645 0.23) (layers C1F F.Paste F.Mask)
      (net 225 "Net-(C9-Pad1)") (die_length -2147.483648))
  )
  (module hackrf:GSG-HP-DEA (layer C1F) (tedit 4FE3C48C)
    (at 80.6498 137.8742 180)
    (fp_text reference U8 (at 0 0 180) (layer F.SilkS))
    (fp_text value RX_HIGHPASS_FILTER (at 0 0 180) (layer F.SilkS) hide)
    (pad 1 smd rect (at -0.8509 0 180) (size 0.50038 0.70104) (layers C1F F.Paste F.Mask)
      (net 245 "Net-(C27-Pad1)") (die_length 3.40614))
    (pad 3 smd rect (at 0.8509 0 180) (size 0.50038 0.70104) (layers C1F F.Paste F.Mask)
      (net 243 "Net-(C26-Pad1)") (die_length -2147.483648))
    (pad 4 smd rect (at 0 -0.44958 180) (size 0.59944 0.50038) (layers C1F F.Paste F.Mask)
      (net 193 GND) (die_length -2147.483648))
    (pad 2 smd rect (at 0 0.44958 180) (size 0.59944 0.50038) (layers C1F F.Paste F.Mask)
      (net 193 GND) (die_length 3.40614))
  )
  (module hackrf:GSG-SKY13317-373LF (layer C1F) (tedit 537A5509)
    (at 77.851 146.304 180)
    (fp_text reference U9 (at 0 0 180) (layer F.SilkS))
    (fp_text value SKY13317 (at 0 0 180) (layer F.SilkS) hide)
    (pad 1 smd rect (at -0.95 -0.6 180) (size 0.8 0.24) (layers C1F F.Paste F.Mask)
      (net 254 "Net-(C44-Pad2)"))
    (pad 2 smd rect (at -0.95 -0.2 180) (size 0.8 0.24) (layers C1F F.Paste F.Mask)
      (net 329 "Net-(U9-Pad2)"))
    (pad 3 smd rect (at -0.95 0.2 180) (size 0.8 0.24) (layers C1F F.Paste F.Mask)
      (net 219 TX_MIX_BP))
    (pad 4 smd rect (at -0.95 0.6 180) (size 0.8 0.24) (layers C1F F.Paste F.Mask)
      (net 250 "Net-(C32-Pad2)"))
    (pad 5 smd rect (at 0.95 0.6 180) (size 0.8 0.24) (layers C1F F.Paste F.Mask)
      (net 249 "Net-(C31-Pad1)"))
    (pad 6 smd rect (at 0.95 0.2 180) (size 0.8 0.24) (layers C1F F.Paste F.Mask)
      (net 1 !MIX_BYPASS))
    (pad 7 smd rect (at 0.95 -0.2 180) (size 0.8 0.24) (layers C1F F.Paste F.Mask)
      (net 208 RX_MIX_BP))
    (pad 8 smd rect (at 0.95 -0.6 180) (size 0.8 0.24) (layers C1F F.Paste F.Mask)
      (net 253 "Net-(C43-Pad1)"))
    (pad 0 smd rect (at 0 0 180) (size 0.2 1.3) (layers C1F F.Mask)
      (net 193 GND) (solder_paste_margin_ratio -0.01))
    (pad 0 smd oval (at 0.25 0 180) (size 0.2 1.2) (layers C1F F.Mask)
      (net 193 GND))
    (pad 0 smd rect (at 0 0 180) (size 0.5 1.2) (layers C1F F.Mask)
      (net 193 GND))
    (pad 0 smd oval (at -0.25 0.05 180) (size 0.2 1.1) (layers C1F F.Mask)
      (net 193 GND))
    (pad 0 smd rect (at -0.24 -0.49 135) (size 0.17112 0.14224) (layers C1F F.Mask)
      (net 193 GND))
    (pad 0 smd rect (at -0.25 -0.425 180) (size 0.2 0.15) (layers C1F F.Mask)
      (net 193 GND))
    (pad 0 smd rect (at 0 0 180) (size 0.6 1.1) (layers C1F F.Paste)
      (net 193 GND) (solder_paste_margin_ratio -0.01))
  )
  (module hackrf:GSG-SKY13350-385LF (layer C1F) (tedit 526ED53C)
    (at 104.9634 158.164 90)
    (solder_paste_ratio -0.02)
    (fp_text reference U10 (at 0 0 90) (layer F.SilkS))
    (fp_text value SKY13350 (at 0 0 90) (layer F.SilkS) hide)
    (pad 1 smd rect (at -0.6435 -0.24892 90) (size 0.645 0.23) (layers C1F F.Paste F.Mask)
      (net 204 RX) (die_length -2147.483648))
    (pad 3 smd rect (at 0 0.552 90) (size 0.3 0.813) (layers C1F F.Paste F.Mask)
      (net 193 GND) (die_length -2147.483648))
    (pad 4 smd rect (at 0.6435 0.24892 90) (size 0.645 0.23) (layers C1F F.Paste F.Mask)
      (net 240 "Net-(C23-Pad1)") (die_length 0.0508))
    (pad 5 smd rect (at 0.6435 -0.24892 90) (size 0.645 0.23) (layers C1F F.Paste F.Mask)
      (net 215 TX) (die_length 10.53846))
    (pad 6 smd rect (at 0 -0.552 90) (size 0.3 0.813) (layers C1F F.Paste F.Mask)
      (net 257 "Net-(C46-Pad1)") (die_length -2147.483648))
    (pad 2 smd rect (at -0.6435 0.24892 90) (size 0.645 0.23) (layers C1F F.Paste F.Mask)
      (net 261 "Net-(C51-Pad2)") (die_length -2147.483648))
  )
  (module hackrf:GSG-SKY13350-385LF (layer C1F) (tedit 526ED53C)
    (at 109.6285 156.2753)
    (solder_paste_ratio -0.02)
    (fp_text reference U11 (at 0 0) (layer F.SilkS))
    (fp_text value SKY13350 (at 0 0) (layer F.SilkS) hide)
    (pad 1 smd rect (at -0.6435 -0.24892) (size 0.645 0.23) (layers C1F F.Paste F.Mask)
      (net 201 MIX_BYPASS) (die_length -2147.483648))
    (pad 3 smd rect (at 0 0.552) (size 0.3 0.813) (layers C1F F.Paste F.Mask)
      (net 193 GND) (die_length -2147.483648))
    (pad 4 smd rect (at 0.6435 0.24892) (size 0.645 0.23) (layers C1F F.Paste F.Mask)
      (net 262 "Net-(C51-Pad1)") (die_length 0.0508))
    (pad 5 smd rect (at 0.6435 -0.24892) (size 0.645 0.23) (layers C1F F.Paste F.Mask)
      (net 1 !MIX_BYPASS) (die_length 10.53846))
    (pad 6 smd rect (at 0 -0.552) (size 0.3 0.813) (layers C1F F.Paste F.Mask)
      (net 258 "Net-(C48-Pad1)") (die_length -2147.483648))
    (pad 2 smd rect (at -0.6435 0.24892) (size 0.645 0.23) (layers C1F F.Paste F.Mask)
      (net 252 "Net-(C43-Pad2)") (die_length -2147.483648))
  )
  (module hackrf:GSG-SKY13317-373LF (layer C1F) (tedit 537A5509)
    (at 77.71 153.809 270)
    (fp_text reference U12 (at 0 0 270) (layer F.SilkS))
    (fp_text value SKY13317 (at 0 0 270) (layer F.SilkS) hide)
    (pad 1 smd rect (at -0.95 -0.6 270) (size 0.8 0.24) (layers C1F F.Paste F.Mask)
      (net 255 "Net-(C44-Pad1)"))
    (pad 2 smd rect (at -0.95 -0.2 270) (size 0.8 0.24) (layers C1F F.Paste F.Mask)
      (net 330 "Net-(U12-Pad2)"))
    (pad 3 smd rect (at -0.95 0.2 270) (size 0.8 0.24) (layers C1F F.Paste F.Mask)
      (net 206 RX_AMP))
    (pad 4 smd rect (at -0.95 0.6 270) (size 0.8 0.24) (layers C1F F.Paste F.Mask)
      (net 40 /frontend/RX_AMP_OUT))
    (pad 5 smd rect (at 0.95 0.6 270) (size 0.8 0.24) (layers C1F F.Paste F.Mask)
      (net 267 "Net-(C61-Pad2)"))
    (pad 6 smd rect (at 0.95 0.2 270) (size 0.8 0.24) (layers C1F F.Paste F.Mask)
      (net 167 AMP_BYPASS))
    (pad 7 smd rect (at 0.95 -0.2 270) (size 0.8 0.24) (layers C1F F.Paste F.Mask)
      (net 217 TX_AMP))
    (pad 8 smd rect (at 0.95 -0.6 270) (size 0.8 0.24) (layers C1F F.Paste F.Mask)
      (net 41 /frontend/TX_AMP_IN))
    (pad 0 smd rect (at 0 0 270) (size 0.2 1.3) (layers C1F F.Mask)
      (net 193 GND) (solder_paste_margin_ratio -0.01))
    (pad 0 smd oval (at 0.25 0 270) (size 0.2 1.2) (layers C1F F.Mask)
      (net 193 GND))
    (pad 0 smd rect (at 0 0 270) (size 0.5 1.2) (layers C1F F.Mask)
      (net 193 GND))
    (pad 0 smd oval (at -0.25 0.05 270) (size 0.2 1.1) (layers C1F F.Mask)
      (net 193 GND))
    (pad 0 smd rect (at -0.24 -0.49 225) (size 0.17112 0.14224) (layers C1F F.Mask)
      (net 193 GND))
    (pad 0 smd rect (at -0.25 -0.425 270) (size 0.2 0.15) (layers C1F F.Mask)
      (net 193 GND))
    (pad 0 smd rect (at 0 0 270) (size 0.6 1.1) (layers C1F F.Paste)
      (net 193 GND) (solder_paste_margin_ratio -0.01))
  )
  (module hackrf:GSG-SOT363 (layer C1F) (tedit 5099C1B1)
    (at 72.884 154.952 270)
    (fp_text reference U13 (at 0 -0.1778 270) (layer F.SilkS))
    (fp_text value MGA-81563 (at 0 0 270) (layer F.SilkS) hide)
    (pad 1 smd rect (at -0.6604 1.0033 270) (size 0.4572 0.9906) (layers C1F F.Paste F.Mask)
      (net 193 GND) (die_length 0.08382))
    (pad 2 smd rect (at 0 1.0033 270) (size 0.4572 0.9906) (layers C1F F.Paste F.Mask)
      (net 193 GND) (die_length -2147.483648))
    (pad 3 smd rect (at 0.6604 1.0033 270) (size 0.4572 0.9906) (layers C1F F.Paste F.Mask)
      (net 264 "Net-(C58-Pad2)") (die_length -2147.483648))
    (pad 4 smd rect (at 0.6604 -1.0033 270) (size 0.4572 0.9906) (layers C1F F.Paste F.Mask)
      (net 193 GND) (die_length -2147.483648))
    (pad 5 smd rect (at 0 -1.0033 270) (size 0.4572 0.9906) (layers C1F F.Paste F.Mask)
      (net 193 GND) (die_length 0.12192))
    (pad 6 smd rect (at -0.6604 -1.0033 270) (size 0.4572 0.9906) (layers C1F F.Paste F.Mask)
      (net 260 "Net-(C50-Pad1)") (die_length 0.1651))
  )
  (module hackrf:GSG-SKY13317-373LF (layer C1F) (tedit 537A5509)
    (at 73.1126 159.1176 90)
    (fp_text reference U14 (at 0 0 90) (layer F.SilkS))
    (fp_text value SKY13317 (at 0 0 90) (layer F.SilkS) hide)
    (pad 1 smd rect (at -0.95 -0.6 90) (size 0.8 0.24) (layers C1F F.Paste F.Mask)
      (net 271 "Net-(C64-Pad1)"))
    (pad 2 smd rect (at -0.95 -0.2 90) (size 0.8 0.24) (layers C1F F.Paste F.Mask)
      (net 331 "Net-(U14-Pad2)"))
    (pad 3 smd rect (at -0.95 0.2 90) (size 0.8 0.24) (layers C1F F.Paste F.Mask)
      (net 217 TX_AMP))
    (pad 4 smd rect (at -0.95 0.6 90) (size 0.8 0.24) (layers C1F F.Paste F.Mask)
      (net 42 /frontend/TX_AMP_OUT))
    (pad 5 smd rect (at 0.95 0.6 90) (size 0.8 0.24) (layers C1F F.Paste F.Mask)
      (net 268 "Net-(C61-Pad1)"))
    (pad 6 smd rect (at 0.95 0.2 90) (size 0.8 0.24) (layers C1F F.Paste F.Mask)
      (net 167 AMP_BYPASS))
    (pad 7 smd rect (at 0.95 -0.2 90) (size 0.8 0.24) (layers C1F F.Paste F.Mask)
      (net 206 RX_AMP))
    (pad 8 smd rect (at 0.95 -0.6 90) (size 0.8 0.24) (layers C1F F.Paste F.Mask)
      (net 265 "Net-(C58-Pad1)"))
    (pad 0 smd rect (at 0 0 90) (size 0.2 1.3) (layers C1F F.Mask)
      (net 193 GND) (solder_paste_margin_ratio -0.01))
    (pad 0 smd oval (at 0.25 0 90) (size 0.2 1.2) (layers C1F F.Mask)
      (net 193 GND))
    (pad 0 smd rect (at 0 0 90) (size 0.5 1.2) (layers C1F F.Mask)
      (net 193 GND))
    (pad 0 smd oval (at -0.25 0.05 90) (size 0.2 1.1) (layers C1F F.Mask)
      (net 193 GND))
    (pad 0 smd rect (at -0.24 -0.49 45) (size 0.17112 0.14224) (layers C1F F.Mask)
      (net 193 GND))
    (pad 0 smd rect (at -0.25 -0.425 90) (size 0.2 0.15) (layers C1F F.Mask)
      (net 193 GND))
    (pad 0 smd rect (at 0 0 90) (size 0.6 1.1) (layers C1F F.Paste)
      (net 193 GND) (solder_paste_margin_ratio -0.01))
  )
  (module hackrf:GSG-LXES1TBCC2-004 (layer C1F) (tedit 52F13010)
    (at 170.025 124.875 270)
    (fp_text reference U15 (at 0 0.1 270) (layer F.SilkS))
    (fp_text value LXES1TBCC2-004 (at 0 0 270) (layer F.SilkS) hide)
    (pad 1 smd rect (at 0.5 -0.95 270) (size 0.3 0.9) (layers C1F F.Paste F.Mask)
      (net 296 "Net-(J1-Pad3)") (die_length -2147.483648))
    (pad 2 smd rect (at 0 -0.95 270) (size 0.3 0.9) (layers C1F F.Paste F.Mask)
      (net 193 GND) (die_length -2147.483648))
    (pad 3 smd rect (at -0.5 -0.95 270) (size 0.3 0.9) (layers C1F F.Paste F.Mask)
      (net 297 "Net-(J1-Pad2)") (die_length -2147.483648))
    (pad 4 smd rect (at -0.5 0.95 270) (size 0.3 0.9) (layers C1F F.Paste F.Mask)
      (net 332 "Net-(U15-Pad4)") (die_length 0.01524))
    (pad 5 smd rect (at 0 0.95 270) (size 0.3 0.9) (layers C1F F.Paste F.Mask)
      (net 160 /mcu/usb/power/VBUS))
    (pad 6 smd rect (at 0.5 0.95 270) (size 0.3 0.9) (layers C1F F.Paste F.Mask)
      (net 333 "Net-(U15-Pad6)") (die_length 0.08128))
    (pad 0 smd rect (at 0 0 270) (size 1.1 0.5) (layers C1F F.Paste F.Mask))
  )
  (module hackrf:GSG-SOIC8-208 (layer C1F) (tedit 4F8A53A2)
    (at 160.7566 158.6484 180)
    (fp_text reference U20 (at 0 0 180) (layer F.SilkS))
    (fp_text value W25Q80 (at 0 0 180) (layer F.SilkS) hide)
    (pad 1 smd rect (at -3.81 -1.905 180) (size 1.905 0.635) (layers C1F F.Paste F.Mask)
      (net 146 /mcu/usb/power/SPIFI_CS) (die_length 0.08382))
    (pad 2 smd rect (at -3.81 -0.635 180) (size 1.905 0.635) (layers C1F F.Paste F.Mask)
      (net 147 /mcu/usb/power/SPIFI_MISO) (die_length 0.08128))
    (pad 3 smd rect (at -3.81 0.635 180) (size 1.905 0.635) (layers C1F F.Paste F.Mask)
      (net 150 /mcu/usb/power/SPIFI_SIO2) (die_length 0.1143))
    (pad 4 smd rect (at -3.81 1.905 180) (size 1.905 0.635) (layers C1F F.Paste F.Mask)
      (net 193 GND) (die_length 0.53086))
    (pad 5 smd rect (at 3.81 1.905 180) (size 1.905 0.635) (layers C1F F.Paste F.Mask)
      (net 148 /mcu/usb/power/SPIFI_MOSI) (die_length -2147.483648))
    (pad 6 smd rect (at 3.81 0.635 180) (size 1.905 0.635) (layers C1F F.Paste F.Mask)
      (net 149 /mcu/usb/power/SPIFI_SCK) (die_length -2147.483648))
    (pad 7 smd rect (at 3.81 -0.635 180) (size 1.905 0.635) (layers C1F F.Paste F.Mask)
      (net 151 /mcu/usb/power/SPIFI_SIO3) (die_length 0.00254))
    (pad 8 smd rect (at 3.81 -1.905 180) (size 1.905 0.635) (layers C1F F.Paste F.Mask)
      (net 221 VCC) (die_length 0.08382))
  )
  (module hackrf:GSG-S-PVSON-N10 (layer C1F) (tedit 527E9ACF)
    (at 169.53 111.9512 180)
    (fp_text reference U21 (at 0 0 180) (layer F.SilkS))
    (fp_text value TPS62410 (at 0 0 180) (layer F.SilkS) hide)
    (pad 1 smd rect (at -1.5 -1 180) (size 0.85 0.28) (layers C1F F.Paste F.Mask)
      (net 284 "Net-(C125-Pad2)"))
    (pad 2 smd rect (at -1.5 -0.5 180) (size 0.85 0.28) (layers C1F F.Paste F.Mask)
      (net 315 "Net-(R51-Pad1)"))
    (pad 3 smd rect (at -1.5 0 180) (size 0.85 0.28) (layers C1F F.Paste F.Mask)
      (net 162 /mcu/usb/power/VIN))
    (pad 4 smd rect (at -1.5 0.5 180) (size 0.85 0.28) (layers C1F F.Paste F.Mask)
      (net 115 /mcu/usb/power/REG_OUT1))
    (pad 5 smd rect (at -1.5 1 180) (size 0.85 0.28) (layers C1F F.Paste F.Mask)
      (net 317 "Net-(R55-Pad2)"))
    (pad 6 smd rect (at 1.5 1 180) (size 0.85 0.28) (layers C1F F.Paste F.Mask)
      (net 303 "Net-(L11-Pad2)"))
    (pad 7 smd rect (at 1.5 0.5 180) (size 0.85 0.28) (layers C1F F.Paste F.Mask)
      (net 316 "Net-(R52-Pad2)"))
    (pad 8 smd rect (at 1.5 0 180) (size 0.85 0.28) (layers C1F F.Paste F.Mask)
      (net 193 GND))
    (pad 9 smd rect (at 1.5 -0.5 180) (size 0.85 0.28) (layers C1F F.Paste F.Mask)
      (net 87 /mcu/usb/power/EN1V8))
    (pad 10 smd rect (at 1.5 -1 180) (size 0.85 0.28) (layers C1F F.Paste F.Mask)
      (net 302 "Net-(L10-Pad1)"))
    (pad 0 smd rect (at 0.41 0.6 180) (size 0.825 1.2) (layers C1F F.Paste F.Mask)
      (net 193 GND))
    (pad 0 smd rect (at 0.41 -0.6 180) (size 0.825 1.2) (layers C1F F.Paste F.Mask)
      (net 193 GND))
    (pad 0 smd rect (at -0.41 -0.6 180) (size 0.825 1.2) (layers C1F F.Paste F.Mask)
      (net 193 GND))
    (pad 0 smd rect (at -0.41 0.6 180) (size 0.825 1.2) (layers C1F F.Paste F.Mask)
      (net 193 GND))
    (pad 0 smd rect (at 0.25 -1.2 180) (size 0.28 1.4) (layers C1F F.Mask)
      (net 193 GND))
    (pad 0 smd rect (at -0.25 -1.2 180) (size 0.28 1.4) (layers C1F F.Mask)
      (net 193 GND))
    (pad 0 smd rect (at -0.25 1.2 180) (size 0.28 1.4) (layers C1F F.Mask)
      (net 193 GND))
    (pad 0 smd rect (at 0.25 1.2 180) (size 0.28 1.4) (layers C1F F.Mask)
      (net 193 GND))
    (pad 0 thru_hole circle (at 0 0 180) (size 0.585 0.585) (drill 0.33) (layers *.Cu *.Mask)
      (net 193 GND))
    (pad 0 thru_hole circle (at 0.5 -0.75 180) (size 0.585 0.585) (drill 0.33) (layers *.Cu *.Mask)
      (net 193 GND))
    (pad 0 thru_hole circle (at -0.5 -0.75 180) (size 0.585 0.585) (drill 0.3302) (layers *.Cu *.Mask)
      (net 193 GND))
    (pad 0 thru_hole circle (at -0.5 0.75 180) (size 0.585 0.585) (drill 0.3302) (layers *.Cu *.Mask)
      (net 193 GND))
    (pad 0 thru_hole circle (at 0.5 0.75 180) (size 0.585 0.585) (drill 0.3302) (layers *.Cu *.Mask)
      (net 193 GND))
    (pad 0 smd rect (at -0.25 -1.55 180) (size 0.28 0.7) (layers C1F F.Paste)
      (net 193 GND))
    (pad 0 smd rect (at 0.25 -1.55 180) (size 0.28 0.7) (layers C1F F.Paste)
      (net 193 GND))
    (pad 0 smd rect (at 0.25 1.55 180) (size 0.28 0.7) (layers C1F F.Paste)
      (net 193 GND))
    (pad 0 smd rect (at -0.25 1.55 180) (size 0.28 0.7) (layers C1F F.Paste)
      (net 193 GND))
  )
  (module hackrf:GSG-LQFP144 (layer C1F) (tedit 4F8A463D)
    (at 149.247794 140.14427 225)
    (fp_text reference U23 (at 0 0 225) (layer F.SilkS))
    (fp_text value LPC4320FBD144 (at 0 0 225) (layer F.SilkS) hide)
    (pad 1 smd rect (at -11.00074 -8.7503 225) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 194 HP) (die_length 0.01524))
    (pad 2 smd rect (at -11.00074 -8.24992 225) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 203 RSSI) (die_length 18.20672))
    (pad 3 smd rect (at -11.00074 -7.74954 225) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 107 /mcu/usb/power/LED1) (die_length 0.01524))
    (pad 4 smd rect (at -11.00074 -7.24916 225) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 193 GND) (die_length 0.01524))
    (pad 5 smd rect (at -11.00074 -6.74878 225) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 221 VCC) (die_length -2147.483648))
    (pad 6 smd rect (at -11.00074 -6.25094 225) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 43 /mcu/usb/power/ADC0_0) (die_length -2147.483648))
    (pad 7 smd rect (at -11.00074 -5.75056 225) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 145 /mcu/usb/power/SGPIO9) (die_length 28.61056))
    (pad 8 smd rect (at -11.00074 -5.25018 225) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 108 /mcu/usb/power/LED2) (die_length -2147.483648))
    (pad 9 smd rect (at -11.00074 -4.7498 225) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 216 TXENABLE))
    (pad 10 smd rect (at -11.00074 -4.24942 225) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 205 RXENABLE) (die_length 0.01524))
    (pad 11 smd rect (at -11.00074 -3.74904 225) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 222 XCVR_EN) (die_length -2147.483648))
    (pad 12 smd rect (at -11.00074 -3.2512 225) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 165 /mcu/usb/power/XTAL1) (die_length 18.20672))
    (pad 13 smd rect (at -11.00074 -2.75082 225) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 166 /mcu/usb/power/XTAL2) (die_length -2147.483648))
    (pad 14 smd rect (at -11.00074 -2.25044 225) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 97 /mcu/usb/power/GP_CLKIN) (die_length 0.01524))
    (pad 15 smd rect (at -11.00074 -1.75006 225) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 136 /mcu/usb/power/SGPIO13) (die_length 0.01524))
    (pad 16 smd rect (at -11.00074 -1.24968 225) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 221 VCC) (die_length 0.01524))
    (pad 17 smd rect (at -11.00074 -0.7493 225) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 221 VCC) (die_length 0.01524))
    (pad 18 smd rect (at -11.00074 -0.24892 225) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 86 /mcu/usb/power/DP) (die_length 0.04064))
    (pad 19 smd rect (at -11.00074 0.24892 225) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 193 GND) (die_length 0.01524))
    (pad 20 smd rect (at -11.00074 0.7493 225) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 85 /mcu/usb/power/DM) (die_length 0.01524))
    (pad 21 smd rect (at -11.00074 1.24968 225) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 318 "Net-(R62-Pad1)") (die_length -2147.483648))
    (pad 22 smd rect (at -11.00074 1.75006 225) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 295 "Net-(J1-Pad4)") (die_length -2147.483648))
    (pad 23 smd rect (at -11.00074 2.25044 225) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 193 GND) (die_length -2147.483648))
    (pad 24 smd rect (at -11.00074 2.75082 225) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 118 /mcu/usb/power/RREF) (die_length -2147.483648))
    (pad 25 smd rect (at -11.00074 3.2512 225) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 221 VCC) (die_length 0.01524))
    (pad 26 smd rect (at -11.00074 3.74904 225) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 153 /mcu/usb/power/TDI) (die_length 0.01524))
    (pad 27 smd rect (at -11.00074 4.24942 225) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 152 /mcu/usb/power/TCK) (die_length -2147.483648))
    (pad 28 smd rect (at -11.00074 4.7498 225) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 84 /mcu/usb/power/DBGEN) (die_length 0.01524))
    (pad 29 smd rect (at -11.00074 5.25018 225) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 309 "Net-(P24-Pad1)") (die_length 0.01524))
    (pad 30 smd rect (at -11.00074 5.75056 225) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 155 /mcu/usb/power/TMS) (die_length -2147.483648))
    (pad 31 smd rect (at -11.00074 6.25094 225) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 154 /mcu/usb/power/TDO) (die_length 0.01524))
    (pad 32 smd rect (at -11.00074 6.74878 225) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 131 /mcu/usb/power/SGPIO0) (die_length 0.01524))
    (pad 33 smd rect (at -11.00074 7.24916 225) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 137 /mcu/usb/power/SGPIO14) (die_length -2147.483648))
    (pad 34 smd rect (at -11.00074 7.74954 225) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 132 /mcu/usb/power/SGPIO1) (die_length -2147.483648))
    (pad 35 smd rect (at -11.00074 8.24992 225) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 138 /mcu/usb/power/SGPIO15) (die_length 18.20672))
    (pad 36 smd rect (at -11.00074 8.7503 225) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 221 VCC) (die_length -2147.483648))
    (pad 37 smd rect (at -8.7503 11.00074 315) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 4 !VAA_ENABLE) (die_length -2147.483648))
    (pad 38 smd rect (at -8.24992 11.00074 315) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 144 /mcu/usb/power/SGPIO7) (die_length 0.01524))
    (pad 39 smd rect (at -7.74954 11.00074 315) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 195 LP) (die_length 0.01524))
    (pad 40 smd rect (at -7.24916 11.00074 315) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 193 GND) (die_length 18.20672))
    (pad 41 smd rect (at -6.74878 11.00074 315) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 221 VCC) (die_length 0.01524))
    (pad 42 smd rect (at -6.25094 11.00074 315) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 110 /mcu/usb/power/P1_1) (die_length 0.01524))
    (pad 43 smd rect (at -5.75056 11.00074 315) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 111 /mcu/usb/power/P1_2) (die_length -2147.483648))
    (pad 44 smd rect (at -5.25018 11.00074 315) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 212 SSP1_MISO) (die_length -2147.483648))
    (pad 45 smd rect (at -4.7498 11.00074 315) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 123 /mcu/usb/power/SD_CLK) (die_length 0.01778))
    (pad 46 smd rect (at -4.24942 11.00074 315) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 219 TX_MIX_BP) (die_length 0.01524))
    (pad 47 smd rect (at -3.74904 11.00074 315) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 213 SSP1_MOSI) (die_length 0.01524))
    (pad 48 smd rect (at -3.2512 11.00074 315) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 129 /mcu/usb/power/SD_POW) (die_length -2147.483648))
    (pad 49 smd rect (at -2.75082 11.00074 315) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 124 /mcu/usb/power/SD_CMD) (die_length 0.01524))
    (pad 50 smd rect (at -2.25044 11.00074 315) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 1 !MIX_BYPASS) (die_length -2147.483648))
    (pad 51 smd rect (at -1.75006 11.00074 315) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 130 /mcu/usb/power/SD_VOLT0) (die_length -2147.483648))
    (pad 52 smd rect (at -1.24968 11.00074 315) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 125 /mcu/usb/power/SD_DAT0) (die_length 0.01524))
    (pad 53 smd rect (at -0.7493 11.00074 315) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 126 /mcu/usb/power/SD_DAT1) (die_length 0.01524))
    (pad 54 smd rect (at -0.24892 11.00074 315) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 208 RX_MIX_BP) (die_length -2147.483648))
    (pad 55 smd rect (at 0.24892 11.00074 315) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 127 /mcu/usb/power/SD_DAT2) (die_length -2147.483648))
    (pad 56 smd rect (at 0.7493 11.00074 315) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 128 /mcu/usb/power/SD_DAT3) (die_length 0.01524))
    (pad 57 smd rect (at 1.24968 11.00074 315) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 197 MIXER_ENX) (die_length -2147.483648))
    (pad 58 smd rect (at 1.75006 11.00074 315) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 198 MIXER_RESETX) (die_length 0.01524))
    (pad 59 smd rect (at 2.25044 11.00074 315) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 221 VCC) (die_length 0.01524))
    (pad 60 smd rect (at 2.75082 11.00074 315) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 122 /mcu/usb/power/SD_CD) (die_length -2147.483648))
    (pad 61 smd rect (at 3.2512 11.00074 315) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 133 /mcu/usb/power/SGPIO10) (die_length 0.01524))
    (pad 62 smd rect (at 3.74904 11.00074 315) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 139 /mcu/usb/power/SGPIO2) (die_length -2147.483648))
    (pad 63 smd rect (at 4.24942 11.00074 315) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 217 TX_AMP) (die_length -2147.483648))
    (pad 64 smd rect (at 4.7498 11.00074 315) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 140 /mcu/usb/power/SGPIO3) (die_length 0.01524))
    (pad 65 smd rect (at 5.25018 11.00074 315) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 171 CS_AD) (die_length -2147.483648))
    (pad 66 smd rect (at 5.75056 11.00074 315) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 134 /mcu/usb/power/SGPIO11) (die_length 0.01524))
    (pad 67 smd rect (at 6.25094 11.00074 315) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 135 /mcu/usb/power/SGPIO12) (die_length 0.01524))
    (pad 68 smd rect (at 6.74878 11.00074 315) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 214 SSP1_SCK) (die_length -2147.483648))
    (pad 69 smd rect (at 7.24916 11.00074 315) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 82 /mcu/usb/power/CPLD_TDO) (die_length 0.01524))
    (pad 70 smd rect (at 7.74954 11.00074 315) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 172 CS_XCVR) (die_length -2147.483648))
    (pad 71 smd rect (at 8.24992 11.00074 315) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 221 VCC) (die_length 0.01524))
    (pad 72 smd rect (at 8.7503 11.00074 315) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 211 SGPIO_CLK) (die_length -2147.483648))
    (pad 73 smd rect (at 11.00074 8.7503 225) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 100 /mcu/usb/power/I2S0_RX_MCLK) (die_length 0.01524))
    (pad 74 smd rect (at 11.00074 8.24992 225) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 80 /mcu/usb/power/CPLD_TCK) (die_length -2147.483648))
    (pad 75 smd rect (at 11.00074 7.74954 225) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 157 /mcu/usb/power/U0_TXD) (die_length -2147.483648))
    (pad 76 smd rect (at 11.00074 7.24916 225) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 193 GND) (die_length 0.01524))
    (pad 77 smd rect (at 11.00074 6.74878 225) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 221 VCC) (die_length 0.01524))
    (pad 78 smd rect (at 11.00074 6.25094 225) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 81 /mcu/usb/power/CPLD_TDI) (die_length 0.01524))
    (pad 79 smd rect (at 11.00074 5.75056 225) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 141 /mcu/usb/power/SGPIO4) (die_length -2147.483648))
    (pad 80 smd rect (at 11.00074 5.25018 225) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 200 MIXER_SDATA) (die_length 0.01524))
    (pad 81 smd rect (at 11.00074 4.7498 225) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 156 /mcu/usb/power/U0_RXD) (die_length 0.01524))
    (pad 82 smd rect (at 11.00074 4.24942 225) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 83 /mcu/usb/power/CPLD_TMS) (die_length -2147.483648))
    (pad 83 smd rect (at 11.00074 3.74904 225) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 142 /mcu/usb/power/SGPIO5) (die_length 0.01524))
    (pad 84 smd rect (at 11.00074 3.2512 225) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 143 /mcu/usb/power/SGPIO6) (die_length 18.20672))
    (pad 85 smd rect (at 11.00074 2.75082 225) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 215 TX) (die_length -2147.483648))
    (pad 86 smd rect (at 11.00074 2.25044 225) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 201 MIX_BYPASS) (die_length 18.20672))
    (pad 87 smd rect (at 11.00074 1.75006 225) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 99 /mcu/usb/power/I2C1_SDA) (die_length 0.01524))
    (pad 88 smd rect (at 11.00074 1.24968 225) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 98 /mcu/usb/power/I2C1_SCL) (die_length -2147.483648))
    (pad 89 smd rect (at 11.00074 0.7493 225) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 345 "Net-(U23-Pad89)") (die_length 0.01524))
    (pad 90 smd rect (at 11.00074 0.24892 225) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 346 "Net-(U23-Pad90)") (die_length 18.20672))
    (pad 91 smd rect (at 11.00074 -0.24892 225) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 204 RX) (die_length 0.01524))
    (pad 92 smd rect (at 11.00074 -0.7493 225) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 209 SCL) (die_length -2147.483648))
    (pad 93 smd rect (at 11.00074 -1.24968 225) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 210 SDA) (die_length 0.01524))
    (pad 94 smd rect (at 11.00074 -1.75006 225) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 221 VCC) (die_length 0.01524))
    (pad 95 smd rect (at 11.00074 -2.25044 225) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 199 MIXER_SCLK) (die_length -2147.483648))
    (pad 96 smd rect (at 11.00074 -2.75082 225) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 106 /mcu/usb/power/ISP) (die_length -2147.483648))
    (pad 97 smd rect (at 11.00074 -3.2512 225) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 3 !TX_AMP_PWR) (die_length 0.01524))
    (pad 98 smd rect (at 11.00074 -3.74904 225) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 113 /mcu/usb/power/P2_8) (die_length 0.01524))
    (pad 99 smd rect (at 11.00074 -4.24942 225) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 104 /mcu/usb/power/I2S0_TX_MCLK) (die_length -2147.483648))
    (pad 100 smd rect (at 11.00074 -4.7498 225) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 87 /mcu/usb/power/EN1V8) (die_length 0.01016))
    (pad 101 smd rect (at 11.00074 -5.25018 225) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 163 /mcu/usb/power/VREGMODE) (die_length 18.20672))
    (pad 102 smd rect (at 11.00074 -5.75056 225) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 114 /mcu/usb/power/P2_9) (die_length -2147.483648))
    (pad 103 smd rect (at 11.00074 -6.25094 225) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 109 /mcu/usb/power/LED3) (die_length 0.01778))
    (pad 104 smd rect (at 11.00074 -6.74878 225) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 167 AMP_BYPASS) (die_length 0.01524))
    (pad 105 smd rect (at 11.00074 -7.24916 225) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 206 RX_AMP) (die_length 0.01524))
    (pad 106 smd rect (at 11.00074 -7.74954 225) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 2 !RX_AMP_PWR) (die_length -2147.483648))
    (pad 107 smd rect (at 11.00074 -8.24992 225) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 221 VCC) (die_length 0.01524))
    (pad 108 smd rect (at 11.00074 -8.7503 225) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 112 /mcu/usb/power/P2_13) (die_length 18.20672))
    (pad 109 smd rect (at 8.7503 -11.00074 315) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 193 GND) (die_length 0.01524))
    (pad 110 smd rect (at 8.24992 -11.00074 315) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 95 /mcu/usb/power/GPIO3_8) (die_length -2147.483648))
    (pad 111 smd rect (at 7.74954 -11.00074 315) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 221 VCC) (die_length 0.01524))
    (pad 112 smd rect (at 7.24916 -11.00074 315) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 105 /mcu/usb/power/I2S0_TX_SCK) (die_length -2147.483648))
    (pad 113 smd rect (at 6.74878 -11.00074 315) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 96 /mcu/usb/power/GPIO3_9) (die_length -2147.483648))
    (pad 114 smd rect (at 6.25094 -11.00074 315) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 103 /mcu/usb/power/I2S0_RX_WS) (die_length 18.20672))
    (pad 115 smd rect (at 5.75056 -11.00074 315) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 89 /mcu/usb/power/GPIO3_10) (die_length -2147.483648))
    (pad 116 smd rect (at 5.25018 -11.00074 315) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 102 /mcu/usb/power/I2S0_RX_SDA) (die_length -2147.483648))
    (pad 117 smd rect (at 4.7498 -11.00074 315) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 90 /mcu/usb/power/GPIO3_11) (die_length 0.08382))
    (pad 118 smd rect (at 4.24942 -11.00074 315) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 149 /mcu/usb/power/SPIFI_SCK) (die_length 18.20672))
    (pad 119 smd rect (at 3.74904 -11.00074 315) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 151 /mcu/usb/power/SPIFI_SIO3) (die_length 18.20672))
    (pad 120 smd rect (at 3.2512 -11.00074 315) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 101 /mcu/usb/power/I2S0_RX_SCK) (die_length -2147.483648))
    (pad 121 smd rect (at 2.75082 -11.00074 315) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 150 /mcu/usb/power/SPIFI_SIO2) (die_length 0.01524))
    (pad 122 smd rect (at 2.25044 -11.00074 315) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 147 /mcu/usb/power/SPIFI_MISO) (die_length 0.01524))
    (pad 123 smd rect (at 1.75006 -11.00074 315) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 148 /mcu/usb/power/SPIFI_MOSI) (die_length -2147.483648))
    (pad 124 smd rect (at 1.24968 -11.00074 315) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 146 /mcu/usb/power/SPIFI_CS) (die_length -2147.483648))
    (pad 125 smd rect (at 0.7493 -11.00074 315) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 119 /mcu/usb/power/RTCX1) (die_length 0.01524))
    (pad 126 smd rect (at 0.24892 -11.00074 315) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 120 /mcu/usb/power/RTCX2) (die_length -2147.483648))
    (pad 127 smd rect (at -0.24892 -11.00074 315) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 159 /mcu/usb/power/VBAT) (die_length 0.01016))
    (pad 128 smd rect (at -0.7493 -11.00074 315) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 117 /mcu/usb/power/RESET) (die_length -2147.483648))
    (pad 129 smd rect (at -1.24968 -11.00074 315) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 121 /mcu/usb/power/RTC_ALARM) (die_length 0.01524))
    (pad 130 smd rect (at -1.75006 -11.00074 315) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 164 /mcu/usb/power/WAKEUP) (die_length 0.01524))
    (pad 131 smd rect (at -2.25044 -11.00074 315) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 221 VCC) (die_length -2147.483648))
    (pad 132 smd rect (at -2.75082 -11.00074 315) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 91 /mcu/usb/power/GPIO3_12) (die_length 0.01524))
    (pad 133 smd rect (at -3.2512 -11.00074 315) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 92 /mcu/usb/power/GPIO3_13) (die_length -2147.483648))
    (pad 134 smd rect (at -3.74904 -11.00074 315) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 93 /mcu/usb/power/GPIO3_14) (die_length -2147.483648))
    (pad 135 smd rect (at -4.24942 -11.00074 315) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 193 GND) (die_length -2147.483648))
    (pad 136 smd rect (at -4.7498 -11.00074 315) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 347 "Net-(U23-Pad136)") (die_length -2147.483648))
    (pad 137 smd rect (at -5.25018 -11.00074 315) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 221 VCC) (die_length 0.12192))
    (pad 138 smd rect (at -5.75056 -11.00074 315) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 348 "Net-(U23-Pad138)") (die_length 0.01524))
    (pad 139 smd rect (at -6.25094 -11.00074 315) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 349 "Net-(U23-Pad139)") (die_length -2147.483648))
    (pad 140 smd rect (at -6.74878 -11.00074 315) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 94 /mcu/usb/power/GPIO3_15) (die_length -2147.483648))
    (pad 141 smd rect (at -7.24916 -11.00074 315) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 221 VCC) (die_length -2147.483648))
    (pad 142 smd rect (at -7.74954 -11.00074 315) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 46 /mcu/usb/power/ADC0_6) (die_length 0.01524))
    (pad 143 smd rect (at -8.24992 -11.00074 315) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 44 /mcu/usb/power/ADC0_2) (die_length 18.20672))
    (pad 144 smd rect (at -8.7503 -11.00074 315) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 45 /mcu/usb/power/ADC0_5) (die_length 0.01524))
  )
  (module hackrf:GSG-VQ100 (layer C1F) (tedit 4F8A48B5)
    (at 126.746 117.0178 270)
    (fp_text reference U24 (at 0 0 270) (layer F.SilkS))
    (fp_text value GSG-XC2C64A-7VQG100C (at 0 0 270) (layer F.SilkS) hide)
    (pad 1 smd rect (at -8.001 -5.99948 270) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 52 /mcu/usb/power/B2AUX12) (die_length -2147.483648))
    (pad 2 smd rect (at -8.001 -5.4991 270) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 51 /mcu/usb/power/B2AUX11) (die_length 0.08382))
    (pad 3 smd rect (at -8.001 -5.00126 270) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 50 /mcu/usb/power/B2AUX10) (die_length 0.00254))
    (pad 4 smd rect (at -8.001 -4.50088 270) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 64 /mcu/usb/power/B2AUX9) (die_length -2147.483648))
    (pad 5 smd rect (at -8.001 -4.0005 270) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 221 VCC) (die_length 0.08382))
    (pad 6 smd rect (at -8.001 -3.50012 270) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 63 /mcu/usb/power/B2AUX8) (die_length -2147.483648))
    (pad 7 smd rect (at -8.001 -2.99974 270) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 62 /mcu/usb/power/B2AUX7) (die_length -2147.483648))
    (pad 8 smd rect (at -8.001 -2.49936 270) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 61 /mcu/usb/power/B2AUX6) (die_length -2147.483648))
    (pad 9 smd rect (at -8.001 -1.99898 270) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 60 /mcu/usb/power/B2AUX5) (die_length -2147.483648))
    (pad 10 smd rect (at -8.001 -1.50114 270) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 59 /mcu/usb/power/B2AUX4) (die_length -2147.483648))
    (pad 11 smd rect (at -8.001 -1.00076 270) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 58 /mcu/usb/power/B2AUX3) (die_length -2147.483648))
    (pad 12 smd rect (at -8.001 -0.50038 270) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 57 /mcu/usb/power/B2AUX2) (die_length 0.24638))
    (pad 13 smd rect (at -8.001 0 270) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 49 /mcu/usb/power/B2AUX1) (die_length -2147.483648))
    (pad 14 smd rect (at -8.001 0.50038 270) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 350 "Net-(U24-Pad14)") (die_length -2147.483648))
    (pad 15 smd rect (at -8.001 1.00076 270) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 351 "Net-(U24-Pad15)") (die_length -2147.483648))
    (pad 16 smd rect (at -8.001 1.50114 270) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 352 "Net-(U24-Pad16)") (die_length -2147.483648))
    (pad 17 smd rect (at -8.001 1.99898 270) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 190 DD9) (die_length -2147.483648))
    (pad 18 smd rect (at -8.001 2.49936 270) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 189 DD8) (die_length -2147.483648))
    (pad 19 smd rect (at -8.001 2.99974 270) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 188 DD7) (die_length -2147.483648))
    (pad 20 smd rect (at -8.001 3.50012 270) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 353 "Net-(U24-Pad20)") (die_length 0.01016))
    (pad 21 smd rect (at -8.001 4.0005 270) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 193 GND) (die_length -2147.483648))
    (pad 22 smd rect (at -8.001 4.50088 270) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 88 /mcu/usb/power/GCK0) (die_length -2147.483648))
    (pad 23 smd rect (at -8.001 5.00126 270) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 191 GCK1) (die_length -2147.483648))
    (pad 24 smd rect (at -8.001 5.4991 270) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 187 DD6) (die_length -2147.483648))
    (pad 25 smd rect (at -8.001 5.99948 270) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 354 "Net-(U24-Pad25)") (die_length -2147.483648))
    (pad 26 smd rect (at -5.99948 8.001) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 5 +1.8V) (die_length 1.59004))
    (pad 27 smd rect (at -5.4991 8.001) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 192 GCK2) (die_length -2147.483648))
    (pad 28 smd rect (at -5.00126 8.001) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 186 DD5) (die_length -2147.483648))
    (pad 29 smd rect (at -4.50088 8.001) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 185 DD4) (die_length -2147.483648))
    (pad 30 smd rect (at -4.0005 8.001) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 184 DD3) (die_length -2147.483648))
    (pad 31 smd rect (at -3.50012 8.001) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 193 GND))
    (pad 32 smd rect (at -2.99974 8.001) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 183 DD2) (die_length -2147.483648))
    (pad 33 smd rect (at -2.49936 8.001) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 182 DD1) (die_length -2147.483648))
    (pad 34 smd rect (at -1.99898 8.001) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 181 DD0) (die_length -2147.483648))
    (pad 35 smd rect (at -1.50114 8.001) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 180 DA7) (die_length 0.12192))
    (pad 36 smd rect (at -1.00076 8.001) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 179 DA6) (die_length 0.08382))
    (pad 37 smd rect (at -0.50038 8.001) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 178 DA5) (die_length -2147.483648))
    (pad 38 smd rect (at 0 8.001) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 221 VCC) (die_length -2147.483648))
    (pad 39 smd rect (at 0.50038 8.001) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 177 DA4) (die_length -2147.483648))
    (pad 40 smd rect (at 1.00076 8.001) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 176 DA3) (die_length -2147.483648))
    (pad 41 smd rect (at 1.50114 8.001) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 175 DA2) (die_length -2147.483648))
    (pad 42 smd rect (at 1.99898 8.001) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 174 DA1) (die_length 0.06096))
    (pad 43 smd rect (at 2.49936 8.001) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 173 DA0) (die_length -2147.483648))
    (pad 44 smd rect (at 2.99974 8.001) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 355 "Net-(U24-Pad44)") (die_length -2147.483648))
    (pad 45 smd rect (at 3.50012 8.001) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 81 /mcu/usb/power/CPLD_TDI) (die_length -2147.483648))
    (pad 46 smd rect (at 4.0005 8.001) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 356 "Net-(U24-Pad46)") (die_length -2147.483648))
    (pad 47 smd rect (at 4.50088 8.001) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 83 /mcu/usb/power/CPLD_TMS) (die_length 0.1397))
    (pad 48 smd rect (at 5.00126 8.001) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 80 /mcu/usb/power/CPLD_TCK) (die_length -2147.483648))
    (pad 49 smd rect (at 5.4991 8.001) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 357 "Net-(U24-Pad49)") (die_length -2147.483648))
    (pad 50 smd rect (at 5.99948 8.001) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 358 "Net-(U24-Pad50)") (die_length -2147.483648))
    (pad 51 smd rect (at 8.001 5.99948 270) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 221 VCC) (die_length 0.0889))
    (pad 52 smd rect (at 8.001 5.4991 270) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 359 "Net-(U24-Pad52)"))
    (pad 53 smd rect (at 8.001 5.00126 270) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 360 "Net-(U24-Pad53)") (die_length -2147.483648))
    (pad 54 smd rect (at 8.001 4.50088 270) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 361 "Net-(U24-Pad54)") (die_length -2147.483648))
    (pad 55 smd rect (at 8.001 4.0005 270) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 47 /mcu/usb/power/B1AUX13))
    (pad 56 smd rect (at 8.001 3.50012 270) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 48 /mcu/usb/power/B1AUX14) (die_length 0.08382))
    (pad 57 smd rect (at 8.001 2.99974 270) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 5 +1.8V) (die_length 0.07366))
    (pad 58 smd rect (at 8.001 2.49936 270) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 362 "Net-(U24-Pad58)") (die_length -2147.483648))
    (pad 59 smd rect (at 8.001 1.99898 270) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 363 "Net-(U24-Pad59)"))
    (pad 60 smd rect (at 8.001 1.50114 270) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 364 "Net-(U24-Pad60)") (die_length -2147.483648))
    (pad 61 smd rect (at 8.001 1.00076 270) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 71 /mcu/usb/power/BANK2F3M16) (die_length 0.08382))
    (pad 62 smd rect (at 8.001 0.50038 270) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 193 GND) (die_length -2147.483648))
    (pad 63 smd rect (at 8.001 0 270) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 365 "Net-(U24-Pad63)") (die_length 0.08128))
    (pad 64 smd rect (at 8.001 -0.50038 270) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 70 /mcu/usb/power/BANK2F3M15) (die_length 1.50622))
    (pad 65 smd rect (at 8.001 -1.00076 270) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 366 "Net-(U24-Pad65)") (die_length -2147.483648))
    (pad 66 smd rect (at 8.001 -1.50114 270) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 367 "Net-(U24-Pad66)") (die_length -2147.483648))
    (pad 67 smd rect (at 8.001 -1.99898 270) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 69 /mcu/usb/power/BANK2F3M14) (die_length -2147.483648))
    (pad 68 smd rect (at 8.001 -2.49936 270) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 368 "Net-(U24-Pad68)") (die_length -2147.483648))
    (pad 69 smd rect (at 8.001 -2.99974 270) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 193 GND) (die_length -2147.483648))
    (pad 70 smd rect (at 8.001 -3.50012 270) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 68 /mcu/usb/power/BANK2F3M12))
    (pad 71 smd rect (at 8.001 -4.0005 270) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 67 /mcu/usb/power/BANK2F3M11))
    (pad 72 smd rect (at 8.001 -4.50088 270) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 66 /mcu/usb/power/BANK2F3M10) (die_length 0.08382))
    (pad 73 smd rect (at 8.001 -5.00126 270) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 369 "Net-(U24-Pad73)") (die_length 0.1651))
    (pad 74 smd rect (at 8.001 -5.4991 270) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 79 /mcu/usb/power/BANK2F3M9) (die_length -2147.483648))
    (pad 75 smd rect (at 8.001 -5.99948 270) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 370 "Net-(U24-Pad75)") (die_length -2147.483648))
    (pad 76 smd rect (at 5.99948 -8.001) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 78 /mcu/usb/power/BANK2F3M8) (die_length -2147.483648))
    (pad 77 smd rect (at 5.4991 -8.001) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 77 /mcu/usb/power/BANK2F3M7) (die_length 0.28448))
    (pad 78 smd rect (at 5.00126 -8.001) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 76 /mcu/usb/power/BANK2F3M6) (die_length -2147.483648))
    (pad 79 smd rect (at 4.50088 -8.001) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 75 /mcu/usb/power/BANK2F3M5) (die_length 0.08382))
    (pad 80 smd rect (at 4.0005 -8.001) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 371 "Net-(U24-Pad80)") (die_length -2147.483648))
    (pad 81 smd rect (at 3.50012 -8.001) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 74 /mcu/usb/power/BANK2F3M4) (die_length -2147.483648))
    (pad 82 smd rect (at 2.99974 -8.001) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 372 "Net-(U24-Pad82)"))
    (pad 83 smd rect (at 2.49936 -8.001) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 82 /mcu/usb/power/CPLD_TDO) (die_length -2147.483648))
    (pad 84 smd rect (at 1.99898 -8.001) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 193 GND) (die_length 0.01016))
    (pad 85 smd rect (at 1.50114 -8.001) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 373 "Net-(U24-Pad85)") (die_length -2147.483648))
    (pad 86 smd rect (at 1.00076 -8.001) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 374 "Net-(U24-Pad86)") (die_length 0.08382))
    (pad 87 smd rect (at 0.50038 -8.001) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 375 "Net-(U24-Pad87)") (die_length 0.01524))
    (pad 88 smd rect (at 0 -8.001) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 221 VCC) (die_length -2147.483648))
    (pad 89 smd rect (at -0.50038 -8.001) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 73 /mcu/usb/power/BANK2F3M3) (die_length 0.08382))
    (pad 90 smd rect (at -1.00076 -8.001) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 72 /mcu/usb/power/BANK2F3M2) (die_length -2147.483648))
    (pad 91 smd rect (at -1.50114 -8.001) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 65 /mcu/usb/power/BANK2F3M1) (die_length -2147.483648))
    (pad 92 smd rect (at -1.99898 -8.001) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 56 /mcu/usb/power/B2AUX16) (die_length -2147.483648))
    (pad 93 smd rect (at -2.49936 -8.001) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 376 "Net-(U24-Pad93)") (die_length -2147.483648))
    (pad 94 smd rect (at -2.99974 -8.001) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 55 /mcu/usb/power/B2AUX15) (die_length 0.12192))
    (pad 95 smd rect (at -3.50012 -8.001) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 377 "Net-(U24-Pad95)") (die_length -2147.483648))
    (pad 96 smd rect (at -4.0005 -8.001) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 378 "Net-(U24-Pad96)") (die_length -2147.483648))
    (pad 97 smd rect (at -4.50088 -8.001) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 54 /mcu/usb/power/B2AUX14) (die_length -2147.483648))
    (pad 98 smd rect (at -5.00126 -8.001) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 221 VCC) (die_length -2147.483648))
    (pad 99 smd rect (at -5.4991 -8.001) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 53 /mcu/usb/power/B2AUX13) (die_length -2147.483648))
    (pad 100 smd rect (at -5.99948 -8.001) (size 1.50114 0.29464) (layers C1F F.Paste F.Mask)
      (net 193 GND) (die_length 18.20672))
  )
  (module hackrf:GSG-SOT363 (layer C1F) (tedit 5099C1B1)
    (at 79.742 158 90)
    (fp_text reference U25 (at 0 -0.1778 90) (layer F.SilkS))
    (fp_text value MGA-81563 (at 0 0 90) (layer F.SilkS) hide)
    (pad 1 smd rect (at -0.6604 1.0033 90) (size 0.4572 0.9906) (layers C1F F.Paste F.Mask)
      (net 193 GND) (die_length 0.08382))
    (pad 2 smd rect (at 0 1.0033 90) (size 0.4572 0.9906) (layers C1F F.Paste F.Mask)
      (net 193 GND) (die_length -2147.483648))
    (pad 3 smd rect (at 0.6604 1.0033 90) (size 0.4572 0.9906) (layers C1F F.Paste F.Mask)
      (net 266 "Net-(C59-Pad2)") (die_length -2147.483648))
    (pad 4 smd rect (at 0.6604 -1.0033 90) (size 0.4572 0.9906) (layers C1F F.Paste F.Mask)
      (net 193 GND) (die_length -2147.483648))
    (pad 5 smd rect (at 0 -1.0033 90) (size 0.4572 0.9906) (layers C1F F.Paste F.Mask)
      (net 193 GND) (die_length 0.12192))
    (pad 6 smd rect (at -0.6604 -1.0033 90) (size 0.4572 0.9906) (layers C1F F.Paste F.Mask)
      (net 269 "Net-(C62-Pad2)") (die_length 0.1651))
  )
  (module hackrf:GSG-XTAL3.2x2.5mm (layer C1F) (tedit 4E1A2084)
    (at 124.6752 168.768 90)
    (fp_text reference X1 (at 0 0 90) (layer F.SilkS))
    (fp_text value GSG-XTAL4PIN (at 0 0 90) (layer F.SilkS) hide)
    (pad 1 smd rect (at -1.09982 0.8001 90) (size 1.39954 1.19888) (layers C1F F.Paste F.Mask)
      (net 35 /baseband/XB) (die_length 0.08128))
    (pad 3 smd rect (at 1.09982 -0.8001 90) (size 1.39954 1.19888) (layers C1F F.Paste F.Mask)
      (net 34 /baseband/XA) (die_length 0.08382))
    (pad 2 smd rect (at 1.09982 0.8001 90) (size 1.39954 1.19888) (layers C1F F.Paste F.Mask)
      (net 193 GND) (die_length -2147.483648))
    (pad 4 smd rect (at -1.09982 -0.8001 90) (size 1.39954 1.19888) (layers C1F F.Paste F.Mask)
      (net 193 GND) (die_length -2147.483648))
  )
  (module hackrf:GSG-XTAL3.2x2.5mm (layer C1F) (tedit 4E1A2084)
    (at 163.149231 132.349408 45)
    (fp_text reference X2 (at 0 0 45) (layer F.SilkS))
    (fp_text value MCU_XTAL (at 0 0 45) (layer F.SilkS) hide)
    (pad 1 smd rect (at -1.09982 0.8001 45) (size 1.39954 1.19888) (layers C1F F.Paste F.Mask)
      (net 165 /mcu/usb/power/XTAL1) (die_length 0.08128))
    (pad 3 smd rect (at 1.09982 -0.8001 45) (size 1.39954 1.19888) (layers C1F F.Paste F.Mask)
      (net 166 /mcu/usb/power/XTAL2) (die_length 0.08382))
    (pad 2 smd rect (at 1.09982 0.8001 45) (size 1.39954 1.19888) (layers C1F F.Paste F.Mask)
      (net 193 GND) (die_length -2147.483648))
    (pad 4 smd rect (at -1.09982 -0.8001 45) (size 1.39954 1.19888) (layers C1F F.Paste F.Mask)
      (net 193 GND) (die_length -2147.483648))
  )
  (module hackrf:GSG-XTAL-AB26TRQ (layer C1F) (tedit 52904C10)
    (at 161.5 153.5)
    (fp_text reference X3 (at 3.1 0) (layer F.SilkS))
    (fp_text value RTC_XTAL (at 3.1 0) (layer F.SilkS) hide)
    (pad 2 smd rect (at 0 0.45) (size 1.1 0.6) (layers C1F F.Paste F.Mask)
      (net 119 /mcu/usb/power/RTCX1))
    (pad 1 smd rect (at 0 -0.45) (size 1.1 0.6) (layers C1F F.Paste F.Mask)
      (net 120 /mcu/usb/power/RTCX2))
    (pad 0 smd rect (at 5.55 0) (size 2.4 1.5) (layers C1F F.Paste F.Mask))
  )
  (module hackrf:GSG-QFN32 (layer C1F) (tedit 527E5F01)
    (at 92.6204 157.7636 270)
    (tags LFCSP)
    (solder_mask_margin 0.07112)
    (clearance 0.1524)
    (fp_text reference U4 (at 0 0 270) (layer F.SilkS))
    (fp_text value RFFC5072 (at 0 0 270) (layer F.SilkS) hide)
    (pad 1 smd oval (at -2.675 -1.75 270) (size 1.35 0.28) (layers C1F F.Paste F.Mask)
      (net 319 "Net-(U4-Pad1)"))
    (pad 2 smd oval (at -2.675 -1.25 270) (size 1.35 0.28) (layers C1F F.Paste F.Mask)
      (net 320 "Net-(U4-Pad2)"))
    (pad 3 smd oval (at -2.675 -0.75 270) (size 1.35 0.28) (layers C1F F.Paste F.Mask)
      (net 321 "Net-(U4-Pad3)"))
    (pad 4 smd oval (at -2.675 -0.25 270) (size 1.35 0.28) (layers C1F F.Paste F.Mask)
      (net 312 "Net-(R4-Pad2)"))
    (pad 5 smd oval (at -2.675 0.25 270) (size 1.35 0.28) (layers C1F F.Paste F.Mask)
      (net 220 VAA))
    (pad 6 smd oval (at -2.675 0.75 270) (size 1.35 0.28) (layers C1F F.Paste F.Mask)
      (net 228 "Net-(C14-Pad2)"))
    (pad 7 smd oval (at -2.675 1.25 270) (size 1.35 0.28) (layers C1F F.Paste F.Mask)
      (net 229 "Net-(C14-Pad1)"))
    (pad 8 smd oval (at -2.675 1.75 270) (size 1.35 0.28) (layers C1F F.Paste F.Mask)
      (net 226 "Net-(C12-Pad1)"))
    (pad 0 smd rect (at 0 0 270) (size 3.525 3.525) (layers C1F F.Mask)
      (net 193 GND) (solder_mask_margin -0.09906))
    (pad 0 thru_hole circle (at 0 0 270) (size 0.6 0.6) (drill 0.35) (layers *.Cu B.Mask)
      (net 193 GND))
    (pad 0 thru_hole circle (at -1.1 0 270) (size 0.6 0.6) (drill 0.35) (layers *.Cu B.Mask)
      (net 193 GND))
    (pad 0 thru_hole circle (at -1.1 -1.1 270) (size 0.6 0.6) (drill 0.35) (layers *.Cu B.Mask)
      (net 193 GND))
    (pad 0 thru_hole circle (at 0 -1.1 270) (size 0.6 0.6) (drill 0.35) (layers *.Cu B.Mask)
      (net 193 GND))
    (pad 0 thru_hole circle (at 1.1 -1.1 270) (size 0.6 0.6) (drill 0.35) (layers *.Cu B.Mask)
      (net 193 GND))
    (pad 0 thru_hole circle (at 1.1 0 270) (size 0.6 0.6) (drill 0.35) (layers *.Cu B.Mask)
      (net 193 GND))
    (pad 0 thru_hole circle (at 1.1 1.1 270) (size 0.6 0.6) (drill 0.35) (layers *.Cu B.Mask)
      (net 193 GND))
    (pad 0 thru_hole circle (at 0 1.1 270) (size 0.6 0.6) (drill 0.35) (layers *.Cu B.Mask)
      (net 193 GND))
    (pad 0 thru_hole circle (at -1.1 1.1 270) (size 0.6 0.6) (drill 0.35) (layers *.Cu B.Mask)
      (net 193 GND))
    (pad 0 smd rect (at -1.1 -1.1 270) (size 1.1 1.1) (layers C1F F.Paste)
      (net 193 GND))
    (pad 0 smd rect (at 0 -1.1 270) (size 1.1 1.1) (layers C1F F.Paste)
      (net 193 GND))
    (pad 0 smd rect (at 1.1 -1.1 270) (size 1.1 1.1) (layers C1F F.Paste)
      (net 193 GND))
    (pad 0 smd rect (at -1.1 0 270) (size 1.1 1.1) (layers C1F F.Paste)
      (net 193 GND))
    (pad 0 smd rect (at 0 0 270) (size 1.1 1.1) (layers C1F F.Paste)
      (net 193 GND))
    (pad 0 smd rect (at 1.1 0 270) (size 1.1 1.1) (layers C1F F.Paste)
      (net 193 GND))
    (pad 0 smd rect (at -1.1 1.1 270) (size 1.1 1.1) (layers C1F F.Paste)
      (net 193 GND))
    (pad 0 smd rect (at 0 1.1 270) (size 1.1 1.1) (layers C1F F.Paste)
      (net 193 GND))
    (pad 0 smd rect (at 1.1 1.1 270) (size 1.1 1.1) (layers C1F F.Paste)
      (net 193 GND))
    (pad 9 smd oval (at -1.75 2.675) (size 1.35 0.28) (layers C1F F.Paste F.Mask)
      (net 307 "Net-(P17-Pad1)"))
    (pad 10 smd oval (at -1.25 2.675) (size 1.35 0.28) (layers C1F F.Paste F.Mask)
      (net 39 /frontend/REF_IN))
    (pad 11 smd oval (at -0.75 2.675) (size 1.35 0.28) (layers C1F F.Paste F.Mask)
      (net 322 "Net-(U4-Pad11)"))
    (pad 12 smd oval (at -0.25 2.675) (size 1.35 0.28) (layers C1F F.Paste F.Mask)
      (net 193 GND))
    (pad 13 smd oval (at 0.25 2.675) (size 1.35 0.28) (layers C1F F.Paste F.Mask)
      (net 323 "Net-(U4-Pad13)"))
    (pad 14 smd oval (at 0.75 2.675) (size 1.35 0.28) (layers C1F F.Paste F.Mask)
      (net 324 "Net-(U4-Pad14)"))
    (pad 15 smd oval (at 1.25 2.675) (size 1.35 0.28) (layers C1F F.Paste F.Mask)
      (net 38 /frontend/!ANT_BIAS))
    (pad 16 smd oval (at 1.75 2.675) (size 1.35 0.28) (layers C1F F.Paste F.Mask)
      (net 306 "Net-(P7-Pad1)"))
    (pad 17 smd oval (at 2.675 1.75 270) (size 1.35 0.28) (layers C1F F.Paste F.Mask)
      (net 325 "Net-(U4-Pad17)"))
    (pad 18 smd oval (at 2.675 1.25 270) (size 1.35 0.28) (layers C1F F.Paste F.Mask)
      (net 326 "Net-(U4-Pad18)"))
    (pad 19 smd oval (at 2.675 0.75 270) (size 1.35 0.28) (layers C1F F.Paste F.Mask)
      (net 221 VCC))
    (pad 20 smd oval (at 2.675 0.25 270) (size 1.35 0.28) (layers C1F F.Paste F.Mask)
      (net 327 "Net-(U4-Pad20)"))
    (pad 21 smd oval (at 2.675 -0.25 270) (size 1.35 0.28) (layers C1F F.Paste F.Mask)
      (net 328 "Net-(U4-Pad21)"))
    (pad 22 smd oval (at 2.675 -0.75 270) (size 1.35 0.28) (layers C1F F.Paste F.Mask)
      (net 220 VAA))
    (pad 23 smd oval (at 2.675 -1.25 270) (size 1.35 0.28) (layers C1F F.Paste F.Mask)
      (net 299 "Net-(L1-Pad1)"))
    (pad 24 smd oval (at 2.675 -1.75 270) (size 1.35 0.28) (layers C1F F.Paste F.Mask)
      (net 298 "Net-(L1-Pad2)"))
    (pad 25 smd oval (at 1.75 -2.675) (size 1.35 0.28) (layers C1F F.Paste F.Mask)
      (net 308 "Net-(P19-Pad1)"))
    (pad 26 smd oval (at 1.25 -2.675) (size 1.35 0.28) (layers C1F F.Paste F.Mask)
      (net 305 "Net-(P6-Pad1)"))
    (pad 27 smd oval (at 0.75 -2.675) (size 1.35 0.28) (layers C1F F.Paste F.Mask)
      (net 300 "Net-(L2-Pad1)"))
    (pad 28 smd oval (at 0.25 -2.675) (size 1.35 0.28) (layers C1F F.Paste F.Mask)
      (net 301 "Net-(L3-Pad1)"))
    (pad 29 smd oval (at -0.25 -2.675) (size 1.35 0.28) (layers C1F F.Paste F.Mask)
      (net 198 MIXER_RESETX))
    (pad 30 smd oval (at -0.75 -2.675) (size 1.35 0.28) (layers C1F F.Paste F.Mask)
      (net 197 MIXER_ENX))
    (pad 31 smd oval (at -1.25 -2.675) (size 1.35 0.28) (layers C1F F.Paste F.Mask)
      (net 199 MIXER_SCLK))
    (pad 32 smd oval (at -1.75 -2.675) (size 1.35 0.28) (layers C1F F.Paste F.Mask)
      (net 200 MIXER_SDATA))
  )
  (module hackrf:GSG-QFN48-6 (layer C1F) (tedit 4F5D8918)
    (at 108.6485 141.8971 90)
    (solder_mask_margin 0.0508)
    (clearance 0.1524)
    (fp_text reference U17 (at 0 0 90) (layer F.SilkS))
    (fp_text value MAX2837 (at 0 0 90) (layer F.SilkS) hide)
    (pad 1 smd oval (at -3 -2.2 90) (size 0.87 0.245) (layers C1F F.Paste F.Mask)
      (net 220 VAA))
    (pad 2 smd oval (at -3 -1.8 90) (size 0.87 0.245) (layers C1F F.Paste F.Mask)
      (net 193 GND))
    (pad 3 smd oval (at -3 -1.4 90) (size 0.87 0.245) (layers C1F F.Paste F.Mask)
      (net 334 "Net-(U17-Pad3)"))
    (pad 4 smd oval (at -3 -1 90) (size 0.87 0.245) (layers C1F F.Paste F.Mask)
      (net 273 "Net-(C99-Pad1)"))
    (pad 5 smd oval (at -3 -0.6 90) (size 0.87 0.245) (layers C1F F.Paste F.Mask)
      (net 275 "Net-(C102-Pad1)"))
    (pad 6 smd oval (at -3 -0.2 90) (size 0.87 0.245) (layers C1F F.Paste F.Mask)
      (net 335 "Net-(U17-Pad6)"))
    (pad 7 smd oval (at -3 0.2 90) (size 0.87 0.245) (layers C1F F.Paste F.Mask)
      (net 220 VAA))
    (pad 8 smd oval (at -3 0.6 90) (size 0.87 0.245) (layers C1F F.Paste F.Mask)
      (net 336 "Net-(U17-Pad8)"))
    (pad 9 smd oval (at -3 1 90) (size 0.87 0.245) (layers C1F F.Paste F.Mask)
      (net 337 "Net-(U17-Pad9)"))
    (pad 10 smd oval (at -3 1.4 90) (size 0.87 0.245) (layers C1F F.Paste F.Mask)
      (net 277 "Net-(C104-Pad1)"))
    (pad 11 smd oval (at -3 1.8 90) (size 0.87 0.245) (layers C1F F.Paste F.Mask)
      (net 281 "Net-(C111-Pad1)"))
    (pad 12 smd oval (at -3 2.2 90) (size 0.87 0.245) (layers C1F F.Paste F.Mask)
      (net 338 "Net-(U17-Pad12)"))
    (pad 13 smd oval (at -2.2 3 180) (size 0.87 0.245) (layers C1F F.Paste F.Mask)
      (net 220 VAA))
    (pad 14 smd oval (at -1.8 3 180) (size 0.87 0.245) (layers C1F F.Paste F.Mask)
      (net 339 "Net-(U17-Pad14)"))
    (pad 15 smd oval (at -1.4 3 180) (size 0.87 0.245) (layers C1F F.Paste F.Mask)
      (net 214 SSP1_SCK))
    (pad 16 smd oval (at -1 3 180) (size 0.87 0.245) (layers C1F F.Paste F.Mask)
      (net 36 /baseband/XCVR_CLKOUT))
    (pad 17 smd oval (at -0.6 3 180) (size 0.87 0.245) (layers C1F F.Paste F.Mask)
      (net 37 /baseband/XTAL2))
    (pad 18 smd oval (at -0.2 3 180) (size 0.87 0.245) (layers C1F F.Paste F.Mask)
      (net 340 "Net-(U17-Pad18)"))
    (pad 19 smd oval (at 0.2 3 180) (size 0.87 0.245) (layers C1F F.Paste F.Mask)
      (net 220 VAA))
    (pad 20 smd oval (at 0.6 3 180) (size 0.87 0.245) (layers C1F F.Paste F.Mask)
      (net 221 VCC))
    (pad 21 smd oval (at 1 3 180) (size 0.87 0.245) (layers C1F F.Paste F.Mask)
      (net 220 VAA))
    (pad 22 smd oval (at 1.4 3 180) (size 0.87 0.245) (layers C1F F.Paste F.Mask)
      (net 193 GND))
    (pad 23 smd oval (at 1.8 3 180) (size 0.87 0.245) (layers C1F F.Paste F.Mask)
      (net 12 /baseband/CPOUT+))
    (pad 24 smd oval (at 2.2 3 180) (size 0.87 0.245) (layers C1F F.Paste F.Mask)
      (net 13 /baseband/CPOUT-))
    (pad 25 smd oval (at 3 2.2 90) (size 0.87 0.245) (layers C1F F.Paste F.Mask)
      (net 222 XCVR_EN))
    (pad 26 smd oval (at 3 1.8 90) (size 0.87 0.245) (layers C1F F.Paste F.Mask)
      (net 193 GND))
    (pad 27 smd oval (at 3 1.4 90) (size 0.87 0.245) (layers C1F F.Paste F.Mask)
      (net 279 "Net-(C106-Pad1)"))
    (pad 28 smd oval (at 3 1 90) (size 0.87 0.245) (layers C1F F.Paste F.Mask)
      (net 220 VAA))
    (pad 29 smd oval (at 3 0.6 90) (size 0.87 0.245) (layers C1F F.Paste F.Mask)
      (net 212 SSP1_MISO))
    (pad 30 smd oval (at 3 0.2 90) (size 0.87 0.245) (layers C1F F.Paste F.Mask)
      (net 172 CS_XCVR))
    (pad 31 smd oval (at 3 -0.2 90) (size 0.87 0.245) (layers C1F F.Paste F.Mask)
      (net 213 SSP1_MOSI))
    (pad 32 smd oval (at 3 -0.6 90) (size 0.87 0.245) (layers C1F F.Paste F.Mask)
      (net 203 RSSI))
    (pad 33 smd oval (at 3 -1 90) (size 0.87 0.245) (layers C1F F.Paste F.Mask)
      (net 341 "Net-(U17-Pad33)"))
    (pad 34 smd oval (at 3 -1.4 90) (size 0.87 0.245) (layers C1F F.Paste F.Mask)
      (net 342 "Net-(U17-Pad34)"))
    (pad 35 smd oval (at 3 -1.8 90) (size 0.87 0.245) (layers C1F F.Paste F.Mask)
      (net 29 /baseband/RXBBQ-))
    (pad 36 smd oval (at 3 -2.2 90) (size 0.87 0.245) (layers C1F F.Paste F.Mask)
      (net 28 /baseband/RXBBQ+))
    (pad 37 smd oval (at 2.2 -3 180) (size 0.87 0.245) (layers C1F F.Paste F.Mask)
      (net 27 /baseband/RXBBI-))
    (pad 38 smd oval (at 1.8 -3 180) (size 0.87 0.245) (layers C1F F.Paste F.Mask)
      (net 26 /baseband/RXBBI+))
    (pad 39 smd oval (at 1.4 -3 180) (size 0.87 0.245) (layers C1F F.Paste F.Mask)
      (net 220 VAA))
    (pad 40 smd oval (at 1 -3 180) (size 0.87 0.245) (layers C1F F.Paste F.Mask)
      (net 343 "Net-(U17-Pad40)"))
    (pad 41 smd oval (at 0.6 -3 180) (size 0.87 0.245) (layers C1F F.Paste F.Mask)
      (net 220 VAA))
    (pad 42 smd oval (at 0.2 -3 180) (size 0.87 0.245) (layers C1F F.Paste F.Mask)
      (net 31 /baseband/TXBBI-))
    (pad 43 smd oval (at -0.2 -3 180) (size 0.87 0.245) (layers C1F F.Paste F.Mask)
      (net 30 /baseband/TXBBI+))
    (pad 44 smd oval (at -0.6 -3 180) (size 0.87 0.245) (layers C1F F.Paste F.Mask)
      (net 32 /baseband/TXBBQ+))
    (pad 45 smd oval (at -1 -3 180) (size 0.87 0.245) (layers C1F F.Paste F.Mask)
      (net 33 /baseband/TXBBQ-))
    (pad 46 smd oval (at -1.4 -3 180) (size 0.87 0.245) (layers C1F F.Paste F.Mask)
      (net 220 VAA))
    (pad 47 smd oval (at -1.8 -3 180) (size 0.87 0.245) (layers C1F F.Paste F.Mask)
      (net 216 TXENABLE))
    (pad 48 smd oval (at -2.2 -3 180) (size 0.87 0.245) (layers C1F F.Paste F.Mask)
      (net 205 RXENABLE))
    (pad 0 smd rect (at 0 0 90) (size 4.525 4.525) (layers C1F F.Mask)
      (net 193 GND) (solder_mask_margin -0.1016))
    (pad 0 thru_hole circle (at 0 0 90) (size 0.635 0.635) (drill 0.381) (layers *.Cu B.Mask)
      (net 193 GND))
    (pad 0 thru_hole circle (at -1.5 0 90) (size 0.635 0.635) (drill 0.381) (layers *.Cu B.Mask)
      (net 193 GND))
    (pad 0 thru_hole circle (at -1.5 -1.5 90) (size 0.635 0.635) (drill 0.381) (layers *.Cu B.Mask)
      (net 193 GND))
    (pad 0 thru_hole circle (at 0 -1.5 90) (size 0.635 0.635) (drill 0.381) (layers *.Cu B.Mask)
      (net 193 GND))
    (pad 0 thru_hole circle (at 1.5 -1.5 90) (size 0.635 0.635) (drill 0.381) (layers *.Cu B.Mask)
      (net 193 GND))
    (pad 0 thru_hole circle (at 1.5 0 90) (size 0.635 0.635) (drill 0.381) (layers *.Cu B.Mask)
      (net 193 GND))
    (pad 0 thru_hole circle (at 1.5 1.5 90) (size 0.635 0.635) (drill 0.381) (layers *.Cu B.Mask)
      (net 193 GND))
    (pad 0 thru_hole circle (at 0 1.5 90) (size 0.635 0.635) (drill 0.381) (layers *.Cu B.Mask)
      (net 193 GND))
    (pad 0 thru_hole circle (at -1.5 1.5 90) (size 0.635 0.635) (drill 0.381) (layers *.Cu B.Mask)
      (net 193 GND))
    (pad 0 smd rect (at -1.5 -1.5 90) (size 1.5 1.5) (layers C1F F.Paste)
      (net 193 GND))
    (pad 0 smd rect (at 0 -1.5 90) (size 1.5 1.5) (layers C1F F.Paste)
      (net 193 GND))
    (pad 0 smd rect (at 1.5 -1.5 90) (size 1.5 1.5) (layers C1F F.Paste)
      (net 193 GND))
    (pad 0 smd rect (at -1.5 0 90) (size 1.5 1.5) (layers C1F F.Paste)
      (net 193 GND))
    (pad 0 smd rect (at 0 0 90) (size 1.5 1.5) (layers C1F F.Paste)
      (net 193 GND))
    (pad 0 smd rect (at 1.5 0 90) (size 1.5 1.5) (layers C1F F.Paste)
      (net 193 GND))
    (pad 0 smd rect (at -1.5 1.5 90) (size 1.5 1.5) (layers C1F F.Paste)
      (net 193 GND))
    (pad 0 smd rect (at 0 1.5 90) (size 1.5 1.5) (layers C1F F.Paste)
      (net 193 GND))
    (pad 0 smd rect (at 1.5 1.5 90) (size 1.5 1.5) (layers C1F F.Paste)
      (net 193 GND))
  )
  (module hackrf:GSG-QFN48-7 (layer C1F) (tedit 509981FA)
    (at 102.8954 112.4618 90)
    (solder_mask_margin 0.07112)
    (clearance 0.1397)
    (fp_text reference U18 (at 0 0 90) (layer F.SilkS))
    (fp_text value MAX5864 (at 0 0 90) (layer F.SilkS) hide)
    (pad 1 smd oval (at -3.45 -2.75 90) (size 0.9 0.28) (layers C1F F.Paste F.Mask)
      (net 25 /baseband/REFP))
    (pad 2 smd oval (at -3.45 -2.25 90) (size 0.9 0.28) (layers C1F F.Paste F.Mask)
      (net 220 VAA))
    (pad 3 smd oval (at -3.45 -1.75 90) (size 0.9 0.28) (layers C1F F.Paste F.Mask)
      (net 14 /baseband/IA+))
    (pad 4 smd oval (at -3.45 -1.25 90) (size 0.9 0.28) (layers C1F F.Paste F.Mask)
      (net 15 /baseband/IA-))
    (pad 5 smd oval (at -3.45 -0.75 90) (size 0.9 0.28) (layers C1F F.Paste F.Mask)
      (net 193 GND))
    (pad 6 smd oval (at -3.45 -0.25 90) (size 0.9 0.28) (layers C1F F.Paste F.Mask)
      (net 191 GCK1))
    (pad 7 smd oval (at -3.45 0.25 90) (size 0.9 0.28) (layers C1F F.Paste F.Mask)
      (net 193 GND))
    (pad 8 smd oval (at -3.45 0.75 90) (size 0.9 0.28) (layers C1F F.Paste F.Mask)
      (net 220 VAA))
    (pad 9 smd oval (at -3.45 1.25 90) (size 0.9 0.28) (layers C1F F.Paste F.Mask)
      (net 21 /baseband/QA-))
    (pad 10 smd oval (at -3.45 1.75 90) (size 0.9 0.28) (layers C1F F.Paste F.Mask)
      (net 20 /baseband/QA+))
    (pad 11 smd oval (at -3.45 2.25 90) (size 0.9 0.28) (layers C1F F.Paste F.Mask)
      (net 220 VAA))
    (pad 12 smd oval (at -3.45 2.75 90) (size 0.9 0.28) (layers C1F F.Paste F.Mask)
      (net 193 GND))
    (pad 13 smd oval (at -2.75 3.45 180) (size 0.9 0.28) (layers C1F F.Paste F.Mask)
      (net 173 DA0))
    (pad 14 smd oval (at -2.25 3.45 180) (size 0.9 0.28) (layers C1F F.Paste F.Mask)
      (net 174 DA1))
    (pad 15 smd oval (at -1.75 3.45 180) (size 0.9 0.28) (layers C1F F.Paste F.Mask)
      (net 175 DA2))
    (pad 16 smd oval (at -1.25 3.45 180) (size 0.9 0.28) (layers C1F F.Paste F.Mask)
      (net 176 DA3))
    (pad 17 smd oval (at -0.75 3.45 180) (size 0.9 0.28) (layers C1F F.Paste F.Mask)
      (net 193 GND))
    (pad 18 smd oval (at -0.25 3.45 180) (size 0.9 0.28) (layers C1F F.Paste F.Mask)
      (net 221 VCC))
    (pad 19 smd oval (at 0.25 3.45 180) (size 0.9 0.28) (layers C1F F.Paste F.Mask)
      (net 177 DA4))
    (pad 20 smd oval (at 0.75 3.45 180) (size 0.9 0.28) (layers C1F F.Paste F.Mask)
      (net 178 DA5))
    (pad 21 smd oval (at 1.25 3.45 180) (size 0.9 0.28) (layers C1F F.Paste F.Mask)
      (net 179 DA6))
    (pad 22 smd oval (at 1.75 3.45 180) (size 0.9 0.28) (layers C1F F.Paste F.Mask)
      (net 180 DA7))
    (pad 23 smd oval (at 2.25 3.45 180) (size 0.9 0.28) (layers C1F F.Paste F.Mask)
      (net 181 DD0))
    (pad 24 smd oval (at 2.75 3.45 180) (size 0.9 0.28) (layers C1F F.Paste F.Mask)
      (net 182 DD1))
    (pad 25 smd oval (at 3.45 2.75 90) (size 0.9 0.28) (layers C1F F.Paste F.Mask)
      (net 183 DD2))
    (pad 26 smd oval (at 3.45 2.25 90) (size 0.9 0.28) (layers C1F F.Paste F.Mask)
      (net 184 DD3))
    (pad 27 smd oval (at 3.45 1.75 90) (size 0.9 0.28) (layers C1F F.Paste F.Mask)
      (net 185 DD4))
    (pad 28 smd oval (at 3.45 1.25 90) (size 0.9 0.28) (layers C1F F.Paste F.Mask)
      (net 186 DD5))
    (pad 29 smd oval (at 3.45 0.75 90) (size 0.9 0.28) (layers C1F F.Paste F.Mask)
      (net 187 DD6))
    (pad 30 smd oval (at 3.45 0.25 90) (size 0.9 0.28) (layers C1F F.Paste F.Mask)
      (net 188 DD7))
    (pad 31 smd oval (at 3.45 -0.25 90) (size 0.9 0.28) (layers C1F F.Paste F.Mask)
      (net 189 DD8))
    (pad 32 smd oval (at 3.45 -0.75 90) (size 0.9 0.28) (layers C1F F.Paste F.Mask)
      (net 190 DD9))
    (pad 33 smd oval (at 3.45 -1.25 90) (size 0.9 0.28) (layers C1F F.Paste F.Mask)
      (net 220 VAA))
    (pad 34 smd oval (at 3.45 -1.75 90) (size 0.9 0.28) (layers C1F F.Paste F.Mask)
      (net 213 SSP1_MOSI))
    (pad 35 smd oval (at 3.45 -2.25 90) (size 0.9 0.28) (layers C1F F.Paste F.Mask)
      (net 214 SSP1_SCK))
    (pad 36 smd oval (at 3.45 -2.75 90) (size 0.9 0.28) (layers C1F F.Paste F.Mask)
      (net 171 CS_AD))
    (pad 37 smd oval (at 2.75 -3.45 180) (size 0.9 0.28) (layers C1F F.Paste F.Mask)
      (net 193 GND))
    (pad 38 smd oval (at 2.25 -3.45 180) (size 0.9 0.28) (layers C1F F.Paste F.Mask)
      (net 344 "Net-(U18-Pad38)"))
    (pad 39 smd oval (at 1.75 -3.45 180) (size 0.9 0.28) (layers C1F F.Paste F.Mask)
      (net 220 VAA))
    (pad 40 smd oval (at 1.25 -3.45 180) (size 0.9 0.28) (layers C1F F.Paste F.Mask)
      (net 22 /baseband/QD+))
    (pad 41 smd oval (at 0.75 -3.45 180) (size 0.9 0.28) (layers C1F F.Paste F.Mask)
      (net 23 /baseband/QD-))
    (pad 42 smd oval (at 0.25 -3.45 180) (size 0.9 0.28) (layers C1F F.Paste F.Mask)
      (net 193 GND))
    (pad 43 smd oval (at -0.25 -3.45 180) (size 0.9 0.28) (layers C1F F.Paste F.Mask)
      (net 220 VAA))
    (pad 44 smd oval (at -0.75 -3.45 180) (size 0.9 0.28) (layers C1F F.Paste F.Mask)
      (net 17 /baseband/ID-))
    (pad 45 smd oval (at -1.25 -3.45 180) (size 0.9 0.28) (layers C1F F.Paste F.Mask)
      (net 16 /baseband/ID+))
    (pad 46 smd oval (at -1.75 -3.45 180) (size 0.9 0.28) (layers C1F F.Paste F.Mask)
      (net 220 VAA))
    (pad 47 smd oval (at -2.25 -3.45 180) (size 0.9 0.28) (layers C1F F.Paste F.Mask)
      (net 11 /baseband/COM))
    (pad 48 smd oval (at -2.75 -3.45 180) (size 0.9 0.28) (layers C1F F.Paste F.Mask)
      (net 24 /baseband/REFN))
    (pad 0 smd rect (at 0 0 90) (size 5.3 5.3) (layers C1F F.Mask)
      (net 193 GND) (solder_mask_margin -0.1016))
    (pad 0 thru_hole circle (at 0 0 90) (size 0.635 0.635) (drill 0.381) (layers *.Cu B.Mask)
      (net 193 GND))
    (pad 0 thru_hole circle (at -1.65 0 90) (size 0.635 0.635) (drill 0.381) (layers *.Cu B.Mask)
      (net 193 GND))
    (pad 0 thru_hole circle (at -1.65 -1.65 90) (size 0.635 0.635) (drill 0.381) (layers *.Cu B.Mask)
      (net 193 GND))
    (pad 0 thru_hole circle (at 0 -1.65 90) (size 0.635 0.635) (drill 0.381) (layers *.Cu B.Mask)
      (net 193 GND))
    (pad 0 thru_hole circle (at 1.65 -1.65 90) (size 0.635 0.635) (drill 0.381) (layers *.Cu B.Mask)
      (net 193 GND))
    (pad 0 thru_hole circle (at 1.65 0 90) (size 0.635 0.635) (drill 0.381) (layers *.Cu B.Mask)
      (net 193 GND))
    (pad 0 thru_hole circle (at 1.65 1.65 90) (size 0.635 0.635) (drill 0.381) (layers *.Cu B.Mask)
      (net 193 GND))
    (pad 0 thru_hole circle (at 0 1.65 90) (size 0.635 0.635) (drill 0.381) (layers *.Cu B.Mask)
      (net 193 GND))
    (pad 0 thru_hole circle (at -1.65 1.65 90) (size 0.635 0.635) (drill 0.381) (layers *.Cu B.Mask)
      (net 193 GND))
    (pad 0 smd rect (at -1.65 -1.65 90) (size 1.65 1.65) (layers C1F F.Paste)
      (net 193 GND))
    (pad 0 smd rect (at 0 -1.65 90) (size 1.65 1.65) (layers C1F F.Paste)
      (net 193 GND))
    (pad 0 smd rect (at 1.65 -1.65 90) (size 1.65 1.65) (layers C1F F.Paste)
      (net 193 GND))
    (pad 0 smd rect (at -1.65 0 90) (size 1.65 1.65) (layers C1F F.Paste)
      (net 193 GND))
    (pad 0 smd rect (at 0 0 90) (size 1.65 1.65) (layers C1F F.Paste)
      (net 193 GND))
    (pad 0 smd rect (at 1.65 0 90) (size 1.65 1.65) (layers C1F F.Paste)
      (net 193 GND))
    (pad 0 smd rect (at -1.65 1.65 90) (size 1.65 1.65) (layers C1F F.Paste)
      (net 193 GND))
    (pad 0 smd rect (at 0 1.65 90) (size 1.65 1.65) (layers C1F F.Paste)
      (net 193 GND))
    (pad 0 smd rect (at 1.65 1.65 90) (size 1.65 1.65) (layers C1F F.Paste)
      (net 193 GND))
  )
  (gr_line (start 180 126.825) (end 180 138.74) (angle 90) (layer Edge.Cuts) (width 0.381))
  (gr_line (start 180 122.075) (end 180 125.925) (angle 90) (layer Edge.Cuts) (width 0.381))
  (gr_line (start 180 104) (end 180 121.175) (angle 90) (layer Edge.Cuts) (width 0.381))
  (gr_arc (start 178.85 126.375) (end 178.85 126.825) (angle 180) (layer Edge.Cuts) (width 0.381))
  (gr_line (start 180 126.825) (end 178.85 126.825) (angle 90) (layer Edge.Cuts) (width 0.381))
  (gr_line (start 180 125.925) (end 178.85 125.925) (angle 90) (layer Edge.Cuts) (width 0.381))
  (gr_arc (start 178.85 121.625) (end 178.85 122.075) (angle 180) (layer Edge.Cuts) (width 0.381))
  (gr_line (start 178.85 122.075) (end 180 122.075) (angle 90) (layer Edge.Cuts) (width 0.381))
  (gr_line (start 180 121.175) (end 178.85 121.175) (angle 90) (layer Edge.Cuts) (width 0.381))
  (gr_line (start 60.58 155.94) (end 60.44 155.8) (angle 90) (layer Edge.Cuts) (width 0.381))
  (gr_line (start 60.44 166.2) (end 60.58 166.06) (angle 90) (layer Edge.Cuts) (width 0.381))
  (gr_arc (start 61.5 167.26) (end 60 167.26) (angle 45) (layer Edge.Cuts) (width 0.381))
  (gr_arc (start 59.52 165) (end 61.02 165) (angle 45) (layer Edge.Cuts) (width 0.381))
  (gr_arc (start 61.5 154.74) (end 60 154.74) (angle -45) (layer Edge.Cuts) (width 0.381))
  (gr_arc (start 59.52 157) (end 61.02 157) (angle -45) (layer Edge.Cuts) (width 0.381))
  (gr_line (start 180 171) (end 180 169.26) (angle 90) (layer Edge.Cuts) (width 0.381))
  (gr_line (start 179.42 168.06) (end 179.56 168.2) (angle 90) (layer Edge.Cuts) (width 0.381))
  (gr_arc (start 178.5 169.26) (end 180 169.26) (angle -45) (layer Edge.Cuts) (width 0.381))
  (gr_arc (start 180.48 167) (end 178.98 167) (angle -45) (layer Edge.Cuts) (width 0.381))
  (gr_line (start 179.42 139.94) (end 179.56 139.8) (angle 90) (layer Edge.Cuts) (width 0.381))
  (gr_arc (start 178.5 138.74) (end 180 138.74) (angle 45) (layer Edge.Cuts) (width 0.381))
  (gr_arc (start 180.48 141) (end 178.98 141) (angle 45) (layer Edge.Cuts) (width 0.381))
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  (gr_line (start 178.98 141) (end 178.98 167) (angle 90) (layer Edge.Cuts) (width 0.381))
  (gr_text USB (at 249.5 84) (layer Cmts.User))
  (gr_text CLKOUT (at 228.5 84) (layer Cmts.User))
  (gr_text CLKIN (at 210.5 84) (layer Cmts.User))
  (gr_text ANTENNA (at 259.5 48) (layer Cmts.User))
  (gr_text TX (at 247.338 48) (layer Cmts.User))
  (gr_text RX (at 242.766 48) (layer Cmts.User))
  (gr_text LED1 (at 238.194 48) (layer Cmts.User))
  (gr_text RF (at 233.622 48) (layer Cmts.User))
  (gr_text 1V8 (at 229.05 48) (layer Cmts.User))
  (gr_text 3V3 (at 216.4 48) (layer Cmts.User))
  (gr_text DFU (at 222.9 48) (layer Cmts.User))
  (gr_text RESET (at 209.9 48) (layer Cmts.User))
  (gr_text "rear end plate" (at 236 91) (layer Cmts.User))
  (gr_text "front end plate" (at 236 55) (layer Cmts.User))
  (gr_text "end plate templates for optional Hammond 1455J1201 enclosure" (at 236 19) (layer Cmts.User))
  (gr_text 4 (at 167.7 101.3) (layer C4B))
  (gr_text 3 (at 166.8 101.3) (layer C3))
  (gr_text 2 (at 165.8 101.3) (layer C2))
  (gr_text 1 (at 164.9 101.3) (layer C1F))
  (gr_text "19 May 2014" (at 78.796 113.278 90) (layer F.SilkS))
  (gr_text P9 (at 98.1 125.47) (layer F.SilkS))
  (gr_text "J10\nGND" (at 116.9214 129.407) (layer F.SilkS))
  (gr_text "P80 SHIELD" (at 175.8494 131.8962 90) (layer F.SilkS))
  (gr_text P5 (at 89.21 110.3062) (layer F.SilkS))
  (gr_text RESET (at 66.7 111.4 90) (layer F.SilkS))
  (gr_text DFU (at 66.7 124.4 90) (layer F.SilkS))
  (gr_text TM (at 70.6172 113.7606 90) (layer F.SilkS))
  (gr_text RF (at 65.08 135.63 90) (layer F.SilkS))
  (gr_text "HackRF One" (at 73.97 117.596 90) (layer F.SilkS))
  (gr_line (start 176 100) (end 64 100) (angle 90) (layer Edge.Cuts) (width 0.381))
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  (gr_arc (start 64 104) (end 60 104) (angle 90) (layer Edge.Cuts) (width 0.381))
  (gr_text 1V8 (at 65.08 130.804 90) (layer F.SilkS))
  (gr_text 3V3 (at 65.08 117.85 90) (layer F.SilkS))
  (gr_text USB (at 65.08 139.948 90) (layer F.SilkS))
  (gr_text RX (at 65.08 144.52 90) (layer F.SilkS))
  (gr_text TX (at 65.08 149.092 90) (layer F.SilkS))
  (gr_text "P1\n1V8" (at 141.7 111.6) (layer F.SilkS))
  (gr_text "P8\nVCC" (at 154.2594 110.992) (layer F.SilkS))
  (gr_text P20 (at 167.7976 144.5454 90) (layer F.SilkS))
  (gr_text P22 (at 152.7608 168.7516) (layer F.SilkS))
  (gr_text "P25  LPC_ISP" (at 144.1756 160.8268) (layer F.SilkS))
  (gr_text P28 (at 127.2084 144.5962 90) (layer F.SilkS))
  (gr_text "P26\nLPC_JTAG" (at 147.7062 118.1548 90) (layer F.SilkS))
  (gr_text "P3\nGND" (at 142.4738 117.4182) (layer F.SilkS))
  (gr_text "P30  BANK2_AUX" (at 148.8238 102.4068) (layer F.SilkS))
  (gr_text "P36\nVAA" (at 80.5994 125.7494) (layer F.SilkS))
  (gr_text "P2\nCLKOUT" (at 176.2558 137.789 90) (layer F.SilkS))
  (gr_text P29 (at 130.739 130.3722) (layer F.SilkS))
  (gr_text "P16\nCLKIN" (at 176.332 156.2802 90) (layer F.SilkS))
  (gr_text "P4\nANTENNA" (at 62.3622 153.3846 90) (layer F.SilkS))
  (gr_text http://greatscottgadgets.com/hackrf/ (at 152.8878 171.2154) (layer F.SilkS))
  (zone (net 0) (net_name "") (layer F.SilkS) (hatch edge 0.508)
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    (min_thickness 0.254)
    (fill (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
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      )
    )
  )
  (zone (net 193) (net_name GND) (layer C2) (hatch edge 0.508)
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      )
    )
  )
  (zone (net 220) (net_name VAA) (layer C3) (hatch edge 0.508)
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      )
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